Information
711 Pyeonghwa-ro, Tanhyeon-myeon, Paju-si, Gyeonggi-do, South Korea
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Overview
- Summary
- Signetics Co., Ltd. is South Korea's first semiconductor assembly and test specialist, commencing semiconductor manufacturing in 1966. The company supplies various semiconductors for electronic components to leading global electronics companies, leveraging its excellent semiconductor packaging and performance inspection technologies. Its capabilities include the timely development and supply of specialized products tailored to customer demands and semiconductor market conditions. The company also possesses the ability to develop products with high reliability, superior thermal, and electrical performance based on product specifications and requirements.Signetics Co., Ltd. is South Korea's first semiconductor assembly and test specialist, commencing semiconductor manufacturing in 1966. The company supplies various semiconductors for electronic components to leading global electronics companies, leveraging its excellent semiconductor packaging and performance inspection technologies. Its capabilities include the timely development and supply of specialized products tailored to customer demands and semiconductor market conditions. The company also possesses the ability to develop products with high reliability, superior thermal, and electrical performance based on product specifications and requirements.
- Key Products/Technologies
- **Main Product Lines**: Diverse semiconductor packaging solutions, including laminate packages, lead frame packages, and flip-chip packages.**Main Product Lines**: Diverse semiconductor packaging solutions, including laminate packages, lead frame packages, and flip-chip packages.
- **Laminate Packages**: A comprehensive portfolio encompassing Fine Pitch Ball Grid Array (FBGA), Board On Chip (BOC), Stacked Die Chip Scale Package (CSP), Plastic BGA (PBGA), Heat Spreader PBGA, Enhanced PBGA, and Fine Pitch Land Grid Array (FLGA).**Laminate Packages**: A comprehensive portfolio encompassing Fine Pitch Ball Grid Array (FBGA), Board On Chip (BOC), Stacked Die Chip Scale Package (CSP), Plastic BGA (PBGA), Heat Spreader PBGA, Enhanced PBGA, and Fine Pitch Land Grid Array (FLGA).
- **Lead Frame Packages**: Provision of various package types such as Metric, Low-Profile and Thin Quad Flat Package (QFP), Thin-Shrink Small Outline Package (TSSOP), Thin Small-Outline Packages (TSOP), and Quad Flat No-Lead (QFN).**Lead Frame Packages**: Provision of various package types such as Metric, Low-Profile and Thin Quad Flat Package (QFP), Thin-Shrink Small Outline Package (TSSOP), Thin Small-Outline Packages (TSOP), and Quad Flat No-Lead (QFN).
- **Flip Chip Packages**: Expertise in Flip Chip BGA (FCBGA) and Flip-Chip Chip Scale Package (FCCSP) technologies.**Flip Chip Packages**: Expertise in Flip Chip BGA (FCBGA) and Flip-Chip Chip Scale Package (FCCSP) technologies.
- **Advanced Packaging Technologies**: Development and application of sophisticated packaging technologies like Flip Chip and System In Package (SiP).**Advanced Packaging Technologies**: Development and application of sophisticated packaging technologies like Flip Chip and System In Package (SiP).
- **Fingerprint Sensor Packaging**: Turnkey solutions for fingerprint sensor assembly and test services, with an assembly capacity of 35,000,000 units per month.**Fingerprint Sensor Packaging**: Turnkey solutions for fingerprint sensor assembly and test services, with an assembly capacity of 35,000,000 units per month.
- **DDR5 Packaging**: Scheduled commencement of mass production for Samsung Electronics' DDR5 memory packaging, demonstrating capabilities in the high-performance memory market.**DDR5 Packaging**: Scheduled commencement of mass production for Samsung Electronics' DDR5 memory packaging, demonstrating capabilities in the high-performance memory market.
- **Technology Development Capabilities**: Overall semiconductor back-end process technology capabilities, including design and simulation, testing, package development, and process development.**Technology Development Capabilities**: Overall semiconductor back-end process technology capabilities, including design and simulation, testing, package development, and process development.
- **Utilization of CAE Solutions**: Adoption of CAE analysis solutions like Ansys for innovative product development and design optimization, reducing time and cost for physical prototype creation.**Utilization of CAE Solutions**: Adoption of CAE analysis solutions like Ansys for innovative product development and design optimization, reducing time and cost for physical prototype creation.
- **Substrate Design and Analysis**: Expertise in designing substrates connecting semiconductor wafers and boards, offering structural, electrical, and thermal analysis and solution support.**Substrate Design and Analysis**: Expertise in designing substrates connecting semiconductor wafers and boards, offering structural, electrical, and thermal analysis and solution support.
- Core Advantages
- **Pioneering History and Experience**: A long-standing presence and accumulated know-how as South Korea's first semiconductor assembly and test specialist since 1966.**Pioneering History and Experience**: A long-standing presence and accumulated know-how as South Korea's first semiconductor assembly and test specialist since 1966.
- **Superior Technology and Product Reliability**: Excellent semiconductor packaging and performance inspection technologies, coupled with the ability to develop products with high reliability and superior thermal and electrical characteristics tailored to customer requirements.**Superior Technology and Product Reliability**: Excellent semiconductor packaging and performance inspection technologies, coupled with the ability to develop products with high reliability and superior thermal and electrical characteristics tailored to customer requirements.
- **Strategic Partnerships and Group Synergy**: Strategic collaborations and co-development with leading global Tier-1 semiconductor companies, and leveraging resources from the Young Poong Group, such as easy access to raw materials from sister company Korea Circuit.**Strategic Partnerships and Group Synergy**: Strategic collaborations and co-development with leading global Tier-1 semiconductor companies, and leveraging resources from the Young Poong Group, such as easy access to raw materials from sister company Korea Circuit.
- **Market-Responsive Technology Development and Diversification**: Timely development and supply of specialized products to meet evolving semiconductor industry and customer demands, internalizing advanced packaging technologies like Flip Chip and SiP, and commercializing fingerprint sensor-related technologies for business diversification.**Market-Responsive Technology Development and Diversification**: Timely development and supply of specialized products to meet evolving semiconductor industry and customer demands, internalizing advanced packaging technologies like Flip Chip and SiP, and commercializing fingerprint sensor-related technologies for business diversification.
- **Efficient Production System**: Implementation of CAE simulations for early problem detection and design refinement, shortening the development process, and securing a stable supply chain and fast delivery through domestic production facilities.**Efficient Production System**: Implementation of CAE simulations for early problem detection and design refinement, shortening the development process, and securing a stable supply chain and fast delivery through domestic production facilities.
- **Global Production Base Expansion**: Planned investment in a new production facility in Vietnam to provide close support to key domestic and international customers and strengthen partnerships.**Global Production Base Expansion**: Planned investment in a new production facility in Vietnam to provide close support to key domestic and international customers and strengthen partnerships.
- Target Industrie
- Communication marketsCommunication markets
- Consumer marketsConsumer markets
- Computing marketsComputing markets
- Mobile devices (cellular phones)Mobile devices (cellular phones)
- AI (Artificial Intelligence) and HBM (High Bandwidth Memory) chip test solutionsAI (Artificial Intelligence) and HBM (High Bandwidth Memory) chip test solutions
- GPU (Graphics Processing Unit) chip test solutionsGPU (Graphics Processing Unit) chip test solutions
- General semiconductor industry (memory and non-memory semiconductors)General semiconductor industry (memory and non-memory semiconductors)
- Major Markets
- South Korea (production base), Vietnam (planned new production base), Greater China region (fingerprint sensor customers)South Korea (production base), Vietnam (planned new production base), Greater China region (fingerprint sensor customers)
- United States (Santa Clara, California sales office for local customer development), North American fabless companiesUnited States (Santa Clara, California sales office for local customer development), North American fabless companies
- Certifications/Patents
- Possession of technical competitiveness in semiconductor packaging and testing.Possession of technical competitiveness in semiconductor packaging and testing.
- Internalization of high-value-added technologies such as Flip Chip and System In Package (SiP).Internalization of high-value-added technologies such as Flip Chip and System In Package (SiP).
- Capability for commercialization of fingerprint sensor-related technologies.Capability for commercialization of fingerprint sensor-related technologies.
- The official website includes pages for 'Quality Certification' and 'Patents', but specific patent numbers or certification names are not explicitly detailed.The official website includes pages for 'Quality Certification' and 'Patents', but specific patent numbers or certification names are not explicitly detailed.
Introduction
Location
711 Pyeonghwa-ro, Tanhyeon-myeon, Paju-si, Gyeonggi-do, South Korea
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