NTS, The Republic of Korea - Komachine Supplier Profile and Product List

- A specialized company in ultra-high-precision surface grinding and polishing equipment essential for core processes in the semiconductor and LED industries. Its capabilities include manufacturing equipment for the entire process from wafers to semiconductor packages. The company pursues growth through continuous innovation and technological development. Its focus is on developing cutting-edge technologies and manufacturing equipment to maximize customer satisfaction. It provides processing solutions for various wafer and component materials. Contribution to increased production efficiency through automation technology. Efforts to secure world-leading technology and quality. Possession of a specialized research and development process for high-value-added equipment production.A specialized company in ultra-high-precision surface grinding and polishing equipment essential for core processes in the semiconductor and LED industries. Its capabilities include manufacturing equipment for the entire process from wafers to semiconductor packages. The company pursues growth through continuous innovation and technological development. Its focus is on developing cutting-edge technologies and manufacturing equipment to maximize customer satisfaction. It provides processing solutions for various wafer and component materials. Contribution to increased production efficiency through automation technology. Efforts to secure world-leading technology and quality. Possession of a specialized research and development process for high-value-added equipment production.
- Development and manufacturing capabilities for double-sided grinding, double-sided lapping, double-sided polishing, double-sided CMP, wax mounting, single-sided DMP, single-sided CMP, semi-auto bonding, full-auto bonding, and semi-auto grinding equipment.Development and manufacturing capabilities for double-sided grinding, double-sided lapping, double-sided polishing, double-sided CMP, wax mounting, single-sided DMP, single-sided CMP, semi-auto bonding, full-auto bonding, and semi-auto grinding equipment.
- A diverse product lineup including NSDG Series (grinders), NSDL Series (lappers), NSDD Series (polishers), and NSDC Series (CMP equipment).A diverse product lineup including NSDG Series (grinders), NSDL Series (lappers), NSDD Series (polishers), and NSDC Series (CMP equipment).
- Supply capabilities for consumables such as Diamond Grinding Wheel, Lapping Plate, Slurry, Ceramic Block, Condition Ring, Facing Bite, Wax, and Dressing Stone.Supply capabilities for consumables such as Diamond Grinding Wheel, Lapping Plate, Slurry, Ceramic Block, Condition Ring, Facing Bite, Wax, and Dressing Stone.
- Possession of Innovative Wafer Thinning System (IWTS) and Innovative Wafer Polishing System (IWPS) technologies.Possession of Innovative Wafer Thinning System (IWTS) and Innovative Wafer Polishing System (IWPS) technologies.
- Operation of a customized professional research and development process including mechanical design, manufacturing, software, data processing, and process planning.Operation of a customized professional research and development process including mechanical design, manufacturing, software, data processing, and process planning.
- Provision of nano-technology-based precision processing solutions through ultra-high-precision surface grinding and polishing technology.Provision of nano-technology-based precision processing solutions through ultra-high-precision surface grinding and polishing technology.
- High-speed processing technology for various wafers (Sapphire, GaAs, Si, etc.) using diamond wheels.High-speed processing technology for various wafers (Sapphire, GaAs, Si, etc.) using diamond wheels.
- High-speed/high-pressure processing technology with a robust, integrated mainframe and large cross-roller bearing structural spindle.High-speed/high-pressure processing technology with a robust, integrated mainframe and large cross-roller bearing structural spindle.
- Securing a high market share as a leading manufacturer of precision surface grinding and polishing equipment for semiconductors.Securing a high market share as a leading manufacturer of precision surface grinding and polishing equipment for semiconductors.
- Ability to supply customized equipment and provide process know-how tailored to various customer products and working environments.Ability to supply customized equipment and provide process know-how tailored to various customer products and working environments.
- Possession of a verified technical team dedicated to equipment installation and customer support for decades.Possession of a verified technical team dedicated to equipment installation and customer support for decades.
- Proactive response system to global customer technical requirements through manufacturing plants and service branches in Korea and China.Proactive response system to global customer technical requirements through manufacturing plants and service branches in Korea and China.
- Manufacturing capabilities for ultra-high-precision surface processing equipment across the entire semiconductor industry, from wafers to packages.Manufacturing capabilities for ultra-high-precision surface processing equipment across the entire semiconductor industry, from wafers to packages.
- Differentiation as the only company to build a full process lineup in the field of LED substrate and chip processing.Differentiation as the only company to build a full process lineup in the field of LED substrate and chip processing.
- Maintenance of leadership in innovative semiconductor equipment through continuous technological development and investment.Maintenance of leadership in innovative semiconductor equipment through continuous technological development and investment.
- Management philosophy centered on originality of technology, innovation of thought, reliability of products, and transparency of operations.Management philosophy centered on originality of technology, innovation of thought, reliability of products, and transparency of operations.
- Semiconductor industry (wafers, semiconductor packages, semiconductor devices, semiconductor circuit design, wafer manufacturing and processing, semiconductor chip assembly and inspection).Semiconductor industry (wafers, semiconductor packages, semiconductor devices, semiconductor circuit design, wafer manufacturing and processing, semiconductor chip assembly and inspection).
- LED industry (LED substrates, chip processing, Micro LEDs, large displays, PCBs for Micro LEDs).LED industry (LED substrates, chip processing, Micro LEDs, large displays, PCBs for Micro LEDs).
- Display industry (grinding and polishing of various display components).Display industry (grinding and polishing of various display components).
- South Korea, ChinaSouth Korea, China
- Possession of an Inno-Biz (Technology Innovation Small and Medium Business) confirmation certificate.Possession of an Inno-Biz (Technology Innovation Small and Medium Business) confirmation certificate.
- Acquisition of a Material, Parts, and Equipment Specialist Company confirmation certificate.Acquisition of a Material, Parts, and Equipment Specialist Company confirmation certificate.
- Possession of a Corporate Research Institute recognition certificate.Possession of a Corporate Research Institute recognition certificate.
- Obtained ISO9001 quality management system and ISO14001 environmental management system certifications.Obtained ISO9001 quality management system and ISO14001 environmental management system certifications.
- Numerous CE certifications held.Numerous CE certifications held.
- Patents related to Sapphire Wafer Back Grinding Device (Patent No. 081002).Patents related to Sapphire Wafer Back Grinding Device (Patent No. 081002).
- Patents related to Substrate Processing Device including Bonding Unit and Polishing Unit (Patent No. 100308).Patents related to Substrate Processing Device including Bonding Unit and Polishing Unit (Patent No. 100308).
- Patents related to Device including Measuring Unit for Real-time Polishing Amount (Patent No. 100507).Patents related to Device including Measuring Unit for Real-time Polishing Amount (Patent No. 100507).
- Patents related to Automatic Demounting Device and Method (Patent No. 130628).Patents related to Automatic Demounting Device and Method (Patent No. 130628).
- Patents related to Single-sided Processing Device (Patent No. 161226).Patents related to Single-sided Processing Device (Patent No. 161226).