Luken Technologies, established in 2007, is a specialized company manufacturing and selling semiconductor and display inspection equipment and components. It holds core product lines of ultra-precision semiconductor inspection components such as MEMS (Micro-Electro-Mechanical System) Fab-based M-POGO Pins, test sockets, and vertical probe cards. The company also supplies equipment and components essential for the final inspection stages of cells and modules in flat panel display manufacturing processes, including LCD and OLED. Luken Technologies is a technology-intensive company focusing on providing solutions critical for advanced memory semiconductor inspection, particularly for HBM (High Bandwidth Memory), and possesses competitive advantages through its integrated unmanned automatic inspection algorithms and AI and deep learning-based vision inspection technologies.LukenTechnologies,establishedin2007,isaspecializedcompanymanufacturingandsellingsemiconductoranddisplayinspectionequipmentandcomponents.Itholdscoreproductlinesofultra-precisionsemiconductorinspectioncomponentssuchasMEMS(Micro-Electro-MechanicalSystem)Fab-basedM-POGOPins,testsockets,andverticalprobecards.Thecompanyalsosuppliesequipmentandcomponentsessentialforthefinalinspectionstagesofcellsandmodulesinflatpaneldisplaymanufacturingprocesses,includingLCDandOLED.LukenTechnologiesisatechnology-intensivecompanyfocusingonprovidingsolutionscriticalforadvancedmemorysemiconductorinspection,particularlyforHBM(HighBandwidthMemory),andpossessescompetitiveadvantagesthroughitsintegratedunmannedautomaticinspectionalgorithmsandAIanddeeplearning-basedvisioninspectiontechnologies.
Key Products/TechnologiesKeyProducts/Technologies
LCD Checker: Equipment for inspecting the appearance and functionality of LCD panels, part of a diverse lineup of display inspection equipment.LCDChecker:EquipmentforinspectingtheappearanceandfunctionalityofLCDpanels,partofadiverselineupofdisplayinspectionequipment.
PCB VISION Checker: Equipment for visually inspecting defects on PCBs.PCBVISIONChecker:EquipmentforvisuallyinspectingdefectsonPCBs.
Semiconductor Checker: Equipment for inspecting the electrical characteristics of semiconductor chips, utilizing ultra-precision semiconductor inspection components like M-POGO Pins, test sockets, and vertical probe cards. Focuses on providing optimized solutions for high-performance semiconductor testing, including HBM.SemiconductorChecker:Equipmentforinspectingtheelectricalcharacteristicsofsemiconductorchips,utilizingultra-precisionsemiconductorinspectioncomponentslikeM-POGOPins,testsockets,andverticalprobecards.Focusesonprovidingoptimizedsolutionsforhigh-performancesemiconductortesting,includingHBM.
LED Checker: Equipment for inspecting the lighting and functionality of LED products.LEDChecker:EquipmentforinspectingthelightingandfunctionalityofLEDproducts.
Scriber: Equipment for cutting display panels.Scriber:Equipmentforcuttingdisplaypanels.
ET-Tester: Equipment for electrical characteristic testing.ET-Tester:Equipmentforelectricalcharacteristictesting.
Automated Inspection Machine (AMI): Display inspection equipment equipped with unmanned automation systems and AI and deep learning-based vision inspection algorithms, offering high inspection accuracy and processing speed. Possesses the technology to independently develop and apply unmanned automatic inspection algorithms in mass production.AutomatedInspectionMachine(AMI):DisplayinspectionequipmentequippedwithunmannedautomationsystemsandAIanddeeplearning-basedvisioninspectionalgorithms,offeringhighinspectionaccuracyandprocessingspeed.Possessesthetechnologytoindependentlydevelopandapplyunmannedautomaticinspectionalgorithmsinmassproduction.
OLED Aging Equipment: Equipment for the aging process and inspection of OLED panels. Supports cell sizes from 1 inch to 8 inches and features inspection processes of loading, pattern aging, and unloading.OLEDAgingEquipment:EquipmentfortheagingprocessandinspectionofOLEDpanels.Supportscellsizesfrom1inchto8inchesandfeaturesinspectionprocessesofloading,patternaging,andunloading.
Array Tester: Equipment used in the TFT array process of displays for array completion inspection, performing electrical characteristic tests.ArrayTester:EquipmentusedintheTFTarrayprocessofdisplaysforarraycompletioninspection,performingelectricalcharacteristictests.
Lighting JIG Checker: Jig-type inspection equipment for lighting inspection of display panels.LightingJIGChecker:Jig-typeinspectionequipmentforlightinginspectionofdisplaypanels.
Probe Unit: A core component used in the final inspection stage of cells and modules in flat panel display (FPD) manufacturing processes. OLED probe units are applicable to various FPDs including WOLED, P-OLED, and LCD.ProbeUnit:Acorecomponentusedinthefinalinspectionstageofcellsandmodulesinflatpaneldisplay(FPD)manufacturingprocesses.OLEDprobeunitsareapplicabletovariousFPDsincludingWOLED,P-OLED,andLCD.
Probe Frame: A frame component that supports and fixes the probe unit.ProbeFrame:Aframecomponentthatsupportsandfixestheprobeunit.
Micro Stage: Micro-stage technology for precise position control.MicroStage:Micro-stagetechnologyforprecisepositioncontrol.
Film Type MEMS Unit: A film-type unit component utilizing MEMS technology.FilmTypeMEMSUnit:Afilm-typeunitcomponentutilizingMEMStechnology.
M-POGO Pin: An ultra-fine spring-structured contact probe capable of producing 65-micrometer pitch products using MEMS processes. It is a key material responsible for electrical connections between chips and inspection equipment during semiconductor inspection.M-POGOPin:Anultra-finespring-structuredcontactprobecapableofproducing65-micrometerpitchproductsusingMEMSprocesses.Itisakeymaterialresponsibleforelectricalconnectionsbetweenchipsandinspectionequipmentduringsemiconductorinspection.
M-POGO Test Socket: A product boasting fine pitch compatibility, low signal distortion, and high durability, based on specialized design and process know-how from MEMS technology. Optimized for high-speed, high-integration semiconductor inspection, such as HBM.M-POGOTestSocket:Aproductboastingfinepitchcompatibility,lowsignaldistortion,andhighdurability,basedonspecializeddesignandprocessknow-howfromMEMStechnology.Optimizedforhigh-speed,high-integrationsemiconductorinspection,suchasHBM.
M-POGO Vertical Probe Card: A solution with excellent durability and stable signal transmission capabilities optimized for high-performance semiconductor testing, including HBM. This product secures domestic competitiveness by developing DC and Memory vertical probe cards in a market heavily reliant on foreign companies.M-POGOVerticalProbeCard:Asolutionwithexcellentdurabilityandstablesignaltransmissioncapabilitiesoptimizedforhigh-performancesemiconductortesting,includingHBM.ThisproductsecuresdomesticcompetitivenessbydevelopingDCandMemoryverticalprobecardsinamarketheavilyreliantonforeigncompanies.
Test Interface Unit (TIU): A component that ensures high-speed, low-noise, and stable signal transmission through PCB design technology for high-integration and ultra-high-speed signal transmission. It serves as an interface board that reliably transmits high-speed signals between the test socket and the inspection equipment.TestInterfaceUnit(TIU):Acomponentthatensureshigh-speed,low-noise,andstablesignaltransmissionthroughPCBdesigntechnologyforhigh-integrationandultra-high-speedsignaltransmission.Itservesasaninterfaceboardthatreliablytransmitshigh-speedsignalsbetweenthetestsocketandtheinspectionequipment.
Core AdvantagesCoreAdvantages
Vertical Integration based on MEMS Fab: The company has established a vertically integrated system from M-POGO Pin self-production to probe cards, test sockets, and TIUs. This ensures both cost competitiveness and technological differentiation, operating a consistent manufacturing system for high-precision, high-reliability semiconductor inspection components.VerticalIntegrationbasedonMEMSFab:ThecompanyhasestablishedaverticallyintegratedsystemfromM-POGOPinself-productiontoprobecards,testsockets,andTIUs.Thisensuresbothcostcompetitivenessandtechnologicaldifferentiation,operatingaconsistentmanufacturingsystemforhigh-precision,high-reliabilitysemiconductorinspectioncomponents.
Ultra-precision Semiconductor Inspection Component Technology: Possesses advanced manufacturing technology for ultra-precision inspection components based on its proprietary MEMS Fab infrastructure. Develops and produces core product lines such as M-POGO Pins, test sockets, and vertical probe cards, essential for advanced memory semiconductor inspection like HBM.Ultra-precisionSemiconductorInspectionComponentTechnology:Possessesadvancedmanufacturingtechnologyforultra-precisioninspectioncomponentsbasedonitsproprietaryMEMSFabinfrastructure.DevelopsandproducescoreproductlinessuchasM-POGOPins,testsockets,andverticalprobecards,essentialforadvancedmemorysemiconductorinspectionlikeHBM.
In-house AI and Deep Learning-based Inspection Algorithms: Independently developed unmanned automatic inspection algorithms applied for automatic detection of minute defects in display panels. This represents a differentiation from competitors by internalizing inspection algorithm technology beyond simple design and production.In-houseAIandDeepLearning-basedInspectionAlgorithms:Independentlydevelopedunmannedautomaticinspectionalgorithmsappliedforautomaticdetectionofminutedefectsindisplaypanels.Thisrepresentsadifferentiationfromcompetitorsbyinternalizinginspectionalgorithmtechnologybeyondsimpledesignandproduction.
Global Market Penetration and Partnerships: Established a cooperative relationship where customized interface boards (DSA) and test sockets are pre-installed in Teradyne inspection equipment. Actively expanding M-POGO Pin exports to the Chinese and Taiwanese markets, diversifying its international customer base.GlobalMarketPenetrationandPartnerships:Establishedacooperativerelationshipwherecustomizedinterfaceboards(DSA)andtestsocketsarepre-installedinTeradyneinspectionequipment.ActivelyexpandingM-POGOPinexportstotheChineseandTaiwanesemarkets,diversifyingitsinternationalcustomerbase.
Business Restructuring and New Capability Acquisition: Acquired ISC's TIU business unit in 2024 to implement vertical integration of semiconductor inspection components. This move strengthened its positioning as a specialized semiconductor inspection component company and secured PCB design and circuit technologies.BusinessRestructuringandNewCapabilityAcquisition:AcquiredISC'sTIUbusinessunitin2024toimplementverticalintegrationofsemiconductorinspectioncomponents.ThismovestrengtheneditspositioningasaspecializedsemiconductorinspectioncomponentcompanyandsecuredPCBdesignandcircuittechnologies.
R&D Personnel and Infrastructure: Over 50% of its total employees are R&D personnel, demonstrating capabilities in developing new concept Prebe Units, in-line scribers, LCD panel appearance inspection equipment, new concept Probe Stations, and semiconductor inspection equipment.R&DPersonnelandInfrastructure:Over50%ofitstotalemployeesareR&Dpersonnel,demonstratingcapabilitiesindevelopingnewconceptPrebeUnits,in-linescribers,LCDpanelappearanceinspectionequipment,newconceptProbeStations,andsemiconductorinspectionequipment.
Target IndustriesTargetIndustries
Semiconductor Industry: Utilized across the entire semiconductor manufacturing process, including inspection of advanced memory semiconductors like HBM, wafer inspection, and package inspection.SemiconductorIndustry:Utilizedacrosstheentiresemiconductormanufacturingprocess,includinginspectionofadvancedmemorysemiconductorslikeHBM,waferinspection,andpackageinspection.
Display Industry: Supplies equipment and components for the final inspection stages of cells and modules in flat panel display (FPD) manufacturing processes, including OLED and LCD. This includes OLED probe units, OLED inspection equipment, and LCD checkers.DisplayIndustry:Suppliesequipmentandcomponentsforthefinalinspectionstagesofcellsandmodulesinflatpaneldisplay(FPD)manufacturingprocesses,includingOLEDandLCD.ThisincludesOLEDprobeunits,OLEDinspectionequipment,andLCDcheckers.
PCB Industry: Applicable to various inspection solutions, including PCB VISION checkers and M-POGO Pin technology.PCBIndustry:Applicabletovariousinspectionsolutions,includingPCBVISIONcheckersandM-POGOPintechnology.
Automotive Industry: M-POGO Pin technology has potential applications in various industrial sectors, such as automotive electronic component inspection.AutomotiveIndustry:M-POGOPintechnologyhaspotentialapplicationsinvariousindustrialsectors,suchasautomotiveelectroniccomponentinspection.
Major MarketsMajorMarkets
China, Taiwan, VietnamChina,Taiwan,Vietnam
Certifications/PatentsCertifications/Patents
ISO 9001 Quality Management System Certification: Obtained in August 2008.ISO9001QualityManagementSystemCertification:ObtainedinAugust2008.
ISO 14001 Environmental Management System Certification: Obtained to operate a consistent manufacturing system for high-precision, high-reliability semiconductor inspection components.ISO14001EnvironmentalManagementSystemCertification:Obtainedtooperateaconsistentmanufacturingsystemforhigh-precision,high-reliabilitysemiconductorinspectioncomponents.
Venture Company Certification: Acquired venture company certification from the Korea Technology Finance Corporation in March 2008.VentureCompanyCertification:AcquiredventurecompanycertificationfromtheKoreaTechnologyFinanceCorporationinMarch2008.
Establishment of Corporate R&D Center: Established a corporate R&D center in March 2008 to focus on continuous technological development.EstablishmentofCorporateR&DCenter:EstablishedacorporateR&DcenterinMarch2008tofocusoncontinuoustechnologicaldevelopment.
Selection as Export-Promising Small and Medium-sized Enterprise: Acknowledged for its technological prowess and potential for expanding into export markets.SelectionasExport-PromisingSmallandMedium-sizedEnterprise:Acknowledgedforitstechnologicalprowessandpotentialforexpandingintoexportmarkets.
Patent Application for Prebe Unit: Filed patents for Prebe Unit domestically and internationally to protect its proprietary technology.PatentApplicationforPrebeUnit:FiledpatentsforPrebeUnitdomesticallyandinternationallytoprotectitsproprietarytechnology.
Successful Development of M-POGO Pin Technology: Successfully developed M-POGO Pin technology, a core component for semiconductor electrical characteristic inspection, utilizing the Korea Photonics Technology Institute's corporate support facilities and research equipment.SuccessfulDevelopmentofM-POGOPinTechnology:SuccessfullydevelopedM-POGOPintechnology,acorecomponentforsemiconductorelectricalcharacteristicinspection,utilizingtheKoreaPhotonicsTechnologyInstitute'scorporatesupportfacilitiesandresearchequipment.
M-POGO Name, Trademark, and Patent Registration: Registered the M-POGO name, trademark, and patents in key countries, securing intellectual property rights for its core technology.M-POGOName,Trademark,andPatentRegistration:RegisteredtheM-POGOname,trademark,andpatentsinkeycountries,securingintellectualpropertyrightsforitscoretechnology.
Acquisition of Technology Evaluation Grade A: Obtained a Technology Evaluation Grade A to meet the requirements for special technology listing on KOSDAQ.AcquisitionofTechnologyEvaluationGradeA:ObtainedaTechnologyEvaluationGradeAtomeettherequirementsforspecialtechnologylistingonKOSDAQ.
Possession of 81 Patents: As of 2026, holds 81 patents, indicating its strong competitive advantage in the relevant field based on proprietary core technologies.Possessionof81Patents:Asof2026,holds81patents,indicatingitsstrongcompetitiveadvantageintherelevantfieldbasedonproprietarycoretechnologies.
Introduction
Location
94 Jungbu-daero 2670beon-gil, Majang-myeon, Icheon, Gyeonggi-do, South Korea
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Information
94 Jungbu-daero 2670beon-gil, Majang-myeon, Icheon, Gyeonggi-do, South Korea