Information
94 Jungbu-daero 2670beon-gil, Majang-myeon, Icheon, Gyeonggi-do, South Korea
+82 31-337-1854
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Overview
- Summary
- LUKEN Technologies is a technology-intensive company specializing in the development and production of semiconductor and display inspection equipment and components. The company's core product line includes ultra-precision semiconductor inspection components such as MEMS Fab-based M-POGO Pins, test sockets, and vertical probe cards. It also plays a significant role in the display sector by supplying OLED inspection equipment and probe units. The company is actively expanding its business into the next-generation semiconductor market through the development of High Bandwidth Memory (HBM) testing components.LUKEN Technologies is a technology-intensive company specializing in the development and production of semiconductor and display inspection equipment and components. The company's core product line includes ultra-precision semiconductor inspection components such as MEMS Fab-based M-POGO Pins, test sockets, and vertical probe cards. It also plays a significant role in the display sector by supplying OLED inspection equipment and probe units. The company is actively expanding its business into the next-generation semiconductor market through the development of High Bandwidth Memory (HBM) testing components.
- Key Products/Technologies
- **Semiconductor Inspection Components**: M-POGO Pin, capable of producing 65-micron pitch products through MEMS processes, is an ultra-fine spring-structured contact probe. M-POGO Test Socket, based on MEMS processes, features specialized design and process know-how for fine pitch compatibility, low signal distortion, and high durability. M-POGO Vertical Probe Card is an optimized solution for high-performance semiconductor testing, including HBM, offering excellent durability and stable signal transmission capabilities. The Test Interface Unit (TIU) secures high-speed, low-noise, and stable signal transmission through advanced PCB design technology for high-density, high-speed signal transfer. The product portfolio also includes HBM test probes, HBM KGS micro-bump probe heads, IC test sockets, and WLCSP probe cards.**Semiconductor Inspection Components**: M-POGO Pin, capable of producing 65-micron pitch products through MEMS processes, is an ultra-fine spring-structured contact probe. M-POGO Test Socket, based on MEMS processes, features specialized design and process know-how for fine pitch compatibility, low signal distortion, and high durability. M-POGO Vertical Probe Card is an optimized solution for high-performance semiconductor testing, including HBM, offering excellent durability and stable signal transmission capabilities. The Test Interface Unit (TIU) secures high-speed, low-noise, and stable signal transmission through advanced PCB design technology for high-density, high-speed signal transfer. The product portfolio also includes HBM test probes, HBM KGS micro-bump probe heads, IC test sockets, and WLCSP probe cards.
- **Display Inspection Equipment and Components**: OLED Probe Unit is a crucial component used in the final inspection stage of cell/module manufacturing processes for Flat Panel Displays (FPDs). OLED Inspection Equipment features an unmanned automation system with AI and deep learning-based vision inspection algorithms, ensuring high inspection accuracy and processing speed. The company offers a diverse range of display-related inspection equipment, including LCD checkers, PCB VISION checkers, LED checkers, scribers, ET-Testers, automated inspection machines (AMI), OLED aging equipment, array testers, and lighting JIG checkers.**Display Inspection Equipment and Components**: OLED Probe Unit is a crucial component used in the final inspection stage of cell/module manufacturing processes for Flat Panel Displays (FPDs). OLED Inspection Equipment features an unmanned automation system with AI and deep learning-based vision inspection algorithms, ensuring high inspection accuracy and processing speed. The company offers a diverse range of display-related inspection equipment, including LCD checkers, PCB VISION checkers, LED checkers, scribers, ET-Testers, automated inspection machines (AMI), OLED aging equipment, array testers, and lighting JIG checkers.
- **Core Technologies**: Proprietary MEMS (Micro-Electro-Mechanical Systems) Fab infrastructure forms the basis for ultra-precision inspection component manufacturing technology. The company utilizes self-developed inspection algorithms and AI vision technology for automatic detection of minute defects in display panels. High-density and high-speed signal transmission PCB design technology represents another key capability.**Core Technologies**: Proprietary MEMS (Micro-Electro-Mechanical Systems) Fab infrastructure forms the basis for ultra-precision inspection component manufacturing technology. The company utilizes self-developed inspection algorithms and AI vision technology for automatic detection of minute defects in display panels. High-density and high-speed signal transmission PCB design technology represents another key capability.
- Core Advantages
- The MEMS Fab-based vertical integration system encompasses the entire manufacturing process from M-POGO Pin production to probe cards, test sockets, and TIUs. This comprehensive approach ensures both cost competitiveness and technological differentiation.The MEMS Fab-based vertical integration system encompasses the entire manufacturing process from M-POGO Pin production to probe cards, test sockets, and TIUs. This comprehensive approach ensures both cost competitiveness and technological differentiation.
- Ultra-precision and high-performance inspection solutions include the capability to produce M-POGO Pins compatible with fine pitches down to 65 micrometers. The company provides product lines optimized for high-speed, high-density next-generation semiconductor inspection, such as High Bandwidth Memory (HBM).Ultra-precision and high-performance inspection solutions include the capability to produce M-POGO Pins compatible with fine pitches down to 65 micrometers. The company provides product lines optimized for high-speed, high-density next-generation semiconductor inspection, such as High Bandwidth Memory (HBM).
- Continuous technological innovation and R&D investment are evident in over 50% of its workforce dedicated to research and development. Strategic moves like the acquisition of an AI Algorithm technology company in 2022 demonstrate an active portfolio expansion strategy.Continuous technological innovation and R&D investment are evident in over 50% of its workforce dedicated to research and development. Strategic moves like the acquisition of an AI Algorithm technology company in 2022 demonstrate an active portfolio expansion strategy.
- Securing domestic production competitiveness involves developing DC and Memory Vertical Probe Cards, reducing reliance on foreign suppliers in the probe card market. This contributes to improving next-generation semiconductor yield and reducing testing costs.Securing domestic production competitiveness involves developing DC and Memory Vertical Probe Cards, reducing reliance on foreign suppliers in the probe card market. This contributes to improving next-generation semiconductor yield and reducing testing costs.
- Global market penetration and partnerships include a collaboration with global test equipment manufacturer Teradyne, where customized interface boards (DSA) and test sockets are standard components in their inspection equipment. The company is also expanding M-POGO Pin exports to the Chinese and Taiwanese markets, diversifying its international clientele.Global market penetration and partnerships include a collaboration with global test equipment manufacturer Teradyne, where customized interface boards (DSA) and test sockets are standard components in their inspection equipment. The company is also expanding M-POGO Pin exports to the Chinese and Taiwanese markets, diversifying its international clientele.
- Business restructuring and new capability acquisition are exemplified by the 2024 acquisition of ISC's TIU business unit, leading to the vertical integration of semiconductor inspection components. This strategy reinforces its position as a specialized semiconductor inspection component manufacturer.Business restructuring and new capability acquisition are exemplified by the 2024 acquisition of ISC's TIU business unit, leading to the vertical integration of semiconductor inspection components. This strategy reinforces its position as a specialized semiconductor inspection component manufacturer.
- Target Industrie
- The semiconductor industry is a primary application area, with essential solutions provided for advanced memory semiconductor inspection, particularly High Bandwidth Memory (HBM). Contributions span from wafer-level chip inspection to the final performance verification of packaged semiconductor chips.The semiconductor industry is a primary application area, with essential solutions provided for advanced memory semiconductor inspection, particularly High Bandwidth Memory (HBM). Contributions span from wafer-level chip inspection to the final performance verification of packaged semiconductor chips.
- The display industry benefits from the supply of equipment and components for the final inspection stages of cell and module manufacturing in Flat Panel Displays (FPDs), including OLED and LCD. The company's technology for automatic detection of minute defects in display panels enhances customer productivity and quality competitiveness.The display industry benefits from the supply of equipment and components for the final inspection stages of cell and module manufacturing in Flat Panel Displays (FPDs), including OLED and LCD. The company's technology for automatic detection of minute defects in display panels enhances customer productivity and quality competitiveness.
- The PCB (Printed Circuit Board) industry is also served with products related to vision inspection equipment and interface boards.The PCB (Printed Circuit Board) industry is also served with products related to vision inspection equipment and interface boards.
- Major Markets
- China, Taiwan, VietnamChina, Taiwan, Vietnam
- Certifications/Patents
- Acquisition of ISO 9001 Quality Management System certification and ISO 14001 Environmental Management System certification. Operation of a consistent manufacturing system for high-precision, high-reliability semiconductor inspection components.Acquisition of ISO 9001 Quality Management System certification and ISO 14001 Environmental Management System certification. Operation of a consistent manufacturing system for high-precision, high-reliability semiconductor inspection components.
- Certification as a venture company by the Korea Technology Finance Corporation and selection as an export-promising small and medium-sized enterprise. In 2017, the company obtained certifications for management innovation and technology innovation for small and medium-sized enterprises.Certification as a venture company by the Korea Technology Finance Corporation and selection as an export-promising small and medium-sized enterprise. In 2017, the company obtained certifications for management innovation and technology innovation for small and medium-sized enterprises.
- Domestic and international patent applications for Probe Unit technology and a total of 81 patents held. Actively focusing on technological development, including the acquisition of OLED inspection-related patents in 2015.Domestic and international patent applications for Probe Unit technology and a total of 81 patents held. Actively focusing on technological development, including the acquisition of OLED inspection-related patents in 2015.
- Establishment of a corporate research institute to continuously strengthen technological development and innovation capabilities.Establishment of a corporate research institute to continuously strengthen technological development and innovation capabilities.
- Recognition for its technological prowess through the receipt of the Best Technology Award at the KONEX Awards in 2024.Recognition for its technological prowess through the receipt of the Best Technology Award at the KONEX Awards in 2024.
Introduction
Location
94 Jungbu-daero 2670beon-gil, Majang-myeon, Icheon, Gyeonggi-do, South Korea
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