Kostek Systems
Series3
Product List
12Vacuum Cluster Tools
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EFEM
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Load Port Module
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CIS Wafer Bonding System
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Temporary Wafer Bonding System
TAURUS 300TB
Temporary Wafer De-Bonding System
TAURUS 300DB
Temporary Wafer Bonding/Debonding System
TAURUS 300FOB/300FOD
Plasma Ashing System
R-7400
Encapsulation System
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Vacuum Transfer System
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Temporary Wafer Bonding System
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De-Bonding System
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Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.