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Kostek Systems

Kostek Systems

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Introduction

We promise you to create the best value based on our creativity passion and differentiated technology.

We have been providing the vacuum cluster tool which is used in the semiconductor front-end process equipments of the semiconductor industry since 2000. Now, we have expanded the business into a Wafer Bonding System, which is new growing in the market, through continuous efforts for the development of technologies.

This is used for Wafer to Wafer bonding / de-bonding. It is the key process used in the manufacturing of next-generation TSV 3D IC, V-LED Chip and CMOS image Sensors of the Smartphone Cameras.

We will continually provide our customers with new technologies-applied products having the best performance and efficiency.

Location

231, Bangkkoji-gil, Seotan-myeon, Pyeongtaek-si, Gyeonggi-do, Korea

http://kosteks.com

+82-31-646-1500

+82-31-646-1515

sales@kosteks.com

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Kostek Systems

Kostek Systems

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

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