Semi conductor equipment manufacturer, Aero space equipment, Parts, Measuring equipment, UV curling machine, Lamp and more
EMI Shield Vacuum Laminator
EMI 차폐용 Tape Lamination을 기존 Ball 도피 방식에서 Vacuum Lamination 방식으로 개발하여 공정 개선함.
Tape Lamination at Bump without Void by expanding
Diaphragm at the condition of mounted Chip Bump
380 X 380 RING FRAME