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Vacuum Laminator
Model Name
-
Series
Semiconductor
Data
-
Manufacturer information
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Daesung Engineering

Semi conductor equipment manufacturer, Aero space equipment, Parts, Measuring equipment, UV curling machine, Lamp and more

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Manufacturer
Daesung Engineering
Product Type
Machine
Brand
-
SKU
40954
Product Name
Vacuum Laminator
Model Name
-
Size
-
Weight
-
Product Details

Vacuum Laminator

The equipment that install NCF on the Wafer without damage of Void, Thermal Strain, and Bump in 3D TSV Packaging processing and It also laminates film using by diaphragm expansion that is caused by air pressure difference in Vacuum Chamber.

Product descriptions

 
Daesung Engineering Vacuum Laminator  
 

SPECIFICATION

· TYPE : FULL AUTO BUMPED
· WAFER SIZE(inch)
   : 8”, 12” Wafer 
   : 8”, 12” Wafer(With Ring Frame)
· DEMENSION(mm) : 1,990(W) * 2,580(D) * 2,220(H)
· WEIGHT : 1,100kg  
 
 

Daesung Engineering
Daesung Engineering
Semi conductor equipment manufacturer, Aero space equipment, Parts, Measuring equipment, UV curling machine, Lamp and more
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