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Plasma Sawing System
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APTCSemi conductor process equipment manufacturer, Hybrid system, Chamber system products
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Manufacturer
APTC
Brand
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SKU
29451
Product Name
Plasma Sawing System
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Product Details

As the semiconductor technology node continues to shrink feature sizes, accurate wafer sawing becomes more important.
The mechanical blade or laser sawing can damage the rim of die, while plasma sawing is clear and delicate in slicing from die to die.
Especially, plasma sawing technology is effective in thin wafer sawing. Furthermore, the advantages are throughput improvement and higher die strength.

APTCSemi conductor process equipment manufacturer, Hybrid system, Chamber system products
APTC was founded with the purpose to produce world-class semiconductor processing equipment. APTC is focused on engineering and technology for plasma-related semiconductor processing equipment. Despite its short history, APTC has made significant progress including 300mm etchers, plasma doping systems, and LED etchers. In light of a multidisciplinary area that requires processing equipment, APTC aims to combine all areas of engineering. Starting with etchers, APTC aspires to be the worldwide leader in semiconductor processing equipment. The semiconductor processing equipment will naturally have a significant impact on related industries such as materials processing, vacuum technology, RF engineering, etc.
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