ALPSITEC is a designer and manufacturer of CMP (Chemical Mechanical Planarization) equipment. The company specializes in the polishing and planarization of semiconductor wafers. It provides CMP solutions primarily to universities, research institutions, and industrial customers, offering a range of equipment from prototyping to mass production.ALPSITECisadesignerandmanufacturerofCMP(ChemicalMechanicalPlanarization)equipment.Thecompanyspecializesinthepolishingandplanarizationofsemiconductorwafers.ItprovidesCMPsolutionsprimarilytouniversities,researchinstitutions,andindustrialcustomers,offeringarangeofequipmentfromprototypingtomassproduction.
Key Products/TechnologiesKeyProducts/Technologies
**CMP Machines E460**: A semi-automatic system for polishing and planarizing 1-inch to 8-inch wafers. This flexible equipment is optimized for research and development and small-scale production requirements. It features four slurry pumps and ex-situ or in-situ conditioning systems, capable of polishing oxides, silicon, polysilicon, nitrides, and metals. The E460 offers 10 process steps and precise control via a touchscreen interface.**CMPMachinesE460**:Asemi-automaticsystemforpolishingandplanarizing1-inchto8-inchwafers.Thisflexibleequipmentisoptimizedforresearchanddevelopmentandsmall-scaleproductionrequirements.Itfeaturesfourslurrypumpsandex-situorin-situconditioningsystems,capableofpolishingoxides,silicon,polysilicon,nitrides,andmetals.TheE460offers10processstepsandprecisecontrolviaatouchscreeninterface.
**CMP Machines Pcox 200s**: A standalone module for process development, offering the same specifications as a production machine. It supports 4-inch to 200mm wafer compatibility, automatic loading/unloading, and 10 polishing steps. Key features include ex-situ and in-situ conditioning, an integrated slurry pump, and quick exchange capabilities for platens, carriers, and conditioning tools.**CMPMachinesPcox200s**:Astandalonemoduleforprocessdevelopment,offeringthesamespecificationsasaproductionmachine.Itsupports4-inchto200mmwafercompatibility,automaticloading/unloading,and10polishingsteps.Keyfeaturesincludeex-situandin-situconditioning,anintegratedslurrypump,andquickexchangecapabilitiesforplatens,carriers,andconditioningtools.
**CMP Machines Pcox 202-203-204**: A series of modular, production-oriented machines with configurations including 2 to 4 polishing modules. These machines share similar characteristics with the Pcox 200s, providing high throughput and excellent availability for high-volume production environments. They offer competitive pricing, modularity, and scalability, making them a strong solution for semiconductor manufacturers.**CMPMachinesPcox202-203-204**:Aseriesofmodular,production-orientedmachineswithconfigurationsincluding2to4polishingmodules.ThesemachinessharesimilarcharacteristicswiththePcox200s,providinghighthroughputandexcellentavailabilityforhigh-volumeproductionenvironments.Theyoffercompetitivepricing,modularity,andscalability,makingthemastrongsolutionforsemiconductormanufacturers.
**CMP Machines E400 E**: A compact, tabletop tool designed for polishing and planarizing single wafers with diameters between 1 inch and 4 inches, as well as various shapes like squares and wafer quarters. It is optimized for research and development applications and new material development. The E400 E's development is based on Alpsitec's 15 years of experience in CMP and tool control.**CMPMachinesE400E**:Acompact,tabletoptooldesignedforpolishingandplanarizingsinglewaferswithdiametersbetween1inchand4inches,aswellasvariousshapeslikesquaresandwaferquarters.Itisoptimizedforresearchanddevelopmentapplicationsandnewmaterialdevelopment.TheE400E'sdevelopmentisbasedonAlpsitec's15yearsofexperienceinCMPandtoolcontrol.
**CMP Machines E550**: A previous model that has been replaced by the Pcox series, now available in a new version running on Windows 7.**CMPMachinesE550**:ApreviousmodelthathasbeenreplacedbythePcoxseries,nowavailableinanewversionrunningonWindows7.
**Core Technologies**: Expertise in designing and manufacturing semi-automatic and automated systems for wafer polishing and planarization. Capability to process various wafer sizes (1-inch to 8-inch, 200mm) and materials (silicon, oxides, metals, etc.). Advanced flexible process recipe settings and real-time parameter control technologies. Integrated slurry delivery and conditioning system technologies.**CoreTechnologies**:Expertiseindesigningandmanufacturingsemi-automaticandautomatedsystemsforwaferpolishingandplanarization.Capabilitytoprocessvariouswafersizes(1-inchto8-inch,200mm)andmaterials(silicon,oxides,metals,etc.).Advancedflexibleprocessrecipesettingsandreal-timeparametercontroltechnologies.Integratedslurrydeliveryandconditioningsystemtechnologies.
Core AdvantagesCoreAdvantages
**Extensive Product Portfolio**: A comprehensive lineup of CMP equipment, ranging from the E400 E and E460 for R&D and prototyping to the Pcox 202-203-204 series for mass production, addressing diverse customer needs.**ExtensiveProductPortfolio**:AcomprehensivelineupofCMPequipment,rangingfromtheE400EandE460forR&DandprototypingtothePcox202-203-204seriesformassproduction,addressingdiversecustomerneeds.
**Modular Design and Scalability**: The modular configuration of the Pcox series allows for flexible expansion and upgrades in response to evolving production requirements. The ability to directly transfer processes developed on the Pcox 200s to Pcox 20X production machines and evolve modules ensures long tool life without obsolescence.**ModularDesignandScalability**:ThemodularconfigurationofthePcoxseriesallowsforflexibleexpansionandupgradesinresponsetoevolvingproductionrequirements.TheabilitytodirectlytransferprocessesdevelopedonthePcox200stoPcox20Xproductionmachinesandevolvemodulesensureslongtoollifewithoutobsolescence.
**High Flexibility and Versatility**: Quick exchange systems for platens, carriers, and conditioning heads facilitate easy sharing of equipment among different processes, wafer sizes, and teams. The capability to process small samples (10x10mm) up to 8-inch wafers and various shapes demonstrates exceptional versatility.**HighFlexibilityandVersatility**:Quickexchangesystemsforplatens,carriers,andconditioningheadsfacilitateeasysharingofequipmentamongdifferentprocesses,wafersizes,andteams.Thecapabilitytoprocesssmallsamples(10x10mm)upto8-inchwafersandvariousshapesdemonstratesexceptionalversatility.
**Robustness and Reliability**: Inheriting the legacy of Steag Electronic Systems, Alpsitec's machines are built on robust mechanical concepts, ensuring high availability and durability. The multi-use of identical components simplifies maintenance and reduces spare parts inventory.**RobustnessandReliability**:InheritingthelegacyofSteagElectronicSystems,Alpsitec'smachinesarebuiltonrobustmechanicalconcepts,ensuringhighavailabilityanddurability.Themulti-useofidenticalcomponentssimplifiesmaintenanceandreducessparepartsinventory.
**Technical Expertise and Custom Solutions**: Over 15 years of experience in CMP and tool control enables the provision of customized designs and solutions tailored to specific customer requirements. Remote support, troubleshooting, and training capabilities via internet connection ensure prompt customer service.**TechnicalExpertiseandCustomSolutions**:Over15yearsofexperienceinCMPandtoolcontrolenablestheprovisionofcustomizeddesignsandsolutionstailoredtospecificcustomerrequirements.Remotesupport,troubleshooting,andtrainingcapabilitiesviainternetconnectionensurepromptcustomerservice.
**Competitive Pricing**: The Pcox 202-203-204 models offer an attractive price-performance ratio compared to other CMP equipment in the market, enhancing customer investment efficiency.**CompetitivePricing**:ThePcox202-203-204modelsofferanattractiveprice-performanceratiocomparedtootherCMPequipmentinthemarket,enhancingcustomerinvestmentefficiency.
Research institutions and university laboratoriesResearchinstitutionsanduniversitylaboratories
Industrial research centersIndustrialresearchcenters
New material developmentNewmaterialdevelopment
Manufacturing of nanoelectronic devices (RRAM, SET, MIM types)Manufacturingofnanoelectronicdevices(RRAM,SET,MIMtypes)
Planarization of metallic nanowiresPlanarizationofmetallicnanowires
Reduction of surface roughness for Si₃N₄, SiO₂ReductionofsurfaceroughnessforSi₃N₄,SiO₂
Planarization of gold microstructuresPlanarizationofgoldmicrostructures
Major MarketsMajorMarkets
AlgeriaAlgeria
China, IndiaChina,India
FranceFrance
Certifications/PatentsCertifications/Patents
Specific patent numbers or official certifications are not directly identified in the search results.Specificpatentnumbersorofficialcertificationsarenotdirectlyidentifiedinthesearchresults.
Technical strength derived from over 15 years of expertise and experience in CMP and tool control.Technicalstrengthderivedfromover15yearsofexpertiseandexperienceinCMPandtoolcontrol.
Capability for technical integration, including readiness for interfacing with proprietary endpoint detection systems like the DFA2 system.Capabilityfortechnicalintegration,includingreadinessforinterfacingwithproprietaryendpointdetectionsystemsliketheDFA2system.
Recognition as a 'Verified & Trusted Manufacturer' on the Komachine platform, indicating reliability.Recognitionasa'Verified&TrustedManufacturer'ontheKomachineplatform,indicatingreliability.