Motivation for Development
This curing machine is designed to be used in the process for fastening and unfastening wafers in the semiconductor wafer-processing CMP process. 

Main Use : For semiconductor wafer-processing process 

Product Features
① Allow for free use of various sizes of wafers 
② Capable of processing multiple wafers. 
③ Permit the processing of light irradiation conditions by channels according to the conditions of wafers 
④ No adhesive residues (chips) left so that adhesion after the processing of wafers can be easily removed
⑤ There are variable types of scan and irradiation distance, all of which can be applied to wafers with various specifications. (Mainly 8- and 10-inch wafers)
⑥ This is the semi-automatic batch type which processes products in an independent chamber.
⑦ Realize the out-gas system and cleam chamber by adopting the N2 purge system
⑧ Achieve high-efficiency UV flux and high-level beam uniformity
⑨ Display the status of the system through various indicators 

Main Specifications