Description

SFA SEMICON’s broad portfolio of Small Outline Package (SOP) include the popular “gullwing” lead formats. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best SOP packages available for your semiconductor devices. These IC packages have proven surface mount (SMT) performance characteristics and have been designed to adopt easily to all SMT processes and lines. SFA SEMICON’s wide array of SOIC packages provide component and packaging engineers the ability and freedom to optimize systems and product designs.

 

Application

ㆍHandheld devices, Cellular phones, PDAs, MP3s,

ㆍConsumer (audio, video, entertainment)

ㆍTelecommunications (pagers, cordless telephone)

ㆍRF / wireless (PC cards, RF/CATV, telemetry)

ㆍOffice (fax, copier, printer)

ㆍPC/peripheral

ㆍAutomotive

 

Feature

ㆍJEDEC Standard compliance

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍLead pitch ≥ 1.27mm