Description

SFA SEMICON offers Quad Flat No lead, QFN package services by utilizing plastic encapsulated leadframe base CSP with a lead pad on the bottom of the package to provide electrical interconnection. The body size of the QFN package has been reduced by 60% compared with the conventional QFP package. It provides good electrical performance by inner lead and short wire. The QFN package with small, lightweight, improved thermal and good electrical performance (but without re-designed lead frame) can ensure our customers gain cost-effective solutions

 

Application

ㆍHandheld devices, Cellular phones, PDAs, MP3s

ㆍGame consoles

 

Feature

ㆍPunch / Saw type

ㆍJEDEC Standard compliance

ㆍDie stack Applicable

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍLead pitch ≥ 0.40mm