Description

PBGA is a die-up design, plastic overmolded BGA using 2, 4 or 6 layer BT substrate and 1.0 or 1.27mm ball pitch and above. It offers high a I/O replacement for the QFP package when the I/O exceeds QFP-256 limitations. SFA SEMICON's PBGA offers improved electrical and thermal operation through multiple routing layers such as ground and power planes. Additionally, industry proven processes and materials provide assurance for reliable and long-term operation.

 

Application

ㆍMicroprocessors / controllers, ASICs, Gate Arrays, memory, DSPs, PLDs, graphics and PC chip sets

ㆍwireless telecommunications, GPS, laptop PC’s, video cameras, disc drives, PLDs, graphics

 

Feature

ㆍJEDEC Standard compliance

ㆍMCP / SiP / Flip chip

ㆍGreen materials (Pb-free / RoHS compliance)