Description

SIP package containing combination of one or more multifunctional Ics with heterogeneous interconnection Including passive components and MEMS/Sensor assembled into a single package EMI shielding with sputtering and plating. Any combination of one or more integrated circuit(s) of different functionalities with various form and factors passive components and/or MEMS assembled into a single package. Getting all or part of the functions of an electronic system on the standard PCB board for a moniturization Achieving electrical/thermal performance enhancement purposes

 

Application

ㆍPower amplifiers, Antenna switches/Frontend module & transceiver, Connectivity module, MEMS integration with ASIC, Sensory module, automotive, 3G/4G model, Solid-state storage devices(SSD)

 

Feature

ㆍPassive Component (≥ 01005)

ㆍSAW,BAW filter, X-tal, Oscillator, Antenna

ㆍEPS (Embedded Passive Substrate)

ㆍEAD (Embedded Active Device)

ㆍCore & Coreless Substrate

ㆍMold Grinding / Double Molding

ㆍShielding