Description

The electronics market trend is to offer more functionality, better performance, higher density, lower cost, along with smaller footprints and lower profiles. SFA SEMICON's Stacked die packages are continuously being upgraded to meet these demands. Compared to single die packages, the stacked die package combines with several different functional devices, or increases memory density within same footprints as a single die package. In addition, this package can be built either as a Land Grid Array or Ball Grid Array to match the application or thermal/electrical design requirements.

 

Application

ㆍMobile Phone, PDA, Camcorder, Wireless Home Appliances

 

Feature

ㆍFace-up

ㆍJEDEC Standard compliance

ㆍMCP / SiP

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍBall pitch ≥ 0.40mm