Description

FBGA packages have been assembled for years in SFA SEMICON . SFA SEMICON 's experienced design group provides the best package structure design and cost-effective material choices to achieve low profile, small form factor, high reliability and high-quality electrical/ thermal performance for FBGA. BGA technology was first introduced as a solution to problems associated with the increasingly high lead counts required for advanced semiconductors used in applications such as portable computers and wireless telecommunications. As the number of leads surrounding the integrated circuits increased, high lead count packages experienced significant electrical shorting problems. BGA technology solved this problem by effectively creating leads on the bottom surface of the package in the form of small bumps or solder balls.

 

Application

ㆍHand-held consumer products

ㆍComputing platforms, Networking

ㆍWireless Communications devices

ㆍPersonal Digital Asistants

 

Feature

ㆍFace-up/Face-down

ㆍJEDEC Standard compliance

ㆍMCP / SiP / Flip chip

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍBall pitch ≥ 0.40mm