Description

The fcCSP package is the main platform in flip Chip package family, which includes bare die type, Molded (CUF,MUF) types, SiP types, Hybrid (fcSCSP) types and a package sub-system meeting the standard BGA footprint that contains multiple components within the same package (MCM fcCSP). Options also include configurations with thin core, Pb-free and Cu Pillar bump and process method (Mass reflow, TCNCP). The Flip chip CSP packages are suitable for low lead count, high frequency, high performance, and portable products such as performance memory, RFICs, and DSPs.

 

Application

High End & Low End Package

ㆍAutomotive

ㆍTelecommunication

ㆍComputer

ㆍConsumer

 

Feature

ㆍBump pitch : Min.130um (Solder bump)

ㆍCu Pillar (TCNCP ≤ 50um / Mass Reflow ≤ 130um)

ㆍDie size : 0.8~12.5mm

ㆍPackage size : 3~19mm