Description

ㆍEfficient Integration : Mother and Daughter communicate efficiently at faster speed, lower inductance, and lower electrical resistance, ideally suited for high speed signal applications, e.g. Si photonics

ㆍMulti Die Capability : Mix of devices can be attached to create fully functional blocks, e.g. attaching a laser to Si photonics chip set creates the platform for an optical transceiver

ㆍSupport Legacy : Once sawn, the chip stack can be assembled into a various types of packages e.g. QSFP, QFN, fcCSP, PBGA, etc.

ㆍMultiple Structures : For example CoW POSSUMTM, CoW+WB, etc.

ㆍObjective

ㆍTo develop SFA SEMICON internal TV for CoC / CoS / CoW process (development) SFA SEMICON qualification

ㆍTo attest and document SFA SEMICON CoC/CoW Design Rule

ㆍTo attest the thermal, electrical, and mechanical aspects of the CoC/CoW design

 

Application

ㆍMobile Phone, HDTV, Camcoder, Wireless Home Appliances, Sensor, Etc

ㆍTouch screen controllers / Antenna

ㆍPower amplifiers

ㆍModem IC, Wi-Fi & Bluetoos, RFIC , PMIC

ㆍApplication processor

 

Feature

ㆍAll standard Cu pillar & solder bump

ㆍFine pitch Cu pillar & u-bump

ㆍNo general under-fill material

ㆍPassivation barrier type

ㆍNSOP(Non Solder on Pad) type