Zaram Technology is a non-memory system semiconductor design specialist trusted by global 5G communication leaders. The company possesses technological capabilities for self-design and manufacturing of communication semiconductors, optical components, and network equipment. It is a leading enterprise in developing XGSPON chips and related solutions, crucial for 5G communication networks. The company is expanding its business into artificial intelligence (AI) and autonomous driving industries based on next-generation communication technologies.ZaramTechnologyisanon-memorysystemsemiconductordesignspecialisttrustedbyglobal5Gcommunicationleaders.Thecompanypossessestechnologicalcapabilitiesforself-designandmanufacturingofcommunicationsemiconductors,opticalcomponents,andnetworkequipment.ItisaleadingenterpriseindevelopingXGSPONchipsandrelatedsolutions,crucialfor5Gcommunicationnetworks.Thecompanyisexpandingitsbusinessintoartificialintelligence(AI)andautonomousdrivingindustriesbasedonnext-generationcommunicationtechnologies.
Key Products/TechnologiesKeyProducts/Technologies
**Communication Semiconductors (XGSPON Chip) and XGSPON SFP+ ONU**: Technology supporting upstream/downstream 10Gbps transmission speeds, capable of connecting up to 64 base stations or terminals via a single optical cable. World's first successful commercialization for 5G small cell backhaul and efficient low-power consumption of 0.9W, significantly lower than the international standard of 2W. Pluggable products enhancing installation convenience and efficiency. The company is pursuing the development of next-generation technologies, including 25Gbps and 100Gbps PON chips.**CommunicationSemiconductors(XGSPONChip)andXGSPONSFP+ONU**:Technologysupportingupstream/downstream10Gbpstransmissionspeeds,capableofconnectingupto64basestationsorterminalsviaasingleopticalcable.World'sfirstsuccessfulcommercializationfor5Gsmallcellbackhaulandefficientlow-powerconsumptionof0.9W,significantlylowerthantheinternationalstandardof2W.Pluggableproductsenhancinginstallationconvenienceandefficiency.Thecompanyispursuingthedevelopmentofnext-generationtechnologies,including25Gbpsand100GbpsPONchips.
**Optical Transceivers**: Products that convert electrical signals to optical signals and optical signals to electrical signals between optical cables and data transmission equipment. A diverse product line including optical transceivers for mobile networks.**OpticalTransceivers**:Productsthatconvertelectricalsignalstoopticalsignalsandopticalsignalstoelectricalsignalsbetweenopticalcablesanddatatransmissionequipment.Adiverseproductlineincludingopticaltransceiversformobilenetworks.
**GiGaWire Solutions**: Solutions providing 1Gbps ultra-high-speed internet service using existing copper-based communication networks. Includes models such as GiGaWire 2.0 Access Solution L12224XH and Outdoor Solution L20204DCP.**GiGaWireSolutions**:Solutionsproviding1Gbpsultra-high-speedinternetserviceusingexistingcopper-basedcommunicationnetworks.IncludesmodelssuchasGiGaWire2.0AccessSolutionL12224XHandOutdoorSolutionL20204DCP.
**DVT and Other SoCs**: Digital Video Broadcasting (DVT) and other System-on-Chip (SoC) product families. The company's technological expertise as a first-generation fabless firm designing multimedia device chips, based on its initial Intellectual Property (IP) business.**DVTandOtherSoCs**:DigitalVideoBroadcasting(DVT)andotherSystem-on-Chip(SoC)productfamilies.Thecompany'stechnologicalexpertiseasafirst-generationfablessfirmdesigningmultimediadevicechips,basedonitsinitialIntellectualProperty(IP)business.
**RISC-V based On-Device AI Neuromorphic Processors**: Development of high-efficiency, ultra-low-power circuits and SoCs for edge devices based on RISC-V design technology. Research for advancing AI semiconductor performance and plans for sample chip production in the second half of 2026.**RISC-VbasedOn-DeviceAINeuromorphicProcessors**:Developmentofhigh-efficiency,ultra-low-powercircuitsandSoCsforedgedevicesbasedonRISC-Vdesigntechnology.ResearchforadvancingAIsemiconductorperformanceandplansforsamplechipproductioninthesecondhalfof2026.
Core AdvantagesCoreAdvantages
**World-leading Low-Power Technology**: Unique technological capability to achieve 0.9W power consumption for XGSPON chips, less than half of the international standard of 2W.**World-leadingLow-PowerTechnology**:Uniquetechnologicalcapabilitytoachieve0.9WpowerconsumptionforXGSPONchips,lessthanhalfoftheinternationalstandardof2W.
**Cost Competitiveness**: Design technology ensuring cost competitiveness through smaller chipset sizes compared to competitors.**CostCompetitiveness**:Designtechnologyensuringcostcompetitivenessthroughsmallerchipsetsizescomparedtocompetitors.
**First Domestic XGSPON SoC Development and Commercialization**: A pioneering position, being the first in Korea to develop and successfully commercialize XGSPON SoC, a next-generation optical communication standard technology.**FirstDomesticXGSPONSoCDevelopmentandCommercialization**:Apioneeringposition,beingthefirstinKoreatodevelopandsuccessfullycommercializeXGSPONSoC,anext-generationopticalcommunicationstandardtechnology.
**Global Communication Equipment Market Entry and Diversification of Vendors**: Ability to meet the demand for vendor diversification from communication equipment companies seeking non-US chips in the 10Gbps PON market, which is largely monopolized by a few US companies like Intel and Broadcom.**GlobalCommunicationEquipmentMarketEntryandDiversificationofVendors**:Abilitytomeetthedemandforvendordiversificationfromcommunicationequipmentcompaniesseekingnon-USchipsinthe10GbpsPONmarket,whichislargelymonopolizedbyafewUScompanieslikeIntelandBroadcom.
**Future Communication and Convergence Industry Scalability**: Strategic expansion into next-generation IT industries through the advanced development of 25Gbps and 100Gbps PON chips, participation in 6G technology standards, and the development of mobility network processors and neuromorphic semiconductors.**FutureCommunicationandConvergenceIndustryScalability**:Strategicexpansionintonext-generationITindustriesthroughtheadvanceddevelopmentof25Gbpsand100GbpsPONchips,participationin6Gtechnologystandards,andthedevelopmentofmobilitynetworkprocessorsandneuromorphicsemiconductors.
**Extensive Patent and Certification-Based Technology**: Possession of 73 registered patents and 3 applied patents (as of 2022, later 80 registered and 3 applied), along with numerous international certifications including ISO9001, TL9000, MET, CB, and ISO14001.**ExtensivePatentandCertification-BasedTechnology**:Possessionof73registeredpatentsand3appliedpatents(asof2022,later80registeredand3applied),alongwithnumerousinternationalcertificationsincludingISO9001,TL9000,MET,CB,andISO14001.
Target IndustrieTargetIndustrie
Telecommunications (5G/6G Mobile Backhaul, FTTH, FTTx, PON Solutions)Telecommunications(5G/6GMobileBackhaul,FTTH,FTTx,PONSolutions)
Internet of Things (IoT)InternetofThings(IoT)
Vehicle IT (Autonomous Driving, Mobility Network Processors)VehicleIT(AutonomousDriving,MobilityNetworkProcessors)
ISO14001 Environmental Management International Standard Certification (2021.01.18)ISO14001EnvironmentalManagementInternationalStandardCertification(2021.01.18)
13 types of overseas certifications including CE, FCC, FDA.13typesofoverseascertificationsincludingCE,FCC,FDA.
Awarded Best FMC (Fixed Mobile Convergence) Solution at the Broadband World Forum (BBWF) in 2020.AwardedBestFMC(FixedMobileConvergence)SolutionattheBroadbandWorldForum(BBWF)in2020.
Awarded Korea Technology Grand Prize in 2021.AwardedKoreaTechnologyGrandPrizein2021.
Awarded Radio and Broadcasting Technology Grand Prize in 2021.AwardedRadioandBroadcastingTechnologyGrandPrizein2021.
Prime Minister's Commendation for Contributions to Semiconductor Industry Development in 2024 (CEO Baek Jun-hyun).PrimeMinister'sCommendationforContributionstoSemiconductorIndustryDevelopmentin2024(CEOBaekJun-hyun).
Designated as an Excellent Technology Research Center (ATC) by the Ministry of Trade, Industry and Energy in 2017.DesignatedasanExcellentTechnologyResearchCenter(ATC)bytheMinistryofTrade,IndustryandEnergyin2017.
Recognized as a Corporate R&D Center by the Korea Industrial Technology Association (KOITA) under the Ministry of Science and ICT.RecognizedasaCorporateR&DCenterbytheKoreaIndustrialTechnologyAssociation(KOITA)undertheMinistryofScienceandICT.
Introduction
Location
41 Seongnam-daero 925beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea
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Information
41 Seongnam-daero 925beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, South Korea