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Semi COG Bonder (24")
Model Name
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Series
Large Machine
Data
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Manufacturer information
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Yujin DiscomLCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
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Manufacturer
Yujin Discom
Brand
-
SKU
32873
Product Name
Semi COG Bonder (24")
Model Name
-
Size
-
Weight
-
Product Details

본 설비는 LCD GLASS 위에 IC Chip을 부착하는 설비이다. IC Chip은 Robot에 의해 Tray에서 자동 공급되며 LCD GLASS Loading Unloading을 수동으로 하면 Alignment에서 IC Chip Bonding까지 자동으로 작업한다. 

 

SPECIFICATIONS

EQUIP. DIMENSION

1160(L)mm×840(W)mm×1690(H)mm

WEIGHT

500Kg

IC CHIP SIZE

4~23mm(L), 1.0~5mm(W)

GLASS SIZE

1.0” ~ 7.0”

PATTERN PITCH

38 ㎛ (25㎛ 2열 배열시)

BONDING ACCURACY

±5 ~ 6 ㎛

TACKTIME(1 IC BONDING)

9~12sec

AILGNMENT

Vision System (Auto Alignment)

BONDING HEAD 수량

2 Head

UTILITY

MAIN POWER:220V±10%, 2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose

Yujin DiscomLCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
Our company established at 1993.5 by the name of Yu-Jin Synthetic machinery. Since then, we have developed and invested in technology to lead Korean LCD manufacturing field. We have already sold and export our machines to SAMSUNG SDI, HYUNDAI, LG and many other company. Now, we will satisfy you with our creative technology from last 10 years know-how. For the best performance and for the highest productivity we make every effort from design to deliver. Yu-Jin DISCOM will be with you and Yu-Jin can manufacture the machine that exactly what you need. Research and development of the value for Human, Technology, Environment is the spirit of Yu-Jin DISCOM.
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