Information
174-12 Yuseori-gil, Seonnam-myeon, Seongju, Gyeongsangbuk-do, South Korea
+82 54-931-8521
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Overview
- Summary
- YCCHEM Co., Ltd. is a specialized company established in 2001, focusing on the development and production of chemical materials for the semiconductor, display, and eco-friendly energy industries. The company supplies a wide range of advanced electronic materials, including PHOTORESIST, HT-SOC, SLURRY, RINSING SOLUTION, ETCHANT, and STRIPPER, to global enterprises. It is actively engaged in developing core materials for next-generation semiconductor processes, particularly in EUV and glass substrate technologies, through continuous R&D and strategic investments for technological localization and global market expansion.YCCHEM Co., Ltd. is a specialized company established in 2001, focusing on the development and production of chemical materials for the semiconductor, display, and eco-friendly energy industries. The company supplies a wide range of advanced electronic materials, including PHOTORESIST, HT-SOC, SLURRY, RINSING SOLUTION, ETCHANT, and STRIPPER, to global enterprises. It is actively engaged in developing core materials for next-generation semiconductor processes, particularly in EUV and glass substrate technologies, through continuous R&D and strategic investments for technological localization and global market expansion.
- Key Products/Technologies
- **Semiconductor Process Materials**: KrF photoresists (0.30um to 12.0um film thickness, 248nm wavelength, positive and negative types), i-Line photoresists (0.1um to 6.0um film thickness, 365nm wavelength, positive and negative types), Bump photoresists (for wafer-level packaging), BARC (Bottom Anti Reflective Coating), SOC (Spin On Carbon), CMP slurries (for wafer surface cleaning and anti-corrosion control), Thinner, Rinsing Solution (pattern collapse prevention solutions for ArF, KrF, and EUV processes), Etchant, Stripper, Developer (for EUV processes, improving photomask developing capability and profile, preventing capacitor collapse), Glue Cleaner (for HBM3 processes, managing metallic impurities below 1ppt and controlling particle contamination).**Semiconductor Process Materials**: KrF photoresists (0.30um to 12.0um film thickness, 248nm wavelength, positive and negative types), i-Line photoresists (0.1um to 6.0um film thickness, 365nm wavelength, positive and negative types), Bump photoresists (for wafer-level packaging), BARC (Bottom Anti Reflective Coating), SOC (Spin On Carbon), CMP slurries (for wafer surface cleaning and anti-corrosion control), Thinner, Rinsing Solution (pattern collapse prevention solutions for ArF, KrF, and EUV processes), Etchant, Stripper, Developer (for EUV processes, improving photomask developing capability and profile, preventing capacitor collapse), Glue Cleaner (for HBM3 processes, managing metallic impurities below 1ppt and controlling particle contamination).
- **Display Materials**: Photoresist, UV implant resin, stripper, promoter, etchant, developer, and other materials for LCD, LED, and OLED applications.**Display Materials**: Photoresist, UV implant resin, stripper, promoter, etchant, developer, and other materials for LCD, LED, and OLED applications.
- **Eco-friendly Energy Materials**: Solar cell process materials (water-soluble cooling oil for cutting, dispersion additive for SiC, detergent, water-soluble cutting oil), PU systems (soft, semi-hard, and hard), and PU resins.**Eco-friendly Energy Materials**: Solar cell process materials (water-soluble cooling oil for cutting, dispersion additive for SiC, detergent, water-soluble cutting oil), PU systems (soft, semi-hard, and hard), and PU resins.
- **Next-generation Technologies**: Development and mass production of materials for EUV lithography processes, including photoresists and rinses, as well as photoresists, coatings, developers, and strippers for glass substrates, targeting HBM and advanced packaging processes.**Next-generation Technologies**: Development and mass production of materials for EUV lithography processes, including photoresists and rinses, as well as photoresists, coatings, developers, and strippers for glass substrates, targeting HBM and advanced packaging processes.
- Core Advantages
- **Advanced Technology Development and Localization Capabilities**: Successful development and mass production of ArF, KrF, and EUV photo process rinses, with EUV rinse being adopted by major domestic memory customers, demonstrating recognized technological prowess. Pioneering development and commercialization of core materials like photoresists, coatings, developers, and strippers for glass substrates in Korea.**Advanced Technology Development and Localization Capabilities**: Successful development and mass production of ArF, KrF, and EUV photo process rinses, with EUV rinse being adopted by major domestic memory customers, demonstrating recognized technological prowess. Pioneering development and commercialization of core materials like photoresists, coatings, developers, and strippers for glass substrates in Korea.
- **Customer-Specific Precision Chemical Material Development**: Expertise in precise design and customized material development tailored to specific process requirements of customers. A 'tailor-then-scale' approach with a small-volume, multi-product manufacturing model, enabling quick response to customer needs and continuous product performance upgrades.**Customer-Specific Precision Chemical Material Development**: Expertise in precise design and customized material development tailored to specific process requirements of customers. A 'tailor-then-scale' approach with a small-volume, multi-product manufacturing model, enabling quick response to customer needs and continuous product performance upgrades.
- **Rigorous Quality Management System**: Operation of an in-house 'mini-fab' capable of replicating and evaluating full lithography and etch sequences. Manufacturing processes managed in cleanroom environments comparable to device fabs, controlling metallic impurities to sub-parts-per-trillion levels and particle contamination to extremely low concentrations.**Rigorous Quality Management System**: Operation of an in-house 'mini-fab' capable of replicating and evaluating full lithography and etch sequences. Manufacturing processes managed in cleanroom environments comparable to device fabs, controlling metallic impurities to sub-parts-per-trillion levels and particle contamination to extremely low concentrations.
- **Strategic R&D Investment and Portfolio Expansion**: Expansion of portfolio into high-growth areas such as HBM, glass substrates, EUV rinses, and Poly-Si slurries. Focused development of new materials to meet the surging demand for fine processes driven by the proliferation of AI semiconductors and High Bandwidth Memory (HBM).**Strategic R&D Investment and Portfolio Expansion**: Expansion of portfolio into high-growth areas such as HBM, glass substrates, EUV rinses, and Poly-Si slurries. Focused development of new materials to meet the surging demand for fine processes driven by the proliferation of AI semiconductors and High Bandwidth Memory (HBM).
- **Global Market Expansion and Collaboration with Major Clients**: Leveraging stable supply to major domestic memory manufacturers as a foundation for expanding into non-memory and global customer segments. Collaboration with leading Korean companies like SK Hynix and Samsung Electronics to validate world-class technological capabilities and establish a foothold for international market entry.**Global Market Expansion and Collaboration with Major Clients**: Leveraging stable supply to major domestic memory manufacturers as a foundation for expanding into non-memory and global customer segments. Collaboration with leading Korean companies like SK Hynix and Samsung Electronics to validate world-class technological capabilities and establish a foothold for international market entry.
- Target Industrie
- Semiconductor Industry (memory, non-memory, advanced packaging, HBM, EUV lithography, glass substrate processes)Semiconductor Industry (memory, non-memory, advanced packaging, HBM, EUV lithography, glass substrate processes)
- Display Industry (LCD, LED, OLED)Display Industry (LCD, LED, OLED)
- Eco-friendly Energy Industry (solar cells)Eco-friendly Energy Industry (solar cells)
- Major Markets
- South AfricaSouth Africa
- South Korea (primary market), China, Taiwan, Singapore, Southeast Asia, JapanSouth Korea (primary market), China, Taiwan, Singapore, Southeast Asia, Japan
- EuropeEurope
- USAUSA
- AustraliaAustralia
- Certifications/Patents
- Over 20 domestic and international patents related to ArF and KrF photo process rinses.Over 20 domestic and international patents related to ArF and KrF photo process rinses.
- A total of 164 patent documents (including applications and grants) and 90 patent families, with 26 granted patents.A total of 164 patent documents (including applications and grants) and 90 patent families, with 26 granted patents.
- ISO certification (related to Yuncheng Chemical Industrial Co., Ltd., direct certification for YCCHEM is unclear).ISO certification (related to Yuncheng Chemical Industrial Co., Ltd., direct certification for YCCHEM is unclear).
- Continuous technological innovation and talent development through its R&D center.Continuous technological innovation and talent development through its R&D center.
Introduction
Location
174-12 Yuseori-gil, Seonnam-myeon, Seongju, Gyeongsangbuk-do, South Korea
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