product Image
QFN (Quad Flat No Lead Package)
Model Name
-
Series
Package Products
View All
Data
-
Manufacturer information
provider logo
WIN PAC

Semi conductor postprocessing solution, Semi conductor, FBGA, WLP, MCP

Problem with product info?
Update request
Manufacturer
WIN PAC
Product Type
Machine
Brand
-
SKU
33535
Product Name
QFN (Quad Flat No Lead Package)
Model Name
-
Size
-
Weight
-
Product Details

Win Pac Inc. QFN (Quad Flat No Lead Package)

More products
UFD (USB Flash Drive)
UFD (USB Flash Drive)
Proximity / Ambient Light Sensor Package
Proximity / Ambient Light Sensor Package
Humidity Sensor Package
Humidity Sensor Package
QFP (Quad Flat Package)
QFP (Quad Flat Package)
POP
POP
SSD (Solid State Drive)
SSD (Solid State Drive)
Flip Chip
Flip Chip
LGA (Land Grid Array)
LGA (Land Grid Array)
FBGA (Fine Pitch Ball Grid Array)
FBGA (Fine Pitch Ball Grid Array)
WIN PAC
WIN PAC
Semi conductor postprocessing solution, Semi conductor, FBGA, WLP, MCP
Inquiry