Information
Luzenbergstraße 82, 68305 Mannheim, Germany
+49 621 745897
-
Overview
- Summary
- WELL DIAMOND WIRE SAWS is a company specializing in the development and manufacturing of diamond wire saw machines since 1974, possessing exclusive technology for high-precision cutting without deformation, heat generation, or material loss. The company provides solutions that minimize or eliminate the need for polishing by achieving clean and smooth cut surfaces on various materials. Serving over 3,000 customers worldwide, it contributes to a wide range of applications including research and development, production, quality control, and material analysis.WELL DIAMOND WIRE SAWS is a company specializing in the development and manufacturing of diamond wire saw machines since 1974, possessing exclusive technology for high-precision cutting without deformation, heat generation, or material loss. The company provides solutions that minimize or eliminate the need for polishing by achieving clean and smooth cut surfaces on various materials. Serving over 3,000 customers worldwide, it contributes to a wide range of applications including research and development, production, quality control, and material analysis.
- Key Products/Technologies
- 3000 Series (Models 3100, 3400, 3500 'Base', 'Premium', 'NC'): Precision diamond wire saws suitable for small samples (up to 50x50mm), primarily used in laboratories. Features include variable wire speed control, automatic shutdown upon wire breakage, 60mm linear feed, sample height adjustment, automatic stop at cut completion, and compatibility with cutting fluid. The Model 3032-4, a precision horizontal saw, allows the use of thin wires (down to 0.08mm) and includes a microscope for accurate sample positioning.3000 Series (Models 3100, 3400, 3500 'Base', 'Premium', 'NC'): Precision diamond wire saws suitable for small samples (up to 50x50mm), primarily used in laboratories. Features include variable wire speed control, automatic shutdown upon wire breakage, 60mm linear feed, sample height adjustment, automatic stop at cut completion, and compatibility with cutting fluid. The Model 3032-4, a precision horizontal saw, allows the use of thin wires (down to 0.08mm) and includes a microscope for accurate sample positioning.
- 4000 Series (Model 4500): The most versatile benchtop diamond wire saw, recommended for samples up to 150x150mm and material lengths up to 400mm. It offers configurable cutting parameters such as wire tension, wire speed, and feed power, supporting continuous wire speeds from 0 to 2.5 m/s and wire diameters from 0.13 to 0.50mm. Maximum cutting depth and height of 150mm are among its specifications.4000 Series (Model 4500): The most versatile benchtop diamond wire saw, recommended for samples up to 150x150mm and material lengths up to 400mm. It offers configurable cutting parameters such as wire tension, wire speed, and feed power, supporting continuous wire speeds from 0 to 2.5 m/s and wire diameters from 0.13 to 0.50mm. Maximum cutting depth and height of 150mm are among its specifications.
- 6000 Series (Model 6500): A versatile diamond wire saw meeting both laboratory and industrial requirements, capable of cutting pieces up to 300x300mm. It features gravity feed adjustable from 100-1500g, supports wire diameters from 0.12-0.50mm, wire lengths of 30m, and wire speeds from 0-2.5m/s, with a maximum sample weight of 15kg. Unlimited sample length is possible with proper support.6000 Series (Model 6500): A versatile diamond wire saw meeting both laboratory and industrial requirements, capable of cutting pieces up to 300x300mm. It features gravity feed adjustable from 100-1500g, supports wire diameters from 0.12-0.50mm, wire lengths of 30m, and wire speeds from 0-2.5m/s, with a maximum sample weight of 15kg. Unlimited sample length is possible with proper support.
- 7000 Series (Model 7500): Ideal for fragile and large samples (ranging from 300mm to 2000mm in diameter or side length). Capable of cutting all materials including ceramic, optical glass, silicon, metals, and composites. It achieves flat surfaces, thin slices, and very clean cuts with an almost intact surface, utilizing a slow wire speed (max 2.5 m/s) to prevent micro-cracks and heat generation.7000 Series (Model 7500): Ideal for fragile and large samples (ranging from 300mm to 2000mm in diameter or side length). Capable of cutting all materials including ceramic, optical glass, silicon, metals, and composites. It achieves flat surfaces, thin slices, and very clean cuts with an almost intact surface, utilizing a slow wire speed (max 2.5 m/s) to prevent micro-cracks and heat generation.
- MURG Model: A benchtop diamond wire saw with an endless wire, recommended for manual cutting of hard samples at high wire speeds for thicknesses up to 80mm.MURG Model: A benchtop diamond wire saw with an endless wire, recommended for manual cutting of hard samples at high wire speeds for thicknesses up to 80mm.
- Core Technology: Patented diamond embedding process for stainless steel wire with synthetic diamonds, ensuring maximum cutting capability and extended wire life. Utilizes a precision reciprocating motor and a gravity/weight system for consistent feed rates, along with a variable wire speed adjustment system. Applies minimal pressure to the material to be cut, preventing heat generation, and offers a range of wire diameters from 0.06mm to 0.70mm.Core Technology: Patented diamond embedding process for stainless steel wire with synthetic diamonds, ensuring maximum cutting capability and extended wire life. Utilizes a precision reciprocating motor and a gravity/weight system for consistent feed rates, along with a variable wire speed adjustment system. Applies minimal pressure to the material to be cut, preventing heat generation, and offers a range of wire diameters from 0.06mm to 0.70mm.
- Core Advantages
- Ultra-precision and Non-damaging Cutting Technology: Unique technological capability to prevent material deformation, heat generation, and micro-cracks during cutting, delivering clean and smooth cut surfaces. This often minimizes or eliminates the need for further polishing, enhancing efficiency.Ultra-precision and Non-damaging Cutting Technology: Unique technological capability to prevent material deformation, heat generation, and micro-cracks during cutting, delivering clean and smooth cut surfaces. This often minimizes or eliminates the need for further polishing, enhancing efficiency.
- Versatile Material Cutting Capability: Flexibility to cut a wide range of materials, from the softest to the hardest, including ceramics, optical glass, silicon, metals, composites, stone, and concrete. Applicability to both homogeneous and non-homogeneous materials.Versatile Material Cutting Capability: Flexibility to cut a wide range of materials, from the softest to the hardest, including ceramics, optical glass, silicon, metals, composites, stone, and concrete. Applicability to both homogeneous and non-homogeneous materials.
- Patented Technology and Exclusive Wire: Patented coating process for stainless steel wire with crimped synthetic diamonds, ensuring superior cutting performance and long wire durability. The company claims to be the only one in the market offering a wire that produces such a pure cut. Patented technology optimizing the correlation between wire, nickel electrodeposited layer, and diamond particles (WO2011055903A2).Patented Technology and Exclusive Wire: Patented coating process for stainless steel wire with crimped synthetic diamonds, ensuring superior cutting performance and long wire durability. The company claims to be the only one in the market offering a wire that produces such a pure cut. Patented technology optimizing the correlation between wire, nickel electrodeposited layer, and diamond particles (WO2011055903A2).
- Global Customer Base and Long History: Nearly 50 years of experience in developing diamond cutting machines since 1974. Earned the trust of over 3,000 customers worldwide, strengthening its position in the global market. Operates a global network with production and support facilities in Switzerland, Germany, and the United States.Global Customer Base and Long History: Nearly 50 years of experience in developing diamond cutting machines since 1974. Earned the trust of over 3,000 customers worldwide, strengthening its position in the global market. Operates a global network with production and support facilities in Switzerland, Germany, and the United States.
- Minimized Material Loss and High Efficiency: Utilizes thin diamond wire diameters ranging from 0.06mm to 0.70mm, minimizing kerf loss during cutting. This contributes to reduced material waste and high material yield. Achieves faster cutting speeds and lower operational costs, leading to overall productivity improvements.Minimized Material Loss and High Efficiency: Utilizes thin diamond wire diameters ranging from 0.06mm to 0.70mm, minimizing kerf loss during cutting. This contributes to reduced material waste and high material yield. Achieves faster cutting speeds and lower operational costs, leading to overall productivity improvements.
- Target Industries
- Material Research and AnalysisMaterial Research and Analysis
- Quality ControlQuality Control
- Failure AnalysisFailure Analysis
- Semiconductor Manufacturing (Silicon Wafer Slicing)Semiconductor Manufacturing (Silicon Wafer Slicing)
- Photovoltaics IndustryPhotovoltaics Industry
- Advanced Materials ProcessingAdvanced Materials Processing
- Construction (Reinforced Concrete, Bridge, Dam, Factory Floor, Jetty, Column, Beam Demolition, Structural Cutting)Construction (Reinforced Concrete, Bridge, Dam, Factory Floor, Jetty, Column, Beam Demolition, Structural Cutting)
- Mining (Marble, Granite, Limestone Extraction)Mining (Marble, Granite, Limestone Extraction)
- MetallographyMetallography
- GeologyGeology
- Archeology and PaleontologyArcheology and Paleontology
- Criminology and ForensicsCriminology and Forensics
- BiologyBiology
- PathologyPathology
- HistologyHistology
- Anatomy and DentistryAnatomy and Dentistry
- Major Markets
- China, India, JapanChina, India, Japan
- Switzerland, GermanySwitzerland, Germany
- United StatesUnited States
- Certifications/Patents
- Patented Technology: Holds patents for its diamond embedding process technology. Patent for diamond wire saw optimizing the correlation among wire, electrodeposited nickel layer, and diamond particles (WO2011055903A2).Patented Technology: Holds patents for its diamond embedding process technology. Patent for diamond wire saw optimizing the correlation among wire, electrodeposited nickel layer, and diamond particles (WO2011055903A2).
- CE Certification: WELL 3400, WELL 4500, and WELL 6500 models possess CE certification.CE Certification: WELL 3400, WELL 4500, and WELL 6500 models possess CE certification.
- Technological Competence: Provides precision without deformation, heat generation, or minimal material loss during cutting, often eliminating the need for polishing. Ensures chip evacuation pathways by forming chip pockets between diamond particles.Technological Competence: Provides precision without deformation, heat generation, or minimal material loss during cutting, often eliminating the need for polishing. Ensures chip evacuation pathways by forming chip pockets between diamond particles.
Introduction
Location
Luzenbergstraße 82, 68305 Mannheim, Germany
클릭하여 위치 살펴보기
