Information
58-47 Seoicheon-ro, Majang-myeon, Icheon, Gyeonggi-do, South Korea
+82 31-645-1100
-
-
Overview
- Summary
- VM Co., Ltd. is a specialized manufacturer of dry etchers for major semiconductor manufacturing processes, established in February 2002. The company has successfully localized and mass-produced semiconductor etching equipment, previously entirely reliant on imports, using its proprietary technology. It holds numerous intellectual property rights related to its unique plasma source and associated technologies for implementing ultra-fine complex processes. The company possesses core original technologies for 300mm wafer dry etching equipment. Recognized for its technological prowess, it serves as a key player in the domestic semiconductor equipment supply chain. [DB, 2, 4, 5, 6, 7, 11, 16, 17]VM Co., Ltd. is a specialized manufacturer of dry etchers for major semiconductor manufacturing processes, established in February 2002. The company has successfully localized and mass-produced semiconductor etching equipment, previously entirely reliant on imports, using its proprietary technology. It holds numerous intellectual property rights related to its unique plasma source and associated technologies for implementing ultra-fine complex processes. The company possesses core original technologies for 300mm wafer dry etching equipment. Recognized for its technological prowess, it serves as a key player in the domestic semiconductor equipment supply chain. [DB, 2, 4, 5, 6, 7, 11, 16, 17]
- Key Products/Technologies
- Poly Etcher System (Conductor Etcher System): Polysilicon etching equipment for 300mm wafers, capable of etching sub-20nm poly-related processes including STI, DPT, and Gate. Key models include Leo-NK I-C and Leo WH. [1, 5, 7, 8, 11, 14, 16, 26, 30]Poly Etcher System (Conductor Etcher System): Polysilicon etching equipment for 300mm wafers, capable of etching sub-20nm poly-related processes including STI, DPT, and Gate. Key models include Leo-NK I-C and Leo WH. [1, 5, 7, 8, 11, 14, 16, 26, 30]
- Metal Etcher System: Metal film etching equipment for 300mm wafers, with the Nardo-M model applicable to Al and W etching processes in DRAM and Flash applications. [5, 7, 8, 11, 14, 16, 26, 30]Metal Etcher System: Metal film etching equipment for 300mm wafers, with the Nardo-M model applicable to Al and W etching processes in DRAM and Flash applications. [5, 7, 8, 11, 14, 16, 26, 30]
- Oxide Etcher System (Dielectric Etcher System): Etching equipment for oxide layers on semiconductor wafers, utilizing a proprietary ACP source that combines ICP and CCP plasma characteristics, optimized for dielectric material etching. The Oxide Etcher is currently undergoing internal evaluation, with preparations for customer wafer demonstrations. [1, 5, 7, 14, 16, 22, 23, 26, 30]Oxide Etcher System (Dielectric Etcher System): Etching equipment for oxide layers on semiconductor wafers, utilizing a proprietary ACP source that combines ICP and CCP plasma characteristics, optimized for dielectric material etching. The Oxide Etcher is currently undergoing internal evaluation, with preparations for customer wafer demonstrations. [1, 5, 7, 14, 16, 22, 23, 26, 30]
- Plasma Original Technology: Possession of multiple intellectual property rights for proprietary plasma sources and related technologies. This technology serves as a core original technology for 300mm wafer dry etching equipment and is applicable to various plasma process equipment, including Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Atomic Layer Etching (ALE) systems. [DB, 2, 4, 5, 6, 11, 26]Plasma Original Technology: Possession of multiple intellectual property rights for proprietary plasma sources and related technologies. This technology serves as a core original technology for 300mm wafer dry etching equipment and is applicable to various plasma process equipment, including Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Atomic Layer Etching (ALE) systems. [DB, 2, 4, 5, 6, 11, 26]
- Equipment Under Development: Commencement of development for next-generation Atomic Layer Etching (ALE) equipment, targeting completion by 2026. [5, 7, 11, 18, 30]Equipment Under Development: Commencement of development for next-generation Atomic Layer Etching (ALE) equipment, targeting completion by 2026. [5, 7, 11, 18, 30]
- Other Products: A diverse portfolio of plasma-related equipment, including LED Etcher, TSV Etcher, Plasma Doping System (APIS), and Plasma Sawing System. [14, 26, 29]Other Products: A diverse portfolio of plasma-related equipment, including LED Etcher, TSV Etcher, Plasma Doping System (APIS), and Plasma Sawing System. [14, 26, 29]
- Core Advantages
- As the sole listed company specializing in etching equipment in Korea, the company benefits from high entry barriers due to patents and a dominant position in the domestic market. [23, 31]As the sole listed company specializing in etching equipment in Korea, the company benefits from high entry barriers due to patents and a dominant position in the domestic market. [23, 31]
- Superior technological competitiveness derived from securing proprietary plasma source original technologies and intellectual property rights. [DB, 2, 4, 5, 6, 11]Superior technological competitiveness derived from securing proprietary plasma source original technologies and intellectual property rights. [DB, 2, 4, 5, 6, 11]
- Successful localization of semiconductor etching equipment, previously entirely imported, through proprietary technology, offering performance and and price competitiveness to replace foreign-made equipment. [DB, 2, 4, 5, 6, 17]Successful localization of semiconductor etching equipment, previously entirely imported, through proprietary technology, offering performance and and price competitiveness to replace foreign-made equipment. [DB, 2, 4, 5, 6, 17]
- A stable revenue base established through close cooperation with major clients, including SK Hynix, and the supply of etching equipment for HBM-related production processes. [1, 5, 6, 8, 9, 10, 11, 17, 20, 23, 31, 32, 35]A stable revenue base established through close cooperation with major clients, including SK Hynix, and the supply of etching equipment for HBM-related production processes. [1, 5, 6, 8, 9, 10, 11, 17, 20, 23, 31, 32, 35]
- Continuous investment in research and development and expansion of its product portfolio, including the development of Oxide Etcher in addition to Poly and Metal Etchers, and the initiation of next-generation Atomic Layer Etching (ALE) equipment development. [1, 5, 7, 11, 16, 18, 23, 26, 30]Continuous investment in research and development and expansion of its product portfolio, including the development of Oxide Etcher in addition to Poly and Metal Etchers, and the initiation of next-generation Atomic Layer Etching (ALE) equipment development. [1, 5, 7, 11, 16, 18, 23, 26, 30]
- Plans for constructing a new headquarters and fab in the Yongin Semiconductor Cluster, aiming for production capacity expansion and a long-term revenue target of 1 trillion KRW. [1, 11, 23]Plans for constructing a new headquarters and fab in the Yongin Semiconductor Cluster, aiming for production capacity expansion and a long-term revenue target of 1 trillion KRW. [1, 11, 23]
- Target Industrie
- Semiconductor Manufacturing Industry: Supplying core equipment, particularly for front-end semiconductor processes. [DB, 2, 4, 5, 6, 7, 8, 11, 14, 16, 17, 18, 23, 26, 30, 31, 32, 33]Semiconductor Manufacturing Industry: Supplying core equipment, particularly for front-end semiconductor processes. [DB, 2, 4, 5, 6, 7, 8, 11, 14, 16, 17, 18, 23, 26, 30, 31, 32, 33]
- Memory Semiconductor Production: Application of etching equipment in DRAM and NAND flash memory production processes. [1, 26]Memory Semiconductor Production: Application of etching equipment in DRAM and NAND flash memory production processes. [1, 26]
- High Bandwidth Memory (HBM) Production: Utilization of etching equipment in SK Hynix's HBM-related production processes. [5, 10, 11, 23]High Bandwidth Memory (HBM) Production: Utilization of etching equipment in SK Hynix's HBM-related production processes. [5, 10, 11, 23]
- Plasma Process Equipment Sector: Applicability of its technology to various plasma process equipment, including Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Atomic Layer Etching (ALE) systems. [2, 4, 11]Plasma Process Equipment Sector: Applicability of its technology to various plasma process equipment, including Chemical Vapor Deposition (CVD), Atomic Layer Deposition (ALD), and Atomic Layer Etching (ALE) systems. [2, 4, 11]
- LED Manufacturing Industry: Contribution to LED manufacturing processes through its LED Etcher products. [14, 26, 29]LED Manufacturing Industry: Contribution to LED manufacturing processes through its LED Etcher products. [14, 26, 29]
- Major Markets
- South Korea, ChinaSouth Korea, China
- Certifications/Patents
- Possession of numerous intellectual property rights related to plasma source and associated technologies. [DB, 5, 6]Possession of numerous intellectual property rights related to plasma source and associated technologies. [DB, 5, 6]
- Multiple patent registrations, including on November 24, 2025, June 24, 2025, April 14, 2025, and July 30, 2024. [33]Multiple patent registrations, including on November 24, 2025, June 24, 2025, April 14, 2025, and July 30, 2024. [33]
- Listed on the KOSDAQ market in 2018. [3, 11]Listed on the KOSDAQ market in 2018. [3, 11]
- Recipient of the Best 4th Industrial Innovation Company Award at the 13th KOSDAQ Awards. [6, 29]Recipient of the Best 4th Industrial Innovation Company Award at the 13th KOSDAQ Awards. [6, 29]
- Acquisition of ISO 45001 certification. [29]Acquisition of ISO 45001 certification. [29]
- Recipient of the Prime Minister's Award at the 9th Semiconductor Technology Award. [29]Recipient of the Prime Minister's Award at the 9th Semiconductor Technology Award. [29]
- Selected as one of Korea's Top 10 New Technologies in 2005 for its 'ACP Source for Semiconductor Wafer Etching'. [24]Selected as one of Korea's Top 10 New Technologies in 2005 for its 'ACP Source for Semiconductor Wafer Etching'. [24]
- Designation as a venture for new technology and establishment of an affiliated research institute. [29]Designation as a venture for new technology and establishment of an affiliated research institute. [29]
Introduction
Location
58-47 Seoicheon-ro, Majang-myeon, Icheon, Gyeonggi-do, South Korea
클릭하여 위치 살펴보기
