Viatron Technologies, The Republic of Korea - Komachine Supplier Profile and Product List

- Viatron Technologies is an industrial equipment manufacturer specializing in semiconductor, solar cell, display, and LCD process equipment and components. The company focuses on providing core solutions for display and semiconductor manufacturing, leveraging its advanced heat treatment equipment technology. It is particularly recognized for its world-class technology in LTPS LCD and AMOLED heat treatment equipment. With a founding philosophy of 'value creation through technology,' the company is dedicated to offering optimized technology, superior products, and differentiated services to its customers.Viatron Technologies is an industrial equipment manufacturer specializing in semiconductor, solar cell, display, and LCD process equipment and components. The company focuses on providing core solutions for display and semiconductor manufacturing, leveraging its advanced heat treatment equipment technology. It is particularly recognized for its world-class technology in LTPS LCD and AMOLED heat treatment equipment. With a founding philosophy of 'value creation through technology,' the company is dedicated to offering optimized technology, superior products, and differentiated services to its customers.
- Inline RTA: Horizontal rapid thermal annealing equipment for high temperatures, with a temperature range of 0-800℃, utilized in crystallization, activation, pre-compaction, and dehydrogenation processes for LTPS LCDs.Inline RTA: Horizontal rapid thermal annealing equipment for high temperatures, with a temperature range of 0-800℃, utilized in crystallization, activation, pre-compaction, and dehydrogenation processes for LTPS LCDs.
- Batch Furnace: Vertical batch low-temperature heat treatment equipment, with a temperature range of 0-450℃, capable of simultaneously processing over 15 TFTs and used in Oxide TFT manufacturing.Batch Furnace: Vertical batch low-temperature heat treatment equipment, with a temperature range of 0-450℃, capable of simultaneously processing over 15 TFTs and used in Oxide TFT manufacturing.
- Pre-compaction RTA: Equipment incorporating technology for controlling scratches, particles, warpage, and shrinkage of 6th/8th generation glass substrates.Pre-compaction RTA: Equipment incorporating technology for controlling scratches, particles, warpage, and shrinkage of 6th/8th generation glass substrates.
- De-hydrogenation RTA/Furnace: Equipment performing dehydrogenation processes within a temperature range of 350-500℃.De-hydrogenation RTA/Furnace: Equipment performing dehydrogenation processes within a temperature range of 350-500℃.
- Crystallization RTA: Equipment performing crystallization processes within a temperature range of 650-780℃.Crystallization RTA: Equipment performing crystallization processes within a temperature range of 650-780℃.
- Activation RTA: Equipment performing activation processes within a temperature range of 550-650℃.Activation RTA: Equipment performing activation processes within a temperature range of 550-650℃.
- Flexible Activation Furnace: Equipment used for the activation process of flexible display substrates.Flexible Activation Furnace: Equipment used for the activation process of flexible display substrates.
- Hydrogenation Furnace: Equipment performing hydrogenation processes within a temperature range of 350-450℃.Hydrogenation Furnace: Equipment performing hydrogenation processes within a temperature range of 350-450℃.
- IGZO Annealing System: System used for the heat treatment process of IGZO (Indium Gallium Zinc Oxide) based display panels.IGZO Annealing System: System used for the heat treatment process of IGZO (Indium Gallium Zinc Oxide) based display panels.
- POLED Polyimide Curing System: Equipment for high-temperature curing of polyimide (PI) films, essential for flexible display manufacturing.POLED Polyimide Curing System: Equipment for high-temperature curing of polyimide (PI) films, essential for flexible display manufacturing.
- Rapid Thermal Chemical Vapor Deposition (RT-CVD) Equipment for 5nm and below next-generation semiconductor processes: Laser-based Si-SiGe stacked EPI-CVD system for large-area simultaneous heating, utilized in 3D DRAM and AI accelerator manufacturing.Rapid Thermal Chemical Vapor Deposition (RT-CVD) Equipment for 5nm and below next-generation semiconductor processes: Laser-based Si-SiGe stacked EPI-CVD system for large-area simultaneous heating, utilized in 3D DRAM and AI accelerator manufacturing.
- Advanced Packaging Laser Assisted Bonder (LAB): Reflow and soldering bonding using VCSEL lasers, supporting large-area soldering bonding methods, contributing to solving warpage and thermal defects in advanced semiconductor packaging.Advanced Packaging Laser Assisted Bonder (LAB): Reflow and soldering bonding using VCSEL lasers, supporting large-area soldering bonding methods, contributing to solving warpage and thermal defects in advanced semiconductor packaging.
- Hybrid Bonder: Equipment incorporating direct bonding of chips and wafers and precise alignment of Cu pads, used for attaching wafers and heterogeneous chip dies.Hybrid Bonder: Equipment incorporating direct bonding of chips and wafers and precise alignment of Cu pads, used for attaching wafers and heterogeneous chip dies.
- ABF Film Laminator: ABF (Ajinomoto Build-up Film) film laminating equipment for semiconductor packaging, successfully localized from previously Japanese-dominated equipment.ABF Film Laminator: ABF (Ajinomoto Build-up Film) film laminating equipment for semiconductor packaging, successfully localized from previously Japanese-dominated equipment.
- NCF (Non-Conductive Film) Process Lamination Equipment: Servo-motor based pressure control equipment utilized in HBM manufacturing processes.NCF (Non-Conductive Film) Process Lamination Equipment: Servo-motor based pressure control equipment utilized in HBM manufacturing processes.
- Wafer Vacuum Laminator (WVL-300): Capable of processing Φ300mm/Φ400mm wafers, with a maximum pressure of 0.32Mpa, maximum temperature of 120±3℃, and vacuum degree below 0.3 Torr.Wafer Vacuum Laminator (WVL-300): Capable of processing Φ300mm/Φ400mm wafers, with a maximum pressure of 0.32Mpa, maximum temperature of 120±3℃, and vacuum degree below 0.3 Torr.
- FCBGA/Glass Substrate Vacuum Laminator (TITAN Series): Featuring a 650x650mm plate, maximum pressure of 50 tons, maximum temperature of 180±3℃, and vacuum degree of 0.16 Torr.FCBGA/Glass Substrate Vacuum Laminator (TITAN Series): Featuring a 650x650mm plate, maximum pressure of 50 tons, maximum temperature of 180±3℃, and vacuum degree of 0.16 Torr.
- Unique high-temperature precision control technology: Capability to provide precise temperature control and uniform heat distribution, significantly improving the quality and yield of OLED panels, especially maintaining consistent quality on large substrates.Unique high-temperature precision control technology: Capability to provide precise temperature control and uniform heat distribution, significantly improving the quality and yield of OLED panels, especially maintaining consistent quality on large substrates.
- Global market dominance: Over 70% market share in the display heat treatment equipment sector, with 100% global market share for inline RTA equipment, establishing itself as a market leader.Global market dominance: Over 70% market share in the display heat treatment equipment sector, with 100% global market share for inline RTA equipment, establishing itself as a market leader.
- Diversification and innovation of technology portfolio: Successful expansion of business areas from a leader in display heat treatment equipment to the market for 5nm and below next-generation semiconductor front-end and advanced packaging back-end equipment.Diversification and innovation of technology portfolio: Successful expansion of business areas from a leader in display heat treatment equipment to the market for 5nm and below next-generation semiconductor front-end and advanced packaging back-end equipment.
- Customer-centric co-development and process innovation: An innovative, proactive approach that goes beyond simply selling equipment, proposing new processes and collaborating closely with customers to improve productivity.Customer-centric co-development and process innovation: An innovative, proactive approach that goes beyond simply selling equipment, proposing new processes and collaborating closely with customers to improve productivity.
- Leading large-area glass substrate processing technology: Completion of development for 6th/8th generation glass substrate pre-compaction and multi-slot batch type furnaces, securing ultra-precision temperature control and substrate deformation control technology for large areas.Leading large-area glass substrate processing technology: Completion of development for 6th/8th generation glass substrate pre-compaction and multi-slot batch type furnaces, securing ultra-precision temperature control and substrate deformation control technology for large areas.
- Contribution to localization and technological self-reliance: Successful localization of ABF film laminators, previously monopolized by Japanese companies, contributing to the technological independence of the Korean semiconductor industry.Contribution to localization and technological self-reliance: Successful localization of ABF film laminators, previously monopolized by Japanese companies, contributing to the technological independence of the Korean semiconductor industry.
- AI-based control technology: Application of deep learning algorithms to optimize heat treatment equipment requiring hundreds of heaters, reducing process variations.AI-based control technology: Application of deep learning algorithms to optimize heat treatment equipment requiring hundreds of heaters, reducing process variations.
- Display Industry: AMOLED, LTPS LCD, Flexible Display, OLED backplane (TFT), Micro LED panel manufacturing.Display Industry: AMOLED, LTPS LCD, Flexible Display, OLED backplane (TFT), Micro LED panel manufacturing.
- Semiconductor Industry: 3D DRAM, AI accelerators, 5nm and below next-generation semiconductor processes, semiconductor packaging (back-end process), HBM manufacturing.Semiconductor Industry: 3D DRAM, AI accelerators, 5nm and below next-generation semiconductor processes, semiconductor packaging (back-end process), HBM manufacturing.
- Solar Cell Industry: Process equipment and component production.Solar Cell Industry: Process equipment and component production.
- South Korea, China, TaiwanSouth Korea, China, Taiwan
- EuropeEurope
- United StatesUnited States
- Possession of a total of 85 patents.Possession of a total of 85 patents.
- Selected as a World Class 300 project company in 2013.Selected as a World Class 300 project company in 2013.
- Awarded the '50 Million Dollar Export Tower' in 2016.Awarded the '50 Million Dollar Export Tower' in 2016.
- Awarded the '70 Million Dollar Export Tower' in 2018.Awarded the '70 Million Dollar Export Tower' in 2018.
- Received the Presidential Commendation on Display Day in 2021 for contributions to the display industry's development.Received the Presidential Commendation on Display Day in 2021 for contributions to the display industry's development.
- Strengthening technological competitiveness through the development of equipment based on original patented technologies and participation in national projects.Strengthening technological competitiveness through the development of equipment based on original patented technologies and participation in national projects.
- Active patenting including Semiconductor chip laser bonding device (WO-2024144347-A1), Gantry-type stage (WO-2024144150-A1), Pre-cleaning device for semiconductor substrate and pre-cleaning method using same (WO-2024117814-A1), Method for manufacturing semiconductor device by using epitaxy process, and manufacturing apparatus therefor (WO-2024005276-A1), and Apparatus for heat treating substrate capable of individually controlling output of VCSEL devices (WO-2023128606-A1).Active patenting including Semiconductor chip laser bonding device (WO-2024144347-A1), Gantry-type stage (WO-2024144150-A1), Pre-cleaning device for semiconductor substrate and pre-cleaning method using same (WO-2024117814-A1), Method for manufacturing semiconductor device by using epitaxy process, and manufacturing apparatus therefor (WO-2024005276-A1), and Apparatus for heat treating substrate capable of individually controlling output of VCSEL devices (WO-2023128606-A1).