VESTEK Inc. is a specialized company in semiconductor and automation equipment, established in 2003 [9]. The company possesses extensive practical experience and applied technologies in advanced semiconductor equipment and automation fields [9]. It aims to provide smart factory solutions [7, 8]. Its main business areas include semiconductor automation equipment development, robot application technology, precision control, and 3D mechanical design capabilities [10].VESTEKInc.isaspecializedcompanyinsemiconductorandautomationequipment,establishedin2003[9].Thecompanypossessesextensivepracticalexperienceandappliedtechnologiesinadvancedsemiconductorequipmentandautomationfields[9].Itaimstoprovidesmartfactorysolutions[7,8].Itsmainbusinessareasincludesemiconductorautomationequipmentdevelopment,robotapplicationtechnology,precisioncontrol,and3Dmechanicaldesigncapabilities[10].
Key Products/TechnologiesKeyProducts/Technologies
The semiconductor equipment product line includes a diverse range such as Auto SSD In-line Packing System (Box Type, Tray Type), Auto Tray Pre-packing System, Auto Tray Vacuum Packing System, Auto Tray Inner Box Packing System, Auto Shipping Box Packing System, Auto Reel Vacuum Packing System, Auto Reel Inner Box Packing System, Auto Reel Shipping Box Packing System, Auto Tray Feeder, and LED equipment [database, 12, 20, 33].ThesemiconductorequipmentproductlineincludesadiverserangesuchasAutoSSDIn-linePackingSystem(BoxType,TrayType),AutoTrayPre-packingSystem,AutoTrayVacuumPackingSystem,AutoTrayInnerBoxPackingSystem,AutoShippingBoxPackingSystem,AutoReelVacuumPackingSystem,AutoReelInnerBoxPackingSystem,AutoReelShippingBoxPackingSystem,AutoTrayFeeder,andLEDequipment[database,12,20,33].
The Smart Tray Packing System is an in-line facility for automatically packing finished semiconductor products loaded in trays, featuring a compact configuration that maximizes equipment efficiency through the use of multi-joint robots [28]. It applies JEDEC Tray, has a tact time of 48 seconds/Inner Box, includes a built-in Inner Box Forming System, and offers customizable sizes of 13460(w) x 5530(d) x 2500(h) [28].TheSmartTrayPackingSystemisanin-linefacilityforautomaticallypackingfinishedsemiconductorproductsloadedintrays,featuringacompactconfigurationthatmaximizesequipmentefficiencythroughtheuseofmulti-jointrobots[28].ItappliesJEDECTray,hasatacttimeof48seconds/InnerBox,includesabuilt-inInnerBoxFormingSystem,andofferscustomizablesizesof13460(w)x5530(d)x2500(h)[28].
The Smart Reel Packing System is an in-line facility for automatically packing finished semiconductor products loaded on reels, enhancing efficiency with multi-joint robot utilization and a compact design [28]. It applies Reel Ф 330, T: 12/16/24/34/44mm, has a tact time of 40 seconds/Inner Box, includes a built-in Inner Box Forming System, and offers customizable sizes of 5720(w) x 6250(d) x 2200(h) [28].TheSmartReelPackingSystemisanin-linefacilityforautomaticallypackingfinishedsemiconductorproductsloadedonreels,enhancingefficiencywithmulti-jointrobotutilizationandacompactdesign[28].ItappliesReelФ330,T:12/16/24/34/44mm,hasatacttimeof40seconds/InnerBox,includesabuilt-inInnerBoxFormingSystem,andofferscustomizablesizesof5720(w)x6250(d)x2200(h)[28].
Capabilities in logistics automation system development, including Stocker (product storage and transfer equipment), autonomous mobile robot (Mobile Robot) development, and material handling equipment utilizing AGV, LGV, and RGV technologies [5].Capabilitiesinlogisticsautomationsystemdevelopment,includingStocker(productstorageandtransferequipment),autonomousmobilerobot(MobileRobot)development,andmaterialhandlingequipmentutilizingAGV,LGV,andRGVtechnologies[5].
Robot application technologies encompass precise control of 6-axis multi-joint robots, X-Y-Z Cartesian robot motion control, precise control of autonomous mobile robots (AMR), collaborative robot, SCARA, Delta robot control, and multi-joint robot simulation technology [5, 10].Robotapplicationtechnologiesencompassprecisecontrolof6-axismulti-jointrobots,X-Y-ZCartesianrobotmotioncontrol,precisecontrolofautonomousmobilerobots(AMR),collaborativerobot,SCARA,Deltarobotcontrol,andmulti-jointrobotsimulationtechnology[5,10].
Development and manufacturing of bio and cosmetic production automation equipment, mask manufacturing automation equipment, hydrocolloid manufacturing automation equipment, pharmaceutical automatic packaging equipment, and general industrial manufacturing automation equipment within the bio/cosmetic facility sector [5, 20].Developmentandmanufacturingofbioandcosmeticproductionautomationequipment,maskmanufacturingautomationequipment,hydrocolloidmanufacturingautomationequipment,pharmaceuticalautomaticpackagingequipment,andgeneralindustrialmanufacturingautomationequipmentwithinthebio/cosmeticfacilitysector[5,20].
Precision control technology ensures PC·PLC-based automation system control, vision-based inspection and measurement technology, mobile robot, AGV, LGV control systems, and kiosk utilization capabilities [7, 10].PrecisioncontroltechnologyensuresPC·PLC-basedautomationsystemcontrol,vision-basedinspectionandmeasurementtechnology,mobilerobot,AGV,LGVcontrolsystems,andkioskutilizationcapabilities[7,10].
3D mechanical design expertise includes 3D design structure and fluid analysis using Solid Works and Edge, PDM establishment using Simulation Tools, and production optimization proposals utilizing ACS Simulation Tool [10].3Dmechanicaldesignexpertiseincludes3DdesignstructureandfluidanalysisusingSolidWorksandEdge,PDMestablishmentusingSimulationTools,andproductionoptimizationproposalsutilizingACSSimulationTool[10].
Core AdvantagesCoreAdvantages
Possession of diverse applied technologies accumulated through extensive practical experience in advanced semiconductor equipment and cutting-edge automation fields [9].Possessionofdiverseappliedtechnologiesaccumulatedthroughextensivepracticalexperienceinadvancedsemiconductorequipmentandcutting-edgeautomationfields[9].
Strong R&D capabilities stemming from the know-how of experienced researchers, a history of performing various client research projects, the expertise of highly skilled developers, unique technology in semiconductor packaging, and smart factory process development know-how [5, 10].StrongR&Dcapabilitiesstemmingfromtheknow-howofexperiencedresearchers,ahistoryofperformingvariousclientresearchprojects,theexpertiseofhighlyskilleddevelopers,uniquetechnologyinsemiconductorpackaging,andsmartfactoryprocessdevelopmentknow-how[5,10].
Manufacturing expertise involving the modularization of units for accurate and rapid equipment production, securing fast and precise manufacturing technology for various models, and efforts to reduce assembly time through research into unit-by-unit assembly followed by overall assembly [5].Manufacturingexpertiseinvolvingthemodularizationofunitsforaccurateandrapidequipmentproduction,securingfastandprecisemanufacturingtechnologyforvariousmodels,andeffortstoreduceassemblytimethroughresearchintounit-by-unitassemblyfollowedbyoverallassembly[5].
Easy Maintenance capability facilitated by the standardization of proprietary technologies, allowing for simpler upkeep [5].EasyMaintenancecapabilityfacilitatedbythestandardizationofproprietarytechnologies,allowingforsimplerupkeep[5].
Customer-centric management, prioritizing customer value by providing superior and differentiated quality products and services in a timely manner, building trust through responsible management as a partner, and striving for customer impression beyond mere satisfaction [8, 28, 32].Customer-centricmanagement,prioritizingcustomervaluebyprovidingsuperioranddifferentiatedqualityproductsandservicesinatimelymanner,buildingtrustthroughresponsiblemanagementasapartner,andstrivingforcustomerimpressionbeyondmeresatisfaction[8,28,32].
Ability to provide optimal smart automation solutions covering semiconductor front/back-end processes, multi-joint robot automation equipment, autonomous driving robots, AI service robots, kiosk utilization, and 3D mechanical design [7, 8].Abilitytoprovideoptimalsmartautomationsolutionscoveringsemiconductorfront/back-endprocesses,multi-jointrobotautomationequipment,autonomousdrivingrobots,AIservicerobots,kioskutilization,and3Dmechanicaldesign[7,8].
Extensive track record of developing and manufacturing approximately 1,700 major equipment units since the company's establishment in 2003 [7, 8, 19].Extensivetrackrecordofdevelopingandmanufacturingapproximately1,700majorequipmentunitssincethecompany'sestablishmentin2003[7,8,19].
A young and innovative corporate culture with an average employee age of 36.3 years, preparing for a second leap forward through aggressive R&D and facility investments, and groundbreaking organizational restructuring [7, 10].Ayoungandinnovativecorporateculturewithanaverageemployeeageof36.3years,preparingforasecondleapforwardthroughaggressiveR&Dandfacilityinvestments,andgroundbreakingorganizationalrestructuring[7,10].
Logistics Automation Industry [5, 26]LogisticsAutomationIndustry[5,26]
Bio and Cosmetic Industry [5, 8, 10, 20]BioandCosmeticIndustry[5,8,10,20]
Pharmaceutical Industry [8, 10]PharmaceuticalIndustry[8,10]
Battery Industry [8, 10]BatteryIndustry[8,10]
General Industrial Automation Sector [5, 8, 10]GeneralIndustrialAutomationSector[5,8,10]
Major MarketsMajorMarkets
China [19], Vietnam [15, 19]China[19],Vietnam[15,19]
Certifications/PatentsCertifications/Patents
A company possessing unique technology in the semiconductor packaging field through many years of research and development [5, 10].Acompanypossessinguniquetechnologyinthesemiconductorpackagingfieldthroughmanyyearsofresearchanddevelopment[5,10].
Capability to provide optimal technical solutions to customers based on decades of accumulated know-how since the initial development of semiconductor packaging process equipment [10].Capabilitytoprovideoptimaltechnicalsolutionstocustomersbasedondecadesofaccumulatedknow-howsincetheinitialdevelopmentofsemiconductorpackagingprocessequipment[10].
Technological strength in standardizing proprietary technologies to facilitate easier maintenance of equipment [5].Technologicalstrengthinstandardizingproprietarytechnologiestofacilitateeasiermaintenanceofequipment[5].