Information
50-8 Banwol-gil, Hwaseong-si, Gyeonggi-do, South Korea
+82 31-206-0543
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Overview
- Summary
- A global company providing total solutions in the semiconductor I.C Test field. A specialized enterprise developing and manufacturing core components for semiconductor package testing, including test sockets, test boards, burn-in boards, and COK. A company that has achieved high growth through creative innovation management and continuous R&D, securing a high level of technology. An entity with strong competitive advantages in both memory and non-memory semiconductor test component markets.A global company providing total solutions in the semiconductor I.C Test field. A specialized enterprise developing and manufacturing core components for semiconductor package testing, including test sockets, test boards, burn-in boards, and COK. A company that has achieved high growth through creative innovation management and continuous R&D, securing a high level of technology. An entity with strong competitive advantages in both memory and non-memory semiconductor test component markets.
- Key Products/Technologies
- Test Sockets: Essential components used in semiconductor chip package inspection, possessing high-performance pogo pin and elastomer type socket technologies. Supplying memory sockets for DDR5, GDDR, LPDDR, and mobile AP-oriented sockets to major customers. Capability in developing next-generation test socket technologies related to 2.5D/3D packaging and High Bandwidth Memory (HBM).Test Sockets: Essential components used in semiconductor chip package inspection, possessing high-performance pogo pin and elastomer type socket technologies. Supplying memory sockets for DDR5, GDDR, LPDDR, and mobile AP-oriented sockets to major customers. Capability in developing next-generation test socket technologies related to 2.5D/3D packaging and High Bandwidth Memory (HBM).
- Test Boards: Core components that electrically connect test equipment and test sockets to evaluate the input/output signals of semiconductor chips.Test Boards: Core components that electrically connect test equipment and test sockets to evaluate the input/output signals of semiconductor chips.
- Burn-in Boards: Boards utilized to detect defects in semiconductor chips under high and low-temperature environments, ensuring reliability.Burn-in Boards: Boards utilized to detect defects in semiconductor chips under high and low-temperature environments, ensuring reliability.
- COK (Change Over Kit): Consumable components that transfer semiconductor chips into test equipment and support physical connections, successfully localized in 2003.COK (Change Over Kit): Consumable components that transfer semiconductor chips into test equipment and support physical connections, successfully localized in 2003.
- Total Solution: A unique and comprehensive solution that develops and supplies all four core components of the semiconductor test process: test sockets, test boards, burn-in boards, and COK.Total Solution: A unique and comprehensive solution that develops and supplies all four core components of the semiconductor test process: test sockets, test boards, burn-in boards, and COK.
- Thermal Control Solutions: A complete system including heat sinks, fans, active cooling, and liquid cooling to effectively manage heat generated during high-performance chip testing. Proprietary development of immersion cooling technology to enhance the accuracy and yield of high-performance semiconductor testing.Thermal Control Solutions: A complete system including heat sinks, fans, active cooling, and liquid cooling to effectively manage heat generated during high-performance chip testing. Proprietary development of immersion cooling technology to enhance the accuracy and yield of high-performance semiconductor testing.
- Development of Core Components for High Frequency: A future technological capability focused on developing core component materials for high-frequency applications in AI and 5G technologies.Development of Core Components for High Frequency: A future technological capability focused on developing core component materials for high-frequency applications in AI and 5G technologies.
- Precision Manufacturing and Quality Inspection Facilities: Possession of state-of-the-art manufacturing equipment such as VM 5400 machining centers, ROKU-ROKU MEGA-S500 high-precision small-diameter micro-machining machines, and MARK-DP5 laser marking equipment. Operation of precision quality inspection facilities including AXIOM series 3D contact measuring machines, SmartScope ZIP 300 3D non-contact measuring machines, and TVX-IMT160CT-S1 X-RAY inspection equipment.Precision Manufacturing and Quality Inspection Facilities: Possession of state-of-the-art manufacturing equipment such as VM 5400 machining centers, ROKU-ROKU MEGA-S500 high-precision small-diameter micro-machining machines, and MARK-DP5 laser marking equipment. Operation of precision quality inspection facilities including AXIOM series 3D contact measuring machines, SmartScope ZIP 300 3D non-contact measuring machines, and TVX-IMT160CT-S1 X-RAY inspection equipment.
- Core Advantages
- Sole Total Solution Provider in Korea: The only company in Korea that develops and supplies all four core components of the semiconductor test process (test sockets, test boards, burn-in boards, and COK). This strength overcomes the limitations of connection accuracy and coordination that can arise when customers procure components from multiple suppliers, contributing to yield improvement.Sole Total Solution Provider in Korea: The only company in Korea that develops and supplies all four core components of the semiconductor test process (test sockets, test boards, burn-in boards, and COK). This strength overcomes the limitations of connection accuracy and coordination that can arise when customers procure components from multiple suppliers, contributing to yield improvement.
- Leading Technological Innovation and Proactive R&D Investment: A company culture focused on securing high-level technology through continuous research and development and technological innovation. Comprising 33% of its total workforce (45 employees) as research personnel, including veteran master's and doctoral degree holders, and planning 25 billion KRW in R&D investment by 2025, demonstrating technology-centric management.Leading Technological Innovation and Proactive R&D Investment: A company culture focused on securing high-level technology through continuous research and development and technological innovation. Comprising 33% of its total workforce (45 employees) as research personnel, including veteran master's and doctoral degree holders, and planning 25 billion KRW in R&D investment by 2025, demonstrating technology-centric management.
- Strong Growth Momentum in the Non-Memory Semiconductor Market: Technological capability to simultaneously inspect up to 32 wireless signal elements of non-memory semiconductors. Exceeding its 2025 target of 50% non-memory revenue contribution, reaching 66.6% on a cumulative basis in Q3, demonstrating growth driven by increased demand for mobile AP and communication chips.Strong Growth Momentum in the Non-Memory Semiconductor Market: Technological capability to simultaneously inspect up to 32 wireless signal elements of non-memory semiconductors. Exceeding its 2025 target of 50% non-memory revenue contribution, reaching 66.6% on a cumulative basis in Q3, demonstrating growth driven by increased demand for mobile AP and communication chips.
- Global Market Expansion and Network Reinforcement: A strategic move to strengthen its position in the Japanese market through the acquisition of JMT, a Japanese test socket specialist, in 2019. Active engagement with overseas customers through the establishment of a Singapore branch, continuously expanding its overseas revenue share in global management.Global Market Expansion and Network Reinforcement: A strategic move to strengthen its position in the Japanese market through the acquisition of JMT, a Japanese test socket specialist, in 2019. Active engagement with overseas customers through the establishment of a Singapore branch, continuously expanding its overseas revenue share in global management.
- Expansion of Production Capacity and Securing Future Growth Foundation: Plans to acquire additional land for its Hwaseong factory in 2024 and commence operations of a new factory in 2026, aiming to more than double its test socket production capacity. This is a key factor in proactively responding to increasing market demand and securing long-term growth visibility.Expansion of Production Capacity and Securing Future Growth Foundation: Plans to acquire additional land for its Hwaseong factory in 2024 and commence operations of a new factory in 2026, aiming to more than double its test socket production capacity. This is a key factor in proactively responding to increasing market demand and securing long-term growth visibility.
- Customer-Tailored Solutions and High Customer Satisfaction: Flexible responsiveness by providing customized test components based on chip size, design, and customer requirements. Partnership in contributing to customer R&D by supplying test boards with attached sockets during the semiconductor development phase.Customer-Tailored Solutions and High Customer Satisfaction: Flexible responsiveness by providing customized test components based on chip size, design, and customer requirements. Partnership in contributing to customer R&D by supplying test boards with attached sockets during the semiconductor development phase.
- Commitment to ESG Management for Sustainable Growth: An enterprise that establishes and implements an ESG management system to fulfill its corporate social responsibilities in environmental, social, and governance aspects. Recognized for its efforts towards sustainable management by achieving an overall ESG rating of 3 in 2023.Commitment to ESG Management for Sustainable Growth: An enterprise that establishes and implements an ESG management system to fulfill its corporate social responsibilities in environmental, social, and governance aspects. Recognized for its efforts towards sustainable management by achieving an overall ESG rating of 3 in 2023.
- Target Industrie
- Semiconductor Manufacturing and Test Industry: Supplying essential components and solutions for final inspection and reliability testing processes of memory and non-memory semiconductors.Semiconductor Manufacturing and Test Industry: Supplying essential components and solutions for final inspection and reliability testing processes of memory and non-memory semiconductors.
- Data Center and Cloud Industry: Providing test solutions for high-performance chips used in data centers and cloud computing.Data Center and Cloud Industry: Providing test solutions for high-performance chips used in data centers and cloud computing.
- Mobile Device Industry: Supplying test solutions for application processors (AP) and communication chips used in mobile devices such as smartphones.Mobile Device Industry: Supplying test solutions for application processors (AP) and communication chips used in mobile devices such as smartphones.
- Artificial Intelligence (AI) Semiconductor Industry: Developing test technologies and components for next-generation AI semiconductors, including High Bandwidth Memory (HBM), chiplets, and high-performance memory modules for AI PCs.Artificial Intelligence (AI) Semiconductor Industry: Developing test technologies and components for next-generation AI semiconductors, including High Bandwidth Memory (HBM), chiplets, and high-performance memory modules for AI PCs.
- Major Markets
- Japan, SingaporeJapan, Singapore
- North AmericaNorth America
- Certifications/Patents
- ISO 9001 (Quality Management System) CertificationISO 9001 (Quality Management System) Certification
- ISO 14001 (Environmental Management System) CertificationISO 14001 (Environmental Management System) Certification
- ISO 45001 (Occupational Health and Safety Management System) CertificationISO 45001 (Occupational Health and Safety Management System) Certification
- ISO 27001 (Information Security Management System) CertificationISO 27001 (Information Security Management System) Certification
- INNO-Biz (Technology Innovation Small and Medium Business) Certification and Venture Company CertificationINNO-Biz (Technology Innovation Small and Medium Business) Certification and Venture Company Certification
- Family-Friendly Company CertificationFamily-Friendly Company Certification
- Achieved 2023 ESG Comprehensive Grade 3Achieved 2023 ESG Comprehensive Grade 3
- Holds over 100 original patents in the test socket fieldHolds over 100 original patents in the test socket field
- Filed over 40 related patents in the test contact field, including universal kits and multi-ATC modulesFiled over 40 related patents in the test contact field, including universal kits and multi-ATC modules
- Filed 6 patents related to simultaneous inspection solutions for non-memory semiconductor wireless signal elementsFiled 6 patents related to simultaneous inspection solutions for non-memory semiconductor wireless signal elements
- Possesses numerous patents for semiconductor test-related solutionsPossesses numerous patents for semiconductor test-related solutions
- Awarded the ICT Patent Management Grand PrizeAwarded the ICT Patent Management Grand Prize
- Awarded the 10 Million Dollar Export TowerAwarded the 10 Million Dollar Export Tower
Introduction
Location
50-8 Banwol-gil, Hwaseong-si, Gyeonggi-do, South Korea
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