Information
Libušina tř. 863/21, 623 00 Brno-Kohoutovice, Czechia
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Overview
- Summary
- TESCAN is a company specializing in nanoscale investigation and analysis solutions, developing innovative electron microscopes, micro-computed tomography, and related software for geosciences, materials science, life sciences, and semiconductor industries. With over 30 years of experience, the company provides high-resolution imaging and surface analysis, having installed over 4,500 systems in more than 80 countries globally. Its 4D-STEM platforms, such as TENSOR, offer new levels of performance and user experience, contributing to advanced materials research and semiconductor analysis.TESCAN is a company specializing in nanoscale investigation and analysis solutions, developing innovative electron microscopes, micro-computed tomography, and related software for geosciences, materials science, life sciences, and semiconductor industries. With over 30 years of experience, the company provides high-resolution imaging and surface analysis, having installed over 4,500 systems in more than 80 countries globally. Its 4D-STEM platforms, such as TENSOR, offer new levels of performance and user experience, contributing to advanced materials research and semiconductor analysis.
- Key Products/Technologies
- Scanning Electron Microscopes (SEM): Platforms for high-resolution imaging and surface analysis, ideal for materials research, quality control, and analytical applications. Tescan VEGA is a tungsten-based SEM for routine imaging and analysis, featuring integrated EDS and Wide Field Optics™ technology. Tescan MIRA is a modular FEG-SEM supporting EDS, EBSD, CL, STEM, and nanoprocessing, designed as an expandable platform. Tescan CLARA™ is a UHR FEG-SEM for surface-sensitive imaging at low voltages, incorporating a BrightBeam™ field-free column and advanced detectors.Scanning Electron Microscopes (SEM): Platforms for high-resolution imaging and surface analysis, ideal for materials research, quality control, and analytical applications. Tescan VEGA is a tungsten-based SEM for routine imaging and analysis, featuring integrated EDS and Wide Field Optics™ technology. Tescan MIRA is a modular FEG-SEM supporting EDS, EBSD, CL, STEM, and nanoprocessing, designed as an expandable platform. Tescan CLARA™ is a UHR FEG-SEM for surface-sensitive imaging at low voltages, incorporating a BrightBeam™ field-free column and advanced detectors.
- Focused Ion Beam-Scanning Electron Microscopes (FIB-SEM): Systems combining high-resolution imaging with advanced automation, offering a choice of Ga+ or Xe plasma FIB sources for sample preparation, prototyping, or failure analysis. Tescan AMBER 2 is an automated Ga+ FIB-SEM system for precise control in TEM sample preparation and nanoprocessing. AMBER X 2 integrates Mistral™ Xe Plasma FIB and BrightBeam™ UHR SEM to handle large-volume sectioning and delicate TEM lamella preparation.Focused Ion Beam-Scanning Electron Microscopes (FIB-SEM): Systems combining high-resolution imaging with advanced automation, offering a choice of Ga+ or Xe plasma FIB sources for sample preparation, prototyping, or failure analysis. Tescan AMBER 2 is an automated Ga+ FIB-SEM system for precise control in TEM sample preparation and nanoprocessing. AMBER X 2 integrates Mistral™ Xe Plasma FIB and BrightBeam™ UHR SEM to handle large-volume sectioning and delicate TEM lamella preparation.
- Micro-Computed Tomography (Micro-CT): X-ray micro-CT systems for non-destructive 3D and real-time 4D imaging, suitable for complex materials and biological sample analysis. UniTOM® HR provides sub-micron resolution, while UniTOM® XL offers high-throughput imaging for large samples. DynaTOM® is a system designed for dynamic in-situ studies, enabling continuous, high-temporal-resolution scanning. Spectral CT provides true spectral imaging for chemical contrast.Micro-Computed Tomography (Micro-CT): X-ray micro-CT systems for non-destructive 3D and real-time 4D imaging, suitable for complex materials and biological sample analysis. UniTOM® HR provides sub-micron resolution, while UniTOM® XL offers high-throughput imaging for large samples. DynaTOM® is a system designed for dynamic in-situ studies, enabling continuous, high-temporal-resolution scanning. Spectral CT provides true spectral imaging for chemical contrast.
- 4D Scanning Transmission Electron Microscopes (4D-STEM): Tescan TENSOR is an integrated analytical 4D-STEM platform providing precise nanoscale characterization for structural, morphological, and chemical property analysis. It supports real-time data processing, automation, and scripting, offering precise strain mapping and phase orientation analysis for semiconductor device analysis. A key feature is its Analytical 4D-STEM capability, acquiring EDS spectra and diffraction patterns simultaneously.4D Scanning Transmission Electron Microscopes (4D-STEM): Tescan TENSOR is an integrated analytical 4D-STEM platform providing precise nanoscale characterization for structural, morphological, and chemical property analysis. It supports real-time data processing, automation, and scripting, offering precise strain mapping and phase orientation analysis for semiconductor device analysis. A key feature is its Analytical 4D-STEM capability, acquiring EDS spectra and diffraction patterns simultaneously.
- Laser Solutions and Ex Situ Lift-Out: FemtoChisel laser technology provides solutions for high-precision semiconductor sample preparation, and Tescan EXLO™ is a technology that performs sample lift-out outside the FIB-SEM, enhancing TEM throughput, reproducibility, and cost efficiency.Laser Solutions and Ex Situ Lift-Out: FemtoChisel laser technology provides solutions for high-precision semiconductor sample preparation, and Tescan EXLO™ is a technology that performs sample lift-out outside the FIB-SEM, enhancing TEM throughput, reproducibility, and cost efficiency.
- Core Advantages
- Integrated Multimodal Solutions: Integration of various imaging and analysis technologies like SEM, FIB-SEM, Micro-CT, and 4D-STEM, offering comprehensive nanoscale characterization from surface to internal structures and atomic scale. The combination of Micro-CT with plasma FIB-SEM based 3D tomography enables mechanistic understanding across multiple length scales.Integrated Multimodal Solutions: Integration of various imaging and analysis technologies like SEM, FIB-SEM, Micro-CT, and 4D-STEM, offering comprehensive nanoscale characterization from surface to internal structures and atomic scale. The combination of Micro-CT with plasma FIB-SEM based 3D tomography enables mechanistic understanding across multiple length scales.
- Innovative Technology and User-Friendliness: Over 30 years of development history and the merger with ORSAY PHYSICS have secured advanced ion beam and electron beam technologies. Platforms like TENSOR offer intuitive user interfaces and automated beam alignment, making them accessible even to non-expert users.Innovative Technology and User-Friendliness: Over 30 years of development history and the merger with ORSAY PHYSICS have secured advanced ion beam and electron beam technologies. Platforms like TENSOR offer intuitive user interfaces and automated beam alignment, making them accessible even to non-expert users.
- Customized Solutions and Flexibility: A flexible approach to developing and delivering tailor-made systems to meet specific customer needs. Pioneering role in integrating new technologies such as plasma ion columns, Raman, and ToF SIMS into microscopes as standard products, along with offering various chamber sizes.Customized Solutions and Flexibility: A flexible approach to developing and delivering tailor-made systems to meet specific customer needs. Pioneering role in integrating new technologies such as plasma ion columns, Raman, and ToF SIMS into microscopes as standard products, along with offering various chamber sizes.
- Global Market Leadership and Extensive Installed Base: Strong global presence with over 4,500 systems installed in more than 80 countries worldwide. Historically strong in European and US markets, with accelerated growth in the Asia-Pacific region through subsidiaries in South Korea, Taiwan, and Singapore.Global Market Leadership and Extensive Installed Base: Strong global presence with over 4,500 systems installed in more than 80 countries worldwide. Historically strong in European and US markets, with accelerated growth in the Asia-Pacific region through subsidiaries in South Korea, Taiwan, and Singapore.
- High Performance and Precision: Tescan's systems deliver superior performance in high-resolution imaging, precise nanoscale fabrication, and non-destructive 3D/4D analysis. Plasma FIB, in particular, offers milling rates up to 50 times faster than conventional Ga+ FIB and the ability to process millimeter-sized cross-sections with minimal artifacts.High Performance and Precision: Tescan's systems deliver superior performance in high-resolution imaging, precise nanoscale fabrication, and non-destructive 3D/4D analysis. Plasma FIB, in particular, offers milling rates up to 50 times faster than conventional Ga+ FIB and the ability to process millimeter-sized cross-sections with minimal artifacts.
- Automated Workflows: Automated sample preparation workflows leveraging AI and machine learning reduce processing time and manual errors, contributing to increased productivity. Solutions like TEM AutoPrep Pro™ software ensure consistency and reproducibility in automated lamella preparation.Automated Workflows: Automated sample preparation workflows leveraging AI and machine learning reduce processing time and manual errors, contributing to increased productivity. Solutions like TEM AutoPrep Pro™ software ensure consistency and reproducibility in automated lamella preparation.
- Target Industries
- Materials Science: Providing nanoscale insights for alloy development, ceramic studies, battery electrode research, surface engineering, quality assurance, and materials discovery. Detection of internal defects and microstructural characterization in a wide range of engineering materials including metals, ceramics, polymers, and composites.Materials Science: Providing nanoscale insights for alloy development, ceramic studies, battery electrode research, surface engineering, quality assurance, and materials discovery. Detection of internal defects and microstructural characterization in a wide range of engineering materials including metals, ceramics, polymers, and composites.
- Semiconductor Industry: Utilized for advanced semiconductor device analysis, failure analysis, nanofabrication, TEM sample preparation, process optimization, and quality control. Supports FinFET strain analysis, 3D NAND grain size mapping, and advanced packaging solutions.Semiconductor Industry: Utilized for advanced semiconductor device analysis, failure analysis, nanofabrication, TEM sample preparation, process optimization, and quality control. Supports FinFET strain analysis, 3D NAND grain size mapping, and advanced packaging solutions.
- Life Sciences: Biological ultrastructure analysis, cryogenic FIB-SEM workflows for preserving cellular and tissue structures, and high-resolution, high-contrast imaging across various sample types.Life Sciences: Biological ultrastructure analysis, cryogenic FIB-SEM workflows for preserving cellular and tissue structures, and high-resolution, high-contrast imaging across various sample types.
- Geosciences: Visualization of pore morphology, mineral composition, and structural variation through analysis of rock cores, cuttings, and thin sections. Supports non-destructive 2D and 3D imaging for geological samples with automated mineralogy, FIB-SEM, and Micro-CT systems.Geosciences: Visualization of pore morphology, mineral composition, and structural variation through analysis of rock cores, cuttings, and thin sections. Supports non-destructive 2D and 3D imaging for geological samples with automated mineralogy, FIB-SEM, and Micro-CT systems.
- Energy Storage: Supporting battery research and production through lithium dendrite detection, electrode-electrolyte interface analysis, cryo-FIB sample preparation, and in-situ and 3D imaging workflows.Energy Storage: Supporting battery research and production through lithium dendrite detection, electrode-electrolyte interface analysis, cryo-FIB sample preparation, and in-situ and 3D imaging workflows.
- Industrial Manufacturing and Quality Control: Monitoring manufacturing processes, validating additive manufacturing, detecting defects, assessing component reliability, and optimizing material design.Industrial Manufacturing and Quality Control: Monitoring manufacturing processes, validating additive manufacturing, detecting defects, assessing component reliability, and optimizing material design.
- Major Markets
- South Korea, Taiwan, China, Malaysia, Singapore, JapanSouth Korea, Taiwan, China, Malaysia, Singapore, Japan
- Czech Republic, Germany, France, UK, Benelux, Austria, SwitzerlandCzech Republic, Germany, France, UK, Benelux, Austria, Switzerland
- United StatesUnited States
- BrazilBrazil
- Certifications/Patents
- Technological Competence: Tescan possesses over 30 years of innovative development capabilities in electron microscopy, micro-computed tomography, and related software solutions. The merger with ORSAY PHYSICS has further solidified its global leadership in customized focused ion beam and electron beam technology.Technological Competence: Tescan possesses over 30 years of innovative development capabilities in electron microscopy, micro-computed tomography, and related software solutions. The merger with ORSAY PHYSICS has further solidified its global leadership in customized focused ion beam and electron beam technology.
- R&D 100 Award: The AMBER X 2 platform, powered by Mistral™ Plasma FIB technology, received the R&D 100 Award in 2025, recognizing its nanoscale innovation.R&D 100 Award: The AMBER X 2 platform, powered by Mistral™ Plasma FIB technology, received the R&D 100 Award in 2025, recognizing its nanoscale innovation.
- Patent Acquisition: The acquisition of ExpressLO's patents has created new possibilities in signal detection, securing a technological edge to deliver faster, clearer, and smarter results.Patent Acquisition: The acquisition of ExpressLO's patents has created new possibilities in signal detection, securing a technological edge to deliver faster, clearer, and smarter results.
Introduction
Location
Libušina tř. 863/21, 623 00 Brno-Kohoutovice, Czechia
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