TELEDYNE DALSA is a global leader in high-performance digital imaging and semiconductors, specializing in electronic imaging components and specialized semiconductor fabrication. The company designs, develops, manufactures, and markets digital imaging products and solutions for various industrial, scientific, and medical applications. Established in 1980 and acquired by Teledyne Technologies in 2011, the company employs approximately 1000 individuals worldwide. Its core competencies include specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.TELEDYNEDALSAisagloballeaderinhigh-performancedigitalimagingandsemiconductors,specializinginelectronicimagingcomponentsandspecializedsemiconductorfabrication.Thecompanydesigns,develops,manufactures,andmarketsdigitalimagingproductsandsolutionsforvariousindustrial,scientific,andmedicalapplications.Establishedin1980andacquiredbyTeledyneTechnologiesin2011,thecompanyemploysapproximately1000individualsworldwide.Itscorecompetenciesincludespecializedintegratedcircuitandelectronicstechnology,software,andhighlyengineeredsemiconductorwaferprocessing.
Key Products/TechnologiesKeyProducts/Technologies
High-performance digital imaging products: image sensors (CCD, CMOS), area scan cameras, line scan cameras, smart cameras, frame grabbers, imaging software, X-ray detectors, and infrared sensing solutions.High-performancedigitalimagingproducts:imagesensors(CCD,CMOS),areascancameras,linescancameras,smartcameras,framegrabbers,imagingsoftware,X-raydetectors,andinfraredsensingsolutions.
Key camera models: Genie Nano 10GigE, Genie Nano GigE (CMOS GigE cameras), Linea HS2 (next-generation TDI technology), BOA2 (smart camera vision system), Linea CMOS multi-channel line scan cameras, Linea HS 32K TDI cameras, Piranha4, Genie TS, and AxCIS™ (high-speed, high-resolution fully integrated line scan imaging modules).Keycameramodels:GenieNano10GigE,GenieNanoGigE(CMOSGigEcameras),LineaHS2(next-generationTDItechnology),BOA2(smartcameravisionsystem),LineaCMOSmulti-channellinescancameras,LineaHS32KTDIcameras,Piranha4,GenieTS,andAxCIS™(high-speed,high-resolutionfullyintegratedlinescanimagingmodules).
Semiconductor products and services: MEMS fabrication (150mm and 200mm wafers), high-voltage ASICs, specialized integrated circuits, CCD fabrication services, wafer-scale packaging, and advanced system-on-chip development and packaging services for high-reliability multi-chip modules.Semiconductorproductsandservices:MEMSfabrication(150mmand200mmwafers),high-voltageASICs,specializedintegratedcircuits,CCDfabricationservices,wafer-scalepackaging,andadvancedsystem-on-chipdevelopmentandpackagingservicesforhigh-reliabilitymulti-chipmodules.
Vision software: iNspect Express (user-friendly interface), Sherlock (for advanced vision integrators), Astrocyte Deep Learning Software (for deep learning-based anomaly detection and classification), CamExpert, and ShadoCam Imaging application.Visionsoftware:iNspectExpress(user-friendlyinterface),Sherlock(foradvancedvisionintegrators),AstrocyteDeepLearningSoftware(fordeeplearning-basedanomalydetectionandclassification),CamExpert,andShadoCamImagingapplication.
Core AdvantagesCoreAdvantages
Vertically integrated supply chain: One of the few companies manufacturing both CCD and CMOS sensors, ensuring high control and flexibility over the production process.Verticallyintegratedsupplychain:OneofthefewcompaniesmanufacturingbothCCDandCMOSsensors,ensuringhighcontrolandflexibilityovertheproductionprocess.
World-leading MEMS foundry capabilities: Offers dozens of proven and patented process modules and techniques on both 150mm and 200mm wafer lines, holding IATF 16949 and ISO 14001 registrations, ranked as the number two independent pure-play MEMS foundry globally.World-leadingMEMSfoundrycapabilities:Offersdozensofprovenandpatentedprocessmodulesandtechniquesonboth150mmand200mmwaferlines,holdingIATF16949andISO14001registrations,rankedasthenumbertwoindependentpure-playMEMSfoundryglobally.
Innovative X-ray detector technology: Possesses advanced CMOS X-ray detector technology providing superior lag-free, real-time imaging with higher resolution and reduced X-ray dose levels compared to competing technologies.InnovativeX-raydetectortechnology:PossessesadvancedCMOSX-raydetectortechnologyprovidingsuperiorlag-free,real-timeimagingwithhigherresolutionandreducedX-raydoselevelscomparedtocompetingtechnologies.
Advanced camera technology and software: Features proprietary camera technology for breakthrough speed, robust build quality, wide operating temperature, a three-year warranty, and unmatched feature sets, exemplified by the Genie Nano series and Linea HS TDI cameras.Advancedcameratechnologyandsoftware:Featuresproprietarycameratechnologyforbreakthroughspeed,robustbuildquality,wideoperatingtemperature,athree-yearwarranty,andunmatchedfeaturesets,exemplifiedbytheGenieNanoseriesandLineaHSTDIcameras.
Strong R&D and innovation focus: Builds upon a 30-year heritage of developing leading high-performance digital imaging and semiconductor solutions, accelerating innovation by leveraging the broader capabilities of Teledyne Technologies.StrongR&Dandinnovationfocus:Buildsupona30-yearheritageofdevelopingleadinghigh-performancedigitalimagingandsemiconductorsolutions,acceleratinginnovationbyleveragingthebroadercapabilitiesofTeledyneTechnologies.
Specialized IC and electronics expertise: Possesses core competencies in specialized integrated circuit and electronics technology, software, and highly engineered semiconductor wafer processing.SpecializedICandelectronicsexpertise:Possessescorecompetenciesinspecializedintegratedcircuitandelectronicstechnology,software,andhighlyengineeredsemiconductorwaferprocessing.
Target IndustriesTargetIndustries
Machine Vision and Inspection: Flaw detection, positioning, identification, verification, and measurement applications in semiconductors, electronics, automotive, pharmaceutical, food and packaging, general manufacturing, printed circuit inspection, and semiconductor wafer inspection.MachineVisionandInspection:Flawdetection,positioning,identification,verification,andmeasurementapplicationsinsemiconductors,electronics,automotive,pharmaceutical,foodandpackaging,generalmanufacturing,printedcircuitinspection,andsemiconductorwaferinspection.
Medical & Life Sciences: Mammography, dental X-ray, digital radiography, biotechnology, crystallography, microscopy, microfluidic devices, ophthalmology, temperature screening, analytical radiology, orthopedic, and surgical radiology.Medical&LifeSciences:Mammography,dentalX-ray,digitalradiography,biotechnology,crystallography,microscopy,microfluidicdevices,ophthalmology,temperaturescreening,analyticalradiology,orthopedic,andsurgicalradiology.
Aerospace: Remote sensing for environmental and earth observation applications, including image sensors for NASA's Mars Rovers (Spirit, Opportunity, Curiosity).Aerospace:Remotesensingforenvironmentalandearthobservationapplications,includingimagesensorsforNASA'sMarsRovers(Spirit,Opportunity,Curiosity).
Scientific Imaging: Crystallography, microscopy, astronomy, spectroscopy, ultra-high-speed imaging, biotechnology, and protein crystallography.ScientificImaging:Crystallography,microscopy,astronomy,spectroscopy,ultra-high-speedimaging,biotechnology,andproteincrystallography.
Defense & Security: Threat detection, situational awareness, night and enhanced vision, ISR (Intelligence, Surveillance, Reconnaissance), and uncooled long-wave infrared detectors.Defense&Security:Threatdetection,situationalawareness,nightandenhancedvision,ISR(Intelligence,Surveillance,Reconnaissance),anduncooledlong-waveinfrareddetectors.
Non-Destructive Testing: Evaluation, troubleshooting, research, and quality control in science and industry, including circuit boards, concrete, metal parts, and assemblies.Non-DestructiveTesting:Evaluation,troubleshooting,research,andqualitycontrolinscienceandindustry,includingcircuitboards,concrete,metalparts,andassemblies.
Canada (Waterloo, Montreal, Bromont), USA (Billerica, Santa Clara, Milpitas)Canada(Waterloo,Montreal,Bromont),USA(Billerica,SantaClara,Milpitas)
Certifications/PatentsCertifications/Patents
IATF 16949 and ISO 14001 registered for its MEMS foundry.IATF16949andISO14001registeredforitsMEMSfoundry.
RoHS compliant.RoHScompliant.
Holds dozens of patents in fabrication technology, image sensor design, and X-ray imaging.Holdsdozensofpatentsinfabricationtechnology,imagesensordesign,andX-rayimaging.
Notable patents include: Semiconductor imager and method with spatially separated proximate and distal reset gates to tune relative gain (US 8405018), Semiconductor image sensor array device, apparatus comprising such a device and method for operating such a device (US 8119967, US 8319168), Packaged device with an image sensor aligned to a faceplate using fiducial marks and connection bodies registered thereto (US 8669633), Continuous clocking mode for TDI binning operation of CCD image sensor (US 8692916), X-ray system, X-ray detector, pixel controller, and method for multi-spectrum imaging (US 12585036), Energy-resolving photon counting detector pixel (US 12372677), Fault detection circuit for image sensor (US 11778134), and Image sensor and imaging system comprising the same (US 11477398).Notablepatentsinclude:Semiconductorimagerandmethodwithspatiallyseparatedproximateanddistalresetgatestotunerelativegain(US8405018),Semiconductorimagesensorarraydevice,apparatuscomprisingsuchadeviceandmethodforoperatingsuchadevice(US8119967,US8319168),Packageddevicewithanimagesensoralignedtoafaceplateusingfiducialmarksandconnectionbodiesregisteredthereto(US8669633),ContinuousclockingmodeforTDIbinningoperationofCCDimagesensor(US8692916),X-raysystem,X-raydetector,pixelcontroller,andmethodformulti-spectrumimaging(US12585036),Energy-resolvingphotoncountingdetectorpixel(US12372677),Faultdetectioncircuitforimagesensor(US11778134),andImagesensorandimagingsystemcomprisingthesame(US11477398).
Acquisition of Sigmascreening B.V. patents and IP portfolio on pressure-sensitive breast compression for screening.AcquisitionofSigmascreeningB.V.patentsandIPportfolioonpressure-sensitivebreastcompressionforscreening.
Awards and Recognition: Gold-level honors at the Vision Systems Design 2018 Innovator Awards for its Linea CMOS multi-channel line scan machine vision camera, Business of the Year Award from the Netherlands-Canadian Chamber of Commerce (2012), SPIE Prism Award in the Quality Control category for its Linea HS 32K TDI camera (2021), Gold honoree at the Vision Systems Design 2024 Innovator Awards for its AxCIS™ family of line scan imaging modules, and the NSERC Synergy Award for Innovation - Small and Medium-Sized Businesses for the Large-Scale Infrared Imaging Sensors Project (2019).AwardsandRecognition:Gold-levelhonorsattheVisionSystemsDesign2018InnovatorAwardsforitsLineaCMOSmulti-channellinescanmachinevisioncamera,BusinessoftheYearAwardfromtheNetherlands-CanadianChamberofCommerce(2012),SPIEPrismAwardintheQualityControlcategoryforitsLineaHS32KTDIcamera(2021),GoldhonoreeattheVisionSystemsDesign2024InnovatorAwardsforitsAxCIS™familyoflinescanimagingmodules,andtheNSERCSynergyAwardforInnovation-SmallandMedium-SizedBusinessesfortheLarge-ScaleInfraredImagingSensorsProject(2019).