Information
80번길 27 Geumto-ro, Sujeong-gu, Seongnam-si, Gyeonggi-do, South Korea
+82 70-4275-0745
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Overview
- Summary
- Telechips is a fabless semiconductor company providing system semiconductor solutions for smart mobility, including in-vehicle infotainment (IVI), ADAS, MCUs, and network processors. The company focuses on developing next-generation AI-based automotive semiconductors and offering total solutions.Telechips is a fabless semiconductor company providing system semiconductor solutions for smart mobility, including in-vehicle infotainment (IVI), ADAS, MCUs, and network processors. The company focuses on developing next-generation AI-based automotive semiconductors and offering total solutions.
- Key Products/Technologies
- Automotive Application Processors (AP): Dolphin series (Dolphin5 TCC807X, Dolphin3 TCC805X, Dolphin+ TCC803X, N-Dolphin TCC750X). Support for various operating systems such as Android Automotive OS (AAOS), Windows Embedded Compact, Nucleus RTOS, AUTOSAR, freeRTOS, QNX, Green Hills, Free OSEK, and Linux. Dolphin5 chipset's approval for Google's Android 15 VSR (Vendor Software Readiness) Program.Automotive Application Processors (AP): Dolphin series (Dolphin5 TCC807X, Dolphin3 TCC805X, Dolphin+ TCC803X, N-Dolphin TCC750X). Support for various operating systems such as Android Automotive OS (AAOS), Windows Embedded Compact, Nucleus RTOS, AUTOSAR, freeRTOS, QNX, Green Hills, Free OSEK, and Linux. Dolphin5 chipset's approval for Google's Android 15 VSR (Vendor Software Readiness) Program.
- Automotive AI Accelerator: A2X (TCA2000/TCA1000) model, with 200/100TOPS NPU and 100K/50K DMIPS CPU performance. Integration of key preprocessing blocks like De-warp, Multi-scaler, and Point Cloud Accelerator. Seamless integration with ADAS and IVI processors, supporting on-device AI features including LLM/sLLM.Automotive AI Accelerator: A2X (TCA2000/TCA1000) model, with 200/100TOPS NPU and 100K/50K DMIPS CPU performance. Integration of key preprocessing blocks like De-warp, Multi-scaler, and Point Cloud Accelerator. Seamless integration with ADAS and IVI processors, supporting on-device AI features including LLM/sLLM.
- Automotive Network Processor SoC: Axon, based on ARM Cortex-A65AE and Cortex-M7 multi-domain cores. ASIL-D certification, support for 4-channel Ethernet (with TSN, 9.5Gbit/s bandwidth), 16 channels of CAN, and 8 channels of LIN. Features include OTA updates, diagnostics, network management, application integration, Intrusion Detection System (IDS) with Deep Packet Inspection (DPI) engine, and MACsec and IPsec security protocols.Automotive Network Processor SoC: Axon, based on ARM Cortex-A65AE and Cortex-M7 multi-domain cores. ASIL-D certification, support for 4-channel Ethernet (with TSN, 9.5Gbit/s bandwidth), 16 channels of CAN, and 8 channels of LIN. Features include OTA updates, diagnostics, network management, application integration, Intrusion Detection System (IDS) with Deep Packet Inspection (DPI) engine, and MACsec and IPsec security protocols.
- Automotive Microcontroller Units (MCU): TCC70xx series.Automotive Microcontroller Units (MCU): TCC70xx series.
- Companion and Communication ICs: T-DMB/DAB (TCC3171/TCC3170), T-DMB/DVB-T/One-Seg/CMMB (TCC3510/TCC3520), ISDB-T (TCC3530/TCC3531/TCC3532) receiver chips. Bluetooth and WiFi Modules (TCM3840, TCM3910, TCM3902), Audio DSP (TCC7604), PMIC (TCC5027/TCC5028), and Video Decoder (AD55).Companion and Communication ICs: T-DMB/DAB (TCC3171/TCC3170), T-DMB/DVB-T/One-Seg/CMMB (TCC3510/TCC3520), ISDB-T (TCC3530/TCC3531/TCC3532) receiver chips. Bluetooth and WiFi Modules (TCM3840, TCM3910, TCM3902), Audio DSP (TCC7604), PMIC (TCC5027/TCC5028), and Video Decoder (AD55).
- Total Solution Provision: Offering comprehensive solutions including chipsets, development environments, hardware design references, core technologies, and software development kits (SDK) to facilitate customer product development.Total Solution Provision: Offering comprehensive solutions including chipsets, development environments, hardware design references, core technologies, and software development kits (SDK) to facilitate customer product development.
- Hypervisor-less Solution (HLS): Technology enabling multiple operating systems to run on a single system without a hypervisor, ensuring cost competitiveness.Hypervisor-less Solution (HLS): Technology enabling multiple operating systems to run on a single system without a hypervisor, ensuring cost competitiveness.
- System-in-Package (SiP) Module: Products integrating semiconductor chips, memory semiconductors, and power semiconductors into a single package.System-in-Package (SiP) Module: Products integrating semiconductor chips, memory semiconductors, and power semiconductors into a single package.
- Core Advantages
- Leading Position in Automotive Semiconductor Market: A leading domestic company in automotive semiconductors, securing a high market share, especially in the IVI market. Achieved 73.6% market share in the domestic market (Hyundai/Kia) in 2017 and 12.4% in the global car infotainment market in 2019.Leading Position in Automotive Semiconductor Market: A leading domestic company in automotive semiconductors, securing a high market share, especially in the IVI market. Achieved 73.6% market share in the domestic market (Hyundai/Kia) in 2017 and 12.4% in the global car infotainment market in 2019.
- Comprehensive Solution Provision Capability: Offering total solutions from chipsets, development environments, hardware design references, core technologies, to software development kits (SDK) to support customer product development.Comprehensive Solution Provision Capability: Offering total solutions from chipsets, development environments, hardware design references, core technologies, to software development kits (SDK) to support customer product development.
- Advanced Technology and R&D Investment: Possessing high-performance, low-power AP design capabilities and optimized solutions. Expanding product lineup into ADAS, AI, MCUs, network gateways, and AI accelerators since 2020. Leading national projects for mobile AI semiconductors, targeting 60,000 DMIPS CPU and 8TOPS NPU performance.Advanced Technology and R&D Investment: Possessing high-performance, low-power AP design capabilities and optimized solutions. Expanding product lineup into ADAS, AI, MCUs, network gateways, and AI accelerators since 2020. Leading national projects for mobile AI semiconductors, targeting 60,000 DMIPS CPU and 8TOPS NPU performance.
- High-Level Safety and Security Technologies: Development of automotive semiconductors meeting ISO26262 (ASIL B/D) functional safety and AEC-Q100 certification. Axon network processor with ASIL-D certification, IDS, DPI engine, MACsec, and IPsec security protocols integration.High-Level Safety and Security Technologies: Development of automotive semiconductors meeting ISO26262 (ASIL B/D) functional safety and AEC-Q100 certification. Axon network processor with ASIL-D certification, IDS, DPI engine, MACsec, and IPsec security protocols integration.
- Global Partnerships and Market Diversification Strategy: Maintaining a strategic partnership with Arm. Targeting the mid-to-high-end SoC market segments by securing new customers in European and Japanese markets. Recognized for its technology by global IT and automotive companies such as Google and Tesla.Global Partnerships and Market Diversification Strategy: Maintaining a strategic partnership with Arm. Targeting the mid-to-high-end SoC market segments by securing new customers in European and Japanese markets. Recognized for its technology by global IT and automotive companies such as Google and Tesla.
- Cost Efficiency and Customized Solutions: Ensuring cost competitiveness through HLS technology that runs multiple operating systems without a hypervisor. Actively responding to customized software requirements and expanding customized product supply with the launch of SiP module products.Cost Efficiency and Customized Solutions: Ensuring cost competitiveness through HLS technology that runs multiple operating systems without a hypervisor. Actively responding to customized software requirements and expanding customized product supply with the launch of SiP module products.
- Target Industrie
- Automotive (In-Vehicle Infotainment Systems (IVI), Cockpit Systems, Advanced Driver-Assistance Systems (ADAS), Autonomous Driving, Software-Defined Vehicles (SDV), Network Gateways)Automotive (In-Vehicle Infotainment Systems (IVI), Cockpit Systems, Advanced Driver-Assistance Systems (ADAS), Autonomous Driving, Software-Defined Vehicles (SDV), Network Gateways)
- Smart HomeSmart Home
- Set-top Box and OTT (Over-The-Top)Set-top Box and OTT (Over-The-Top)
- Medical DevicesMedical Devices
- Security SystemsSecurity Systems
- Industrial AutomationIndustrial Automation
- RobotsRobots
- Smart CitySmart City
- Major Markets
- South Korea, Japan (Tokyo), China (Shenzhen, Shanghai, Dalian), SingaporeSouth Korea, Japan (Tokyo), China (Shenzhen, Shanghai, Dalian), Singapore
- Germany (Munich), France (Paris)Germany (Munich), France (Paris)
- USA (Irvine, Detroit)USA (Irvine, Detroit)
- Certifications/Patents
- Compliance with ISO 26262 (Automotive Functional Safety) standards (ASIL B/D levels). TCC8050 (Dolphin3) meets ISO26262 ASIL B grade. Axon network processor achieved ASIL-D certification.Compliance with ISO 26262 (Automotive Functional Safety) standards (ASIL B/D levels). TCC8050 (Dolphin3) meets ISO26262 ASIL B grade. Axon network processor achieved ASIL-D certification.
- Compliance with AEC-Q100 (Automotive Electronics Council) reliability standard for automotive integrated circuits.Compliance with AEC-Q100 (Automotive Electronics Council) reliability standard for automotive integrated circuits.
- Approval for Google's 'Android 15 VSR (Vendor Software Readiness) Program' (Dolphin5 chipset).Approval for Google's 'Android 15 VSR (Vendor Software Readiness) Program' (Dolphin5 chipset).
- ISO 9001 (Quality Management System) and ISO 14001 (Environmental Management System) certifications (2005).ISO 9001 (Quality Management System) and ISO 14001 (Environmental Management System) certifications (2005).
- LG Electronics and Sony Green Partner certifications (2005).LG Electronics and Sony Green Partner certifications (2005).
- Software Process Quality Certification (2011).Software Process Quality Certification (2011).
- Possession of 153 domestic and international patents (as of 2021).Possession of 153 domestic and international patents (as of 2021).
- Awarded the IR52 Jang Young-shil Award (2000).Awarded the IR52 Jang Young-shil Award (2000).
- Acquired the KT Mark (National New Technology Certification Mark) (2000).Acquired the KT Mark (National New Technology Certification Mark) (2000).
- Awarded the TTA Test & Certification Grand Prize (TCC8050) (2021).Awarded the TTA Test & Certification Grand Prize (TCC8050) (2021).
- Received the Special Corporate Award at the 21st Korea Semiconductor Design Contest (2020, AI semiconductor field).Received the Special Corporate Award at the 21st Korea Semiconductor Design Contest (2020, AI semiconductor field).
- Selected as a 'World Class 300 Company' (2015).Selected as a 'World Class 300 Company' (2015).
- Awarded 'Venture 100 Billion Company' (2017).Awarded 'Venture 100 Billion Company' (2017).
- Received the '30 Million Dollar Export Tower' award and commendation for meritorious service on Trade Day (2016).Received the '30 Million Dollar Export Tower' award and commendation for meritorious service on Trade Day (2016).
Introduction
Location
80번길 27 Geumto-ro, Sujeong-gu, Seongnam-si, Gyeonggi-do, South Korea
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