Techwing
Techwing
Description
| Target Package | BGA, TSOP, CSP, QFP, DIP, etc |
|---|---|
| Parallelism | Up to 64devices |
| Throughput | Up to 11,500 devices per hour |
| Temperature range | '-40℃ to +125℃ |
| Docking mode | Vertical docking |
| Control | Windows-based user interface LCD monitor with Touch screen |
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.