



Semi conductor equipment manufacturer, Memory test handler, FA facility
| Target Package | BGA, TSOP, CSP, QFP, DIP, etc |
|---|---|
| Parallelism | Up to 64devices |
| Throughput | Up to 11,500 devices per hour |
| Temperature range | '-40℃ to +125℃ |
| Docking mode | Vertical docking |
| Control | Windows-based user interface LCD monitor with Touch screen |