



Semi conductor equipment manufacturer, Memory test handler, FA facility
| Target Package | BGA, TSOP, CSP, MCP, POP, etc. |
|---|---|
| Parallelism | Up to 640devices |
| Throughput | Up to 31,900 devices per hour |
| Temperature range | '-40℃ to +125℃ '-55℃ to +150℃ (Optional) |
| Docking mode | Vertical docking |
| Control | Windows-based user interface LCD monitor with Touch screen |