Information
548 Gyeonggidong-ro, Hwaseong-si, Gyeonggi-do, South Korea
+82 31-8020-6111
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Overview
- Summary
- TechL, established in 1998 by experts from global semiconductor giants like Samsung Electronics, SK Hynix, and Intel, is a research and export-oriented semiconductor specialist. The company focuses on memory, outsourced semiconductor assembly and test (OSAT), and connectivity sensors. Over 80% of its annual revenue, exceeding 200 billion KRW, comes from exports. It develops and sells its own storage products and supplies them as an ODM to global corporations. TechL is recognized as a comprehensive packaging house for both memory and non-memory semiconductors, leveraging advanced SiP, bumping, and flip-chip technologies.TechL, established in 1998 by experts from global semiconductor giants like Samsung Electronics, SK Hynix, and Intel, is a research and export-oriented semiconductor specialist. The company focuses on memory, outsourced semiconductor assembly and test (OSAT), and connectivity sensors. Over 80% of its annual revenue, exceeding 200 billion KRW, comes from exports. It develops and sells its own storage products and supplies them as an ODM to global corporations. TechL is recognized as a comprehensive packaging house for both memory and non-memory semiconductors, leveraging advanced SiP, bumping, and flip-chip technologies.
- Key Products/Technologies
- The Memory Business Unit focuses on supplying internal and external memory products. Memory Cards (SD Card, microSD Card) feature UHS-I, SD 3.0 standard for high-definition and high-quality data storage. USB Memory complies with USB 3.0/2.0 specifications for high-speed processing of large files. eMMC (embedded MultiMediaCard) includes v5.1 product development and supply contracts with companies like China's KONKA. SSD (Solid State Drive) products include mSATAⅢ and 2.5-inch SATAII 64GB, 128GB, 256GB models. eUFS (embedded Universal Flash Storage) involves eUFS card product development and plans for high-performance MicroSD Express and eUFS products by Q2 2026.The Memory Business Unit focuses on supplying internal and external memory products. Memory Cards (SD Card, microSD Card) feature UHS-I, SD 3.0 standard for high-definition and high-quality data storage. USB Memory complies with USB 3.0/2.0 specifications for high-speed processing of large files. eMMC (embedded MultiMediaCard) includes v5.1 product development and supply contracts with companies like China's KONKA. SSD (Solid State Drive) products include mSATAⅢ and 2.5-inch SATAII 64GB, 128GB, 256GB models. eUFS (embedded Universal Flash Storage) involves eUFS card product development and plans for high-performance MicroSD Express and eUFS products by Q2 2026.
- The Packaging Solutions Business Unit provides customized chip packaging services. SiP (System in Package) technology is a core capability for integrating various chip components into a single package. The company possesses advanced packaging technologies such as Bumping, Flip Chip, CSP (Chip Size Package), QFN (Quad Flat No-Leads), High Power LGA (Land Grid Array), and Sensor Packages. Its Flip Chip Process utilizes Solder Bump and Cu Pillar Bump, with Bump Pitch ranging from 150um/50um to 120um/30um, and Wafer Thickness from 200um to 80um. Ultra-thin wafer processing and ultra-precision assembly technologies form the basis of its unique post-processing competitiveness.The Packaging Solutions Business Unit provides customized chip packaging services. SiP (System in Package) technology is a core capability for integrating various chip components into a single package. The company possesses advanced packaging technologies such as Bumping, Flip Chip, CSP (Chip Size Package), QFN (Quad Flat No-Leads), High Power LGA (Land Grid Array), and Sensor Packages. Its Flip Chip Process utilizes Solder Bump and Cu Pillar Bump, with Bump Pitch ranging from 150um/50um to 120um/30um, and Wafer Thickness from 200um to 80um. Ultra-thin wafer processing and ultra-precision assembly technologies form the basis of its unique post-processing competitiveness.
- The Connected Solutions Business Unit offers IoT, 5G core modules, and module SiP. IoT products include Bluetooth, WiFi Modules, and LoRa modules, with successful development and launch. The introduction of the world's smallest LoRa module SiP in 2017 demonstrates its industry-leading technology. Capabilities extend to developing Wi-Fi converged sensor solutions. Significant focus on securing technology for automotive Power Management ICs (PMIC).The Connected Solutions Business Unit offers IoT, 5G core modules, and module SiP. IoT products include Bluetooth, WiFi Modules, and LoRa modules, with successful development and launch. The introduction of the world's smallest LoRa module SiP in 2017 demonstrates its industry-leading technology. Capabilities extend to developing Wi-Fi converged sensor solutions. Significant focus on securing technology for automotive Power Management ICs (PMIC).
- Core Advantages
- An in-house R&D organization comparable to large corporations and industry-leading R&D investment. Securing R&D center sites in Osan and establishing development and production bases for new businesses to drive continuous technological innovation. The ability to timely supply creative and leading-edge products that meet customer and market demands, based on extensive development experience and differentiated know-how.An in-house R&D organization comparable to large corporations and industry-leading R&D investment. Securing R&D center sites in Osan and establishing development and production bases for new businesses to drive continuous technological innovation. The ability to timely supply creative and leading-edge products that meet customer and market demands, based on extensive development experience and differentiated know-how.
- Direct development of memory products and strong ODM/OEM/EMS supply capabilities. Maintaining top-tier partnerships with over 40 global corporations, including Samsung Electronics, Micron, Sony, and Hyundai Motor, under its own brand (GoldFlash) and through OEM, ODM, and EMS models. Positioned as Korea's sole specialized company offering customized OSAT services.Direct development of memory products and strong ODM/OEM/EMS supply capabilities. Maintaining top-tier partnerships with over 40 global corporations, including Samsung Electronics, Micron, Sony, and Hyundai Motor, under its own brand (GoldFlash) and through OEM, ODM, and EMS models. Positioned as Korea's sole specialized company offering customized OSAT services.
- Comprehensive packaging capabilities for both memory and non-memory semiconductors, utilizing advanced packaging technologies like SiP, bumping, and flip-chip. Possessing unique competitiveness in post-processing manufacturing through ultra-thin wafer processing and ultra-precision assembly technologies. Proactive response to semiconductor needs for miniaturization, higher speed, and diversified functions.Comprehensive packaging capabilities for both memory and non-memory semiconductors, utilizing advanced packaging technologies like SiP, bumping, and flip-chip. Possessing unique competitiveness in post-processing manufacturing through ultra-thin wafer processing and ultra-precision assembly technologies. Proactive response to semiconductor needs for miniaturization, higher speed, and diversified functions.
- High global market share and an export-oriented business structure. Holding the top market share in Korea and third globally for memory cards. Generating over 80% of its revenue, exceeding 200 billion KRW annually, from exports. Strengthening quality control (QC) systems to meet stringent global customer quality standards, thereby enhancing export competitiveness.High global market share and an export-oriented business structure. Holding the top market share in Korea and third globally for memory cards. Generating over 80% of its revenue, exceeding 200 billion KRW annually, from exports. Strengthening quality control (QC) systems to meet stringent global customer quality standards, thereby enhancing export competitiveness.
- Expansion into new business areas such as electric vehicles, advanced IoT, and automotive power semiconductors. Leveraging synergies and securing growth drivers through collaboration with BH Group affiliates (DKT, BH EVS, BH Semicon). Implementing a dual-site strategy with R&D in Korea and mass production in Vietnam to bolster market and cost competitiveness.Expansion into new business areas such as electric vehicles, advanced IoT, and automotive power semiconductors. Leveraging synergies and securing growth drivers through collaboration with BH Group affiliates (DKT, BH EVS, BH Semicon). Implementing a dual-site strategy with R&D in Korea and mass production in Vietnam to bolster market and cost competitiveness.
- Target Industrie
- IT Industry: Supply of internal/external memory products and storage solutions.IT Industry: Supply of internal/external memory products and storage solutions.
- Automotive Industry: Supply of automotive power semiconductors, fabless solutions for automotive electronics, and components for electric vehicles.Automotive Industry: Supply of automotive power semiconductors, fabless solutions for automotive electronics, and components for electric vehicles.
- Internet of Things (IoT) Sector: Application of IoT modules and SiP, and Wi-Fi converged sensor solutions.Internet of Things (IoT) Sector: Application of IoT modules and SiP, and Wi-Fi converged sensor solutions.
- Telecommunications Industry: Provision of 5G core modules and LoRa communication modules.Telecommunications Industry: Provision of 5G core modules and LoRa communication modules.
- Data Centers: Addressing demand for semiconductor packaging for data storage and AI servers.Data Centers: Addressing demand for semiconductor packaging for data storage and AI servers.
- Consumer Electronics and Industrial Systems: Utilization of Power Management IC (PMIC) technology.Consumer Electronics and Industrial Systems: Utilization of Power Management IC (PMIC) technology.
- Mobile Devices: Memory solutions for various portable devices such as smartphones, digital cameras, camcorders, and MP3 players.Mobile Devices: Memory solutions for various portable devices such as smartphones, digital cameras, camcorders, and MP3 players.
- Major Markets
- South Korea, China, VietnamSouth Korea, China, Vietnam
- United StatesUnited States
- Certifications/Patents
- Awarded 'Excellent Job Invention Compensation Company' certification by the Korean Intellectual Property Office (2016).Awarded 'Excellent Job Invention Compensation Company' certification by the Korean Intellectual Property Office (2016).
- Selected as a '2016 Education Donation Career Experience Certified Institution' by the Ministry of Education.Selected as a '2016 Education Donation Career Experience Certified Institution' by the Ministry of Education.
- Received the '100 Million Dollar Export Tower' award on Trade Day, organized by the Ministry of Knowledge Economy (2010).Received the '100 Million Dollar Export Tower' award on Trade Day, organized by the Ministry of Knowledge Economy (2010).
- Awarded the Minister of Trade, Industry and Energy Award (Grand Prize) at the '2014 Happy SME Management Awards'.Awarded the Minister of Trade, Industry and Energy Award (Grand Prize) at the '2014 Happy SME Management Awards'.
- Received the Presidential Silver Award at the National Quality Circle Competition (2011).Received the Presidential Silver Award at the National Quality Circle Competition (2011).
- Acquired international patent for PCB stacked semiconductor packages (July 2017).Acquired international patent for PCB stacked semiconductor packages (July 2017).
- Obtained patents related to eMMC (multi eMMC) (August 2015).Obtained patents related to eMMC (multi eMMC) (August 2015).
- Possession of world-class package design technology and the capability to develop the world's smallest LoRa SiP.Possession of world-class package design technology and the capability to develop the world's smallest LoRa SiP.
- Technical strength in the post-processing sector through ultra-thin wafer processing and ultra-precision assembly technologies.Technical strength in the post-processing sector through ultra-thin wafer processing and ultra-precision assembly technologies.
Introduction
Location
548 Gyeonggidong-ro, Hwaseong-si, Gyeonggi-do, South Korea
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