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Package Substrate Inspection System
Model Name
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Series
Semiconductor
Data
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Manufacturer information
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Synapse ImagingSemi conductor inspection system manufacturer, Inspection equipment, Measuring equipment, SMT, Wafer, FPP panel
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Manufacturer
Synapse Imaging
Brand
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SKU
34968
Product Name
Package Substrate Inspection System
Model Name
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Size
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Weight
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Product Details

Mold Substrate Inspection equipment designed for inspect defects that may occur on the top and bottom surfaces of package strip rolled out from the molding process - which is one of semiconductor package production processes. This product uses 2D/3D vision system to inspect incomplete mold, crack, exposed base metal and mold thickness on the top side mold and land contamination, PCB swelling, dent and heavy flash on the bottom side of PCB. This is an optical inspection equipment that combined 2D and 3D vision technologies to detect 3D quality defects which are difficult to catch detect in 2D inspection.

Synapse Imaging Package Substrate Inspection System

Synapse ImagingSemi conductor inspection system manufacturer, Inspection equipment, Measuring equipment, SMT, Wafer, FPP panel
Based on the key policy “We make only number one quality products leading market,” Synapse Imaging has been focusing on development of advanced new technologies and competitive products every year to provide more value to customers. Various automated optical inspection systems developed by our company have been received the best reputation in the semiconductor IC packaging industry for over ten years since our foundation in year 2002. Also, we have been extending application of our unrivalled inspection technologies to various other electronic industrial areas such as Display panel, PCB, SMT, Green Sheet, LED and mobile phone manufacturing processes. Our 3D solder paste inspection system features its outstanding performance compared to the existing other 3D SPI systems in terms of speed and precision in 3D measurement. We have received a “Technology Innovation Award” AT Nepcon Shanghai Exhibition, which is one of the largest global electronic assembly equipment exhibitions. Based on the diverse technologies and experiences, various market-leading 3D/2D combined inspection systems including Semiconductor substrate inspection system, Green sheet inspection system, FC bump inspection system, Wafer inspection system and 3D scanner are among our best sellers. Recently, we developed successfully a series of automated optical inspection systems for OLED/LCD display and TSP manufacturing processes for SMART phone devices and are extending the scope of the products to the new display panel markets. Synapse Imaging will continue to develop new inspection technologies to meet demand on cutting edge manufacturing technologies and keep up the leader in the global market of automated optical inspection systems.
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