Information
Schleißheimer Str. 90, 85748 Garching bei München, Germany
+49 89 444433422
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Overview
- Summary
- SUSS is a leading supplier of equipment and process solutions for micro-structuring applications, boasting over 75 years of engineering experience. Its comprehensive portfolio encompasses back-end lithography, wafer bonding, and photomask processing solutions. The company's equipment solutions find application in a wide array of manufacturing processes for daily and industrial use, including memory chips, mobile phone cameras, and tire pressure sensors.SUSS is a leading supplier of equipment and process solutions for micro-structuring applications, boasting over 75 years of engineering experience. Its comprehensive portfolio encompasses back-end lithography, wafer bonding, and photomask processing solutions. The company's equipment solutions find application in a wide array of manufacturing processes for daily and industrial use, including memory chips, mobile phone cameras, and tire pressure sensors.
- Key Products/Technologies
- Imaging Solutions: UV scanning mask alignment equipment and UV projection scanners. The SUSS MA/BA Gen4 Pro series offers patterning resolution below 0.5 µm and alignment accuracy of 0.25 µm, providing full-field lithography solutions for MEMS, advanced packaging, 3D integration, and compound semiconductor markets. The MA8 Gen5 is a mask aligner for various imprint applications in LED, MEMS/NEMS, micro-optics, augmented reality, and optoelectronic sensors.Imaging Solutions: UV scanning mask alignment equipment and UV projection scanners. The SUSS MA/BA Gen4 Pro series offers patterning resolution below 0.5 µm and alignment accuracy of 0.25 µm, providing full-field lithography solutions for MEMS, advanced packaging, 3D integration, and compound semiconductor markets. The MA8 Gen5 is a mask aligner for various imprint applications in LED, MEMS/NEMS, micro-optics, augmented reality, and optoelectronic sensors.
- Bonding Solutions: Permanent and temporary bonding equipment. The SB8 Gen2 wafer bonder is a semi-automated universal wafer bonding system capable of handling wafers up to 200mm, featuring precise temperature control from 30°C to 500°C and uniform bond forces from 300N to 20kN. This platform is ideal for a wide variety of bonding technologies, including anodic bonding, fusion bonding, eutectic bonding, adhesive bonding, and diffusion bonding.Bonding Solutions: Permanent and temporary bonding equipment. The SB8 Gen2 wafer bonder is a semi-automated universal wafer bonding system capable of handling wafers up to 200mm, featuring precise temperature control from 30°C to 500°C and uniform bond forces from 300N to 20kN. This platform is ideal for a wide variety of bonding technologies, including anodic bonding, fusion bonding, eutectic bonding, adhesive bonding, and diffusion bonding.
- Coating Solutions: Inkjet printing, coating, and developing equipment. SUSS spin coaters, developers, and spray coaters are renowned for their consistency, available in bench-top, free-standing, and automated configurations. The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput, and modular photolithography processing for 200mm and 300mm wafers.Coating Solutions: Inkjet printing, coating, and developing equipment. SUSS spin coaters, developers, and spray coaters are renowned for their consistency, available in bench-top, free-standing, and automated configurations. The ACS300 Gen2 is a modular cluster system designed to meet manufacturers' needs for clean, reliable, high-throughput, and modular photolithography processing for 200mm and 300mm wafers.
- Photomask Solutions: Cleaning, baking, and developing equipment. The HMx Square is designed for high-quality substrate processing for photomask applications, optoelectronics, OLED, and special semiconductor back-end (MEMS) applications, offering develop, etch, and cleaning functionalities. The MaskTrack X GlueBuster is a pellicle glue removal system supporting the maintenance of 193i lithography photomasks.Photomask Solutions: Cleaning, baking, and developing equipment. The HMx Square is designed for high-quality substrate processing for photomask applications, optoelectronics, OLED, and special semiconductor back-end (MEMS) applications, offering develop, etch, and cleaning functionalities. The MaskTrack X GlueBuster is a pellicle glue removal system supporting the maintenance of 193i lithography photomasks.
- Core Advantages
- Extensive Engineering Experience and Technology Leadership: As the manufacturer of the world's first mask aligner, the company is a recognized technology leader in back-end lithography, wafer bonding, and photomask processing.Extensive Engineering Experience and Technology Leadership: As the manufacturer of the world's first mask aligner, the company is a recognized technology leader in back-end lithography, wafer bonding, and photomask processing.
- Comprehensive Solution Portfolio: Provision of solutions covering all performance-relevant steps for wafer processing, including coating, baking, developing, aligning, wafer bonding, and photomask cleaning equipment.Comprehensive Solution Portfolio: Provision of solutions covering all performance-relevant steps for wafer processing, including coating, baking, developing, aligning, wafer bonding, and photomask cleaning equipment.
- Contribution to Next-Generation Technologies: Close cooperation with research institutes and industry partners to advance next-generation technologies such as 3D integration, nanoimprint lithography, and key processes for WLP, MEMS, and LED manufacturing.Contribution to Next-Generation Technologies: Close cooperation with research institutes and industry partners to advance next-generation technologies such as 3D integration, nanoimprint lithography, and key processes for WLP, MEMS, and LED manufacturing.
- Global Infrastructure and Service Support: A global infrastructure for applications and service, supporting over 8,000 installed systems worldwide.Global Infrastructure and Service Support: A global infrastructure for applications and service, supporting over 8,000 installed systems worldwide.
- High Precision and Throughput: Offering cost-effective solutions with unsurpassed quality and cutting-edge technology, enabling customers to maximize yield at high throughput and reduce cost of ownership.High Precision and Throughput: Offering cost-effective solutions with unsurpassed quality and cutting-edge technology, enabling customers to maximize yield at high throughput and reduce cost of ownership.
- Addressing AI and High-Bandwidth Memory (HBM) Demand: Provision of temporary wafer bonding solutions and processes crucial for the production of microchips required for AI applications.Addressing AI and High-Bandwidth Memory (HBM) Demand: Provision of temporary wafer bonding solutions and processes crucial for the production of microchips required for AI applications.
- Target Industries
- Semiconductor Industry: Manufacturing of memory chips, processors, MEMS, LEDs, and other microsystem components.Semiconductor Industry: Manufacturing of memory chips, processors, MEMS, LEDs, and other microsystem components.
- Advanced Packaging: Flip-chip, WLCSP, FOWLP, and 2.5D/3D packaging technologies.Advanced Packaging: Flip-chip, WLCSP, FOWLP, and 2.5D/3D packaging technologies.
- MEMS (Micro-Electro-Mechanical Systems): Key components in automotive, industrial, medical, aerospace, and consumer applications.MEMS (Micro-Electro-Mechanical Systems): Key components in automotive, industrial, medical, aerospace, and consumer applications.
- LED (Light Emitting Diode): Optoelectronic devices, consumer electronics, automotive, and general lighting applications.LED (Light Emitting Diode): Optoelectronic devices, consumer electronics, automotive, and general lighting applications.
- Research and Development: University electronics, material science, renewable energy groups, and semiconductor manufacturing and research departments.Research and Development: University electronics, material science, renewable energy groups, and semiconductor manufacturing and research departments.
- Major Markets
- Taiwan, South Korea, China, Japan, Southeast AsiaTaiwan, South Korea, China, Japan, Southeast Asia
- Germany, France, Netherlands, Scandinavia, United Kingdom, IrelandGermany, France, Netherlands, Scandinavia, United Kingdom, Ireland
- United StatesUnited States
- Certifications/Patents
- ISO 9001 certification for its quality management system.ISO 9001 certification for its quality management system.
- Equipment design in accordance with SEMI S1-0701E, S2-0706D, S8-0308, S13-0305, and CE standards.Equipment design in accordance with SEMI S1-0701E, S2-0706D, S8-0308, S13-0305, and CE standards.
- Technical strengths: Precision alignment platforms and chuck technologies enabling consistent CD control and sub-micron overlay. Evolution of bonder technology from anodic and thermo-compression to fusion/hybrid bonding for 3D integration and micro-bump/RDL process enablement.Technical strengths: Precision alignment platforms and chuck technologies enabling consistent CD control and sub-micron overlay. Evolution of bonder technology from anodic and thermo-compression to fusion/hybrid bonding for 3D integration and micro-bump/RDL process enablement.
- Innovation in technology development: Contribution to the advancement of next-generation technologies such as 3D integration and nanoimprint lithography.Innovation in technology development: Contribution to the advancement of next-generation technologies such as 3D integration and nanoimprint lithography.
Introduction
Location
Schleißheimer Str. 90, 85748 Garching bei München, Germany
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