Stemco, The Republic of Korea - Komachine Supplier Profile and Product List

- Stemco Co., Ltd. is a specialized high-integrated circuit film company established in 1995 as a joint venture between Japan's TORAY and Samsung Electro-mechanics. The company primarily produces core components for flat panel displays, including COF, TAB, and SP FILM. It has transitioned from relying on Japanese technology to developing its own proprietary technologies and utilizing domestic raw materials and equipment. Stemco leads the TCP market by successfully mass-producing the world's first 2-Metal COF. The company aims to become a key player in the display and semiconductor industries.Stemco Co., Ltd. is a specialized high-integrated circuit film company established in 1995 as a joint venture between Japan's TORAY and Samsung Electro-mechanics. The company primarily produces core components for flat panel displays, including COF, TAB, and SP FILM. It has transitioned from relying on Japanese technology to developing its own proprietary technologies and utilizing domestic raw materials and equipment. Stemco leads the TCP market by successfully mass-producing the world's first 2-Metal COF. The company aims to become a key player in the display and semiconductor industries.
- COF (Chip On Film): Flexible circuit boards for driver packages, featuring fine circuits formed on thin films and mounting display driver ICs. Applicable to high-resolution displays such as FHD and UHD. Specifications include single-sided circuit boards, Subtractive & Additive methods, product width of 35/48/70/125mm, minimum 18㎛ Pitch for Inner Lead (DDI mounted circuit), and PI Film thicknesses of 38/30/25㎛.COF (Chip On Film): Flexible circuit boards for driver packages, featuring fine circuits formed on thin films and mounting display driver ICs. Applicable to high-resolution displays such as FHD and UHD. Specifications include single-sided circuit boards, Subtractive & Additive methods, product width of 35/48/70/125mm, minimum 18㎛ Pitch for Inner Lead (DDI mounted circuit), and PI Film thicknesses of 38/30/25㎛.
- 2-Metal COF: Products with circuits formed on both sides, offering superior circuit accumulation and heat dissipation compared to conventional COF. Optimized solutions for mobile devices, high-resolution large TVs, and wearable devices. Specifications include double-sided circuit boards, Additive method, product width of 35/48/70 mm, minimum 18㎛ Pitch for Inner Lead (DDI mounted circuit), and PI Film thicknesses of 35/25㎛.2-Metal COF: Products with circuits formed on both sides, offering superior circuit accumulation and heat dissipation compared to conventional COF. Optimized solutions for mobile devices, high-resolution large TVs, and wearable devices. Specifications include double-sided circuit boards, Additive method, product width of 35/48/70 mm, minimum 18㎛ Pitch for Inner Lead (DDI mounted circuit), and PI Film thicknesses of 35/25㎛.
- TAB Film (Tape Automated Bonding): A packaging method for mounting multiple semiconductor leads, consisting of a 3-layer structure with polyimide film, adhesive, and copper foil. Primarily used for display driver ICs since its introduction in the late 1980s.TAB Film (Tape Automated Bonding): A packaging method for mounting multiple semiconductor leads, consisting of a 3-layer structure with polyimide film, adhesive, and copper foil. Primarily used for display driver ICs since its introduction in the late 1980s.
- ID-Coil (Inductor Coil): Components designed to store energy or provide stable power supply to ICs in electronic devices. A new business area, with factory expansion and significant investment in human and material resources for upcoming mass production.ID-Coil (Inductor Coil): Components designed to store energy or provide stable power supply to ICs in electronic devices. A new business area, with factory expansion and significant investment in human and material resources for upcoming mass production.
- FP-Coil (Fine Pitch Coil): A product for driving actuators used in camera image stabilization, manufactured by stacking high-precision circuits and insulation layers on thin film. This technology replaces traditional wire coils.FP-Coil (Fine Pitch Coil): A product for driving actuators used in camera image stabilization, manufactured by stacking high-precision circuits and insulation layers on thin film. This technology replaces traditional wire coils.
- Core Technologies: Reel-to-Reel continuous production technology for flexible substrates without interruption. Fine Pattern technology including etching processes with minimum 18㎛ Pitch (MP) and 16㎛ Pitch (under development), and Semi Additive methods for 1-Metal & 2-Metal with minimum 18㎛ Pitch (MP) and 14㎛ Pitch (ER). Automatic inspection technology with camera resolutions of 1.5㎛/pixel and 2.0㎛/pixel. Double-sided substrate technology and AI-integrated real-time monitoring systems for process control.Core Technologies: Reel-to-Reel continuous production technology for flexible substrates without interruption. Fine Pattern technology including etching processes with minimum 18㎛ Pitch (MP) and 16㎛ Pitch (under development), and Semi Additive methods for 1-Metal & 2-Metal with minimum 18㎛ Pitch (MP) and 14㎛ Pitch (ER). Automatic inspection technology with camera resolutions of 1.5㎛/pixel and 2.0㎛/pixel. Double-sided substrate technology and AI-integrated real-time monitoring systems for process control.
- World's First 2-Metal COF Mass Production: Successful mass production of the world's first 2-Metal COF for flexible mobile displays in 2014, providing optimized solutions for high-spec displays, mobile, and wearable devices, demonstrating technological leadership.World's First 2-Metal COF Mass Production: Successful mass production of the world's first 2-Metal COF for flexible mobile displays in 2014, providing optimized solutions for high-spec displays, mobile, and wearable devices, demonstrating technological leadership.
- Proprietary Technology Development and Localization Capabilities: Transition from reliance on Japanese technology and imported raw materials to developing its own technologies and utilizing domestic raw materials and equipment for product manufacturing.Proprietary Technology Development and Localization Capabilities: Transition from reliance on Japanese technology and imported raw materials to developing its own technologies and utilizing domestic raw materials and equipment for product manufacturing.
- Comprehensive Quality and Environmental Management Systems: Attainment of numerous domestic and international certifications including ISO 9001, ISO 14001, ISO 45001, ISO 50001, and IATF 16949 (automotive quality management system), establishing a management system compliant with global standards.Comprehensive Quality and Environmental Management Systems: Attainment of numerous domestic and international certifications including ISO 9001, ISO 14001, ISO 45001, ISO 50001, and IATF 16949 (automotive quality management system), establishing a management system compliant with global standards.
- Advanced Production Processes and Smart Factory Implementation: Reel-to-Reel continuous production technology, fine pattern etching technology, and an AI-integrated real-time monitoring smart factory system, enhancing outbound quality assurance and securing cost competitiveness.Advanced Production Processes and Smart Factory Implementation: Reel-to-Reel continuous production technology, fine pattern etching technology, and an AI-integrated real-time monitoring smart factory system, enhancing outbound quality assurance and securing cost competitiveness.
- Continuous R&D Investment and Patent Activities: Establishment of a research institute in 2007, over 15 patent applications in the last three years, and ongoing aggressive investment in smart factory development.Continuous R&D Investment and Patent Activities: Establishment of a research institute in 2007, over 15 patent applications in the last three years, and ongoing aggressive investment in smart factory development.
- Extensive Award History: Recognition including Samsung Electronics Best Supplier Award (2005), 100 Million Dollar Export Tower (2006), Industrial Service Medal (2013), Presidential Commendation for Job Creation (2014), 200 Million Dollar Export Tower (2018), Presidential Commendation for National Productivity Award (2020), Dongtap Industrial Medal (2021), and two consecutive Korea Excellent Patent Awards (2022, 2023).Extensive Award History: Recognition including Samsung Electronics Best Supplier Award (2005), 100 Million Dollar Export Tower (2006), Industrial Service Medal (2013), Presidential Commendation for Job Creation (2014), 200 Million Dollar Export Tower (2018), Presidential Commendation for National Productivity Award (2020), Dongtap Industrial Medal (2021), and two consecutive Korea Excellent Patent Awards (2022, 2023).
- Commitment to Eco-Friendly Management: Designation as a Green Company by the Ministry of Environment (2019, re-designated in 2022) and active utilization of eco-friendly energy sources such as solar power and steam recycling, fulfilling corporate social responsibility.Commitment to Eco-Friendly Management: Designation as a Green Company by the Ministry of Environment (2019, re-designated in 2022) and active utilization of eco-friendly energy sources such as solar power and steam recycling, fulfilling corporate social responsibility.
- Flat Panel Display IndustryFlat Panel Display Industry
- High-Resolution Display (FHD, UHD TV) Manufacturing IndustryHigh-Resolution Display (FHD, UHD TV) Manufacturing Industry
- Mobile Device (Smartphone) Manufacturing IndustryMobile Device (Smartphone) Manufacturing Industry
- Wearable Device Manufacturing IndustryWearable Device Manufacturing Industry
- Semiconductor IndustrySemiconductor Industry
- Camera Module Manufacturing IndustryCamera Module Manufacturing Industry
- Greater ChinaGreater China
- ISO 9001 (Quality Management System)ISO 9001 (Quality Management System)
- IATF 16949 (Automotive Quality Management System)IATF 16949 (Automotive Quality Management System)
- ISO 14001 (Environmental Management System)ISO 14001 (Environmental Management System)
- ISO 45001 (Occupational Health and Safety Management System)ISO 45001 (Occupational Health and Safety Management System)
- ISO 50001 (Energy Management System)ISO 50001 (Energy Management System)
- Green Company Designation by the Ministry of Environment (2019, re-designated 2022)Green Company Designation by the Ministry of Environment (2019, re-designated 2022)
- Korea Excellent Patent Award (Electronics & IT Sector, 2022, 2023)Korea Excellent Patent Award (Electronics & IT Sector, 2022, 2023)
- Over 15 Patent Applications in the Last 3 YearsOver 15 Patent Applications in the Last 3 Years