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Auto Solder Ball Placement System for Flip Chip
Model Name
BPS-7200FC
Series
Semiconductor Packaging Equipment
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Data
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Manufacturer information
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SSP

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more

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Manufacturer
SSP
Product Type
Machine
Brand
-
SKU
36036
Product Name
Auto Solder Ball Placement System for Flip Chip
Model Name
BPS-7200FC
Size
-
Weight
-
Product Details

SSP Auto Solder Ball Placement System for Flip Chip BPS-7200FC

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SSP
SSP
Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more
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