Information
8700 Morrissette Dr, West Springfield, VA 22152, USA
+1 703-440-9512
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Overview
- Summary
- SONIX is a pioneering company that has driven breakthroughs in defect detection and process productivity for semiconductor manufacturers since 1986. The company specializes in scanning acoustic microscope (SAM) technology for nondestructive inspection of bonded wafers, packaged semiconductors, and industrial products. It continuously develops new ultrasonic technologies and applications to ensure future innovation quality. Global manufacturers rely on its nondestructive inspection solutions for quality assurance.SONIX is a pioneering company that has driven breakthroughs in defect detection and process productivity for semiconductor manufacturers since 1986. The company specializes in scanning acoustic microscope (SAM) technology for nondestructive inspection of bonded wafers, packaged semiconductors, and industrial products. It continuously develops new ultrasonic technologies and applications to ensure future innovation quality. Global manufacturers rely on its nondestructive inspection solutions for quality assurance.
- Key Products/Technologies
- **ECHO™ Scanning Acoustic Microscope Series**: A universal inspection tool for semiconductor package development, production, and failure analysis. Capable of detecting air defects as thin as 0.05 microns and spatially resolving defects down to 10 microns. Suitable for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection, and traditional plastic packages.**ECHO™ Scanning Acoustic Microscope Series**: A universal inspection tool for semiconductor package development, production, and failure analysis. Capable of detecting air defects as thin as 0.05 microns and spatially resolving defects down to 10 microns. Suitable for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection, and traditional plastic packages.
- **ECHO VS™**: A system offering industry-leading image quality and defect identification capabilities. Includes specialized features for clear imaging of Cu pillars, molded flip chips (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. Detects minute air defects as small as 0.01 microns and resolves defects down to 5 microns.**ECHO VS™**: A system offering industry-leading image quality and defect identification capabilities. Includes specialized features for clear imaging of Cu pillars, molded flip chips (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. Detects minute air defects as small as 0.01 microns and resolves defects down to 5 microns.
- **ECHO Pro**: A system with fully automated handling for 100% package inspection in high-volume production environments.**ECHO Pro**: A system with fully automated handling for 100% package inspection in high-volume production environments.
- **AutoWafer™**: A wafer-level SAM system for nondestructive testing (NDT) of wafers, providing high-resolution identification of bond defects in MEMS, CMOS, memory, TSV, and LED applications. Features robotic cassette handling and sorting of approved and failed wafers for increased production speed.**AutoWafer™**: A wafer-level SAM system for nondestructive testing (NDT) of wafers, providing high-resolution identification of bond defects in MEMS, CMOS, memory, TSV, and LED applications. Features robotic cassette handling and sorting of approved and failed wafers for increased production speed.
- **AutoWafer Pro**: A Class 1 high-resolution tool for 200-300mm wafers, supporting FOUP, FOSB, SMIFF, and cassettes.**AutoWafer Pro**: A Class 1 high-resolution tool for 200-300mm wafers, supporting FOUP, FOSB, SMIFF, and cassettes.
- **S-series Ultrasonic NDT Transducers**: Transducers designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. Offers transducers in 35-75 MHz and 110 MHz-UHF bands.**S-series Ultrasonic NDT Transducers**: Transducers designed in-house to meet the demanding nondestructive testing requirements of semiconductor manufacturing. Offers transducers in 35-75 MHz and 110 MHz-UHF bands.
- **Advanced Imaging Software**: Includes TAMI and ICEBERG imaging software, 3D rendering, simulated scanning, frequency domain imaging, and auto-analysis capabilities.**Advanced Imaging Software**: Includes TAMI and ICEBERG imaging software, 3D rendering, simulated scanning, frequency domain imaging, and auto-analysis capabilities.
- Core Advantages
- **Pioneering Technological Innovation History**: Since its establishment in 1986, the company has pioneered numerous breakthroughs in defect detection and process productivity for semiconductors. Key innovations include the industry's first PC-based nondestructive testing system in 1987 and the first IC inspection system in 1990, demonstrating continuous innovation.**Pioneering Technological Innovation History**: Since its establishment in 1986, the company has pioneered numerous breakthroughs in defect detection and process productivity for semiconductors. Key innovations include the industry's first PC-based nondestructive testing system in 1987 and the first IC inspection system in 1990, demonstrating continuous innovation.
- **Dominant Market Leadership**: The world's largest supplier of automated ultrasonic solutions for nondestructive wafer inspection, holding over 70% market share. This reflects strong market dominance based on technological prowess and reliability.**Dominant Market Leadership**: The world's largest supplier of automated ultrasonic solutions for nondestructive wafer inspection, holding over 70% market share. This reflects strong market dominance based on technological prowess and reliability.
- **Highest Resolution and Precision**: The ECHO system offers defect detection of air gaps as thin as 0.05 microns and spatial resolution down to 10 microns. The ECHO VS provides ultra-high resolution, detecting air defects as small as 0.01 microns and resolving defects down to 5 microns.**Highest Resolution and Precision**: The ECHO system offers defect detection of air gaps as thin as 0.05 microns and spatial resolution down to 10 microns. The ECHO VS provides ultra-high resolution, detecting air defects as small as 0.01 microns and resolving defects down to 5 microns.
- **Broad Application Scope and Flexibility**: Provides nondestructive inspection solutions for a wide range of materials, including bonded wafers, packaged semiconductors, and industrial products. Supports inspection of diverse semiconductor package and wafer types such as MEMS, CMOS, memory, TSV, LED, flip chips, CSP, MCM, and stacked dies.**Broad Application Scope and Flexibility**: Provides nondestructive inspection solutions for a wide range of materials, including bonded wafers, packaged semiconductors, and industrial products. Supports inspection of diverse semiconductor package and wafer types such as MEMS, CMOS, memory, TSV, LED, flip chips, CSP, MCM, and stacked dies.
- **Global Service and Support Network**: Maintains offices and regional representatives in major wafer and packaged semiconductor manufacturing centers worldwide, ensuring rapid response to customer needs. Offers services dedicated to collaborative problem-solving to advance customer business and technical capabilities.**Global Service and Support Network**: Maintains offices and regional representatives in major wafer and packaged semiconductor manufacturing centers worldwide, ensuring rapid response to customer needs. Offers services dedicated to collaborative problem-solving to advance customer business and technical capabilities.
- **Strong Parent Company Support**: As part of Tektronix and backed by Ralliant, a $6 billion diversified industrial growth company, it benefits from financial stability and access to extensive resources. This provides a solid foundation for long-term R&D investment and technological development.**Strong Parent Company Support**: As part of Tektronix and backed by Ralliant, a $6 billion diversified industrial growth company, it benefits from financial stability and access to extensive resources. This provides a solid foundation for long-term R&D investment and technological development.
- Target Industries
- Semiconductor Manufacturing (wafer and package inspection)Semiconductor Manufacturing (wafer and package inspection)
- MicroelectronicsMicroelectronics
- MEMS (Microelectromechanical Systems)MEMS (Microelectromechanical Systems)
- Automotive Components (case hardness depth measurement)Automotive Components (case hardness depth measurement)
- Medical Devices (medical packaging)Medical Devices (medical packaging)
- Capacitor Manufacturing (failure analysis and process control)Capacitor Manufacturing (failure analysis and process control)
- Ceramics (defect root cause and location identification)Ceramics (defect root cause and location identification)
- Industrial Products (nondestructive inspection)Industrial Products (nondestructive inspection)
- Major Markets
- China, South Korea, Taiwan, MalaysiaChina, South Korea, Taiwan, Malaysia
- Across Europe (offices and regional representatives)Across Europe (offices and regional representatives)
- United States (Headquarters in Springfield, Virginia)United States (Headquarters in Springfield, Virginia)
- Certifications/Patents
- **ISO 2001 Certification**: Achieved in 2004.**ISO 2001 Certification**: Achieved in 2004.
- **U.S. Patent 12417935**: Systems, methods and apparatus for dispensing fluid to an object.**U.S. Patent 12417935**: Systems, methods and apparatus for dispensing fluid to an object.
- **U.S. Patent 11779940**: Systems, methods and apparatus for dispensing fluid to an object.**U.S. Patent 11779940**: Systems, methods and apparatus for dispensing fluid to an object.
- **U.S. Patent 10663434**: Wafer chuck.**U.S. Patent 10663434**: Wafer chuck.
- **U.S. Patent 8909492**: Ultrasonic inspection using acoustic modeling.**U.S. Patent 8909492**: Ultrasonic inspection using acoustic modeling.
- **Automated Inspection Method and Apparatus Patent**: Technology utilizing difference images and neural networks for defect classification.**Automated Inspection Method and Apparatus Patent**: Technology utilizing difference images and neural networks for defect classification.
Introduction
Location
8700 Morrissette Dr, West Springfield, VA 22152, USA
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