A company commercializing the world's first Equal Speed Asymmetric Rolling (ESAR) technology, achieving ultra-thinning of high-strength metal materials such as copper, copper alloys, stainless steel, and electrical steel, leading core material technologies for the 4th Industrial Revolution.Acompanycommercializingtheworld'sfirstEqualSpeedAsymmetricRolling(ESAR)technology,achievingultra-thinningofhigh-strengthmetalmaterialssuchascopper,copperalloys,stainlesssteel,andelectricalsteel,leadingcorematerialtechnologiesforthe4thIndustrialRevolution.
Key Products/TechnologiesKeyProducts/Technologies
Development capabilities for ultra-thin rolled sheets based on Equal Speed Asymmetric Rolling (ESAR) technology. This technology is applicable to various metal materials including stainless steel, copper alloys, and superconducting wires.Developmentcapabilitiesforultra-thinrolledsheetsbasedonEqualSpeedAsymmetricRolling(ESAR)technology.Thistechnologyisapplicabletovariousmetalmaterialsincludingstainlesssteel,copperalloys,andsuperconductingwires.
ESAR-μFoil STS, an ultra-thin 10㎛ stainless steel foil product, serving as a core material for advanced industries such as all-solid-state batteries, medical micro-devices, semiconductors, and precision electronic devices.ESAR-μFoilSTS,anultra-thin10㎛stainlesssteelfoilproduct,servingasacorematerialforadvancedindustriessuchasall-solid-statebatteries,medicalmicro-devices,semiconductors,andprecisionelectronicdevices.
Possession of lithium material technology realizing high energy density and fast charging speed for secondary battery anode materials. Providing solutions for anode current collector issues in next-generation all-solid-state batteries and lithium-metal batteries.Possessionoflithiummaterialtechnologyrealizinghighenergydensityandfastchargingspeedforsecondarybatteryanodematerials.Providingsolutionsforanodecurrentcollectorissuesinnext-generationall-solid-statebatteriesandlithium-metalbatteries.
High-strength and ultra-thin copper materials with excellent flexibility and durability, maximizing the performance of automotive electronic components. Ultra-thin copper alloy materials for IT device camera modules, enhancing camera performance by reducing light scattering and reflection at edges.High-strengthandultra-thincoppermaterialswithexcellentflexibilityanddurability,maximizingtheperformanceofautomotiveelectroniccomponents.Ultra-thincopperalloymaterialsforITdevicecameramodules,enhancingcameraperformancebyreducinglightscatteringandreflectionatedges.
Thin Plate hot Forging (TPForge) technology, an innovative process simultaneously forming both sides of thin metal plates, utilized in manufacturing metal separators for Solid Oxide Fuel Cells (SOFC) and Solid Oxide Electrolysis Cells (SOEC). Development capabilities for high-strength, high-pressure resistant seamless tubes for special purposes, manufactured using cold pilgering technology.ThinPlatehotForging(TPForge)technology,aninnovativeprocesssimultaneouslyformingbothsidesofthinmetalplates,utilizedinmanufacturingmetalseparatorsforSolidOxideFuelCells(SOFC)andSolidOxideElectrolysisCells(SOEC).Developmentcapabilitiesforhigh-strength,high-pressureresistantseamlesstubesforspecialpurposes,manufacturedusingcoldpilgeringtechnology.
Core AdvantagesCoreAdvantages
Exclusive original technology commercializing the world's first Equal Speed Asymmetric Rolling (ESAR) technology, enabling ultra-thinning of high-strength metal materials.Exclusiveoriginaltechnologycommercializingtheworld'sfirstEqualSpeedAsymmetricRolling(ESAR)technology,enablingultra-thinningofhigh-strengthmetalmaterials.
Ability to dramatically improve material properties without changing alloy composition and to realize ultra-thin, high-strength, high-ductility materials beyond the limitations of conventional processes.Abilitytodramaticallyimprovematerialpropertieswithoutchangingalloycompositionandtorealizeultra-thin,high-strength,high-ductilitymaterialsbeyondthelimitationsofconventionalprocesses.
Broad applicability across critical future industries, including secondary batteries, semiconductors, electronic components, automotive electronic parts, IT devices, and fuel cells.Broadapplicabilityacrosscriticalfutureindustries,includingsecondarybatteries,semiconductors,electroniccomponents,automotiveelectronicparts,ITdevices,andfuelcells.
Competitive edge in localizing materials and leading the global market by achieving superior properties compared to ultra-thin rolled materials previously dependent on material powerhouses like Japan and Germany.Competitiveedgeinlocalizingmaterialsandleadingtheglobalmarketbyachievingsuperiorpropertiescomparedtoultra-thinrolledmaterialspreviouslydependentonmaterialpowerhouseslikeJapanandGermany.
World's first development of Thin Plate hot Forging (TPForge) technology, forming both sides of thin steel plates with different shapes, thereby reducing processing time and securing price competitiveness.World'sfirstdevelopmentofThinPlatehotForging(TPForge)technology,formingbothsidesofthinsteelplateswithdifferentshapes,therebyreducingprocessingtimeandsecuringpricecompetitiveness.
Consistent recognition of technological prowess and growth potential, including selection for Deep Tech TIPS in 2024, NextRise Innovation Award in 2025, 'Baby Unicorn' by the Ministry of SMEs and Startups in 2025, and CES Innovation Award in 2026.Consistentrecognitionoftechnologicalprowessandgrowthpotential,includingselectionforDeepTechTIPSin2024,NextRiseInnovationAwardin2025,'BabyUnicorn'bytheMinistryofSMEsandStartupsin2025,andCESInnovationAwardin2026.
Target IndustriesTargetIndustries
Secondary battery industry (anode current collectors for all-solid-state batteries, lithium-metal batteries, lithium-sulfur batteries, etc.).Secondarybatteryindustry(anodecurrentcollectorsforall-solid-statebatteries,lithium-metalbatteries,lithium-sulfurbatteries,etc.).
Semiconductor and precision electronic device industries.Semiconductorandprecisionelectronicdeviceindustries.