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SHINDO

SHINDO

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SHINDO

SHINDO

Assembly Machine

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Description

summary 
This equipment automatically matches LCD Panel on the Alignment Mark in order to perform Assembly process.
After that, it maintains the Gap between board by pressurizing and close adhesion; then it irradiates the ultraviolet rays to seal the board. 


Specifications 
- Work Size
①Max. 300 x 400mm (The minimum Size: 2 Inch)
②Thickness: 0.2t, 0.5t, 0.7t, 1.0t, 1.4t
③The upper part board: 2∼15inch (Consultation issue)
④The under board: 2∼15inch (Consultation issue)
□Up/Down board: Up and down relations during the assembly process in the device
- Process capacity: 60secs/sheet
- Align degree after assembly: 0±2㎛ (during glass usage) 
- Board Contact Range
①Image side: 5mm from the board section
②Image opposite side
- Board material
①The upper part board: Al
②The under board: Quarts
- Press parts
①Surface plate pressure set-up range: 0 ∼ 1Kg/cm2
②Pressure setting resolving power: 0.005Kg/cm2
③Control setting unit: 0.001Kg/cm
④Load Cell setting: Servo control
⑤Exclusive controller use 

  
Product Features  

In LCD assembling process, this is for AUTO CCD 
Alignment to assemble two pieces of glass panel 
- High-precision Alignment 
- Competitive price  
  
  
Exporting Country : Taipei 
  
 

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.