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(15)
Product
TO-220
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Product
QFP : Quad Flat Package
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QFP : Quad Flat Package
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Micro SD Card : Micro Secure Digital Card
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SD Card : Secure Digital Card
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Micro SD Card : Micro Secure Digital Card
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Micro SD Card : Micro Secure Digital Card
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DIP : Dual In‐line Package
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DIP : Dual In-line Package
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SOP :Small Outline Package
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SOP : Small Outline Package
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TSOP : Thin Small Outline Package
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TSOP : Thin Small Outline Package
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QFN : Quad Flat No Leads
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QFN : Quad Flat No Leads
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SIP : System in Package
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SIP : System in Package
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Product
PBGA : Plastic Ball Grid Array
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PBGA : Plastic Ball Grid Array
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Product
FBGA Stack Die
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FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
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Product
FBGA : Fine‐pitch Ball Grid Array
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FBGA : Fine-pitch Ball Grid Array
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Product
FCCSP : Flip Chip Chip Scale Package
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FCCSP : Flip Chip Chip Scale Package
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Product
FCBGA : Flip Chip Ball Grid Array
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FCBGA : Flip Chip Ball Grid Array
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Product
CoC, CoW: Chip on Chip, Chip on Wafer
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CoC, CoW : Chip on Chip, Chip on Wafer
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Information
16 Baekseokgongdan 7-ro, Seobuk-gu, Cheonan, Chungcheongnam-do, South Korea
http://www.sfasemicon.com/
+82 41-520-6400
+82 41-520-7490
gyuho.lee@sfasemicon.com
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