SEMICS, The Republic of Korea - Komachine Supplier Profile and Product List

- SEMICS is a specialized semiconductor equipment company that develops and manufactures wafer probers for testing the functionality of semiconductor wafer chips using domestic technology. The company provides AI, HPC, and HBM test solutions. Aiming to become the global No. 1 based on its current third-place market share worldwide. SEMICS strives to provide deep trust and high profits to customers and business partners through innovative technology and challenging products. The company is dedicated to solving technical and operational issues in EDS environments.SEMICS is a specialized semiconductor equipment company that develops and manufactures wafer probers for testing the functionality of semiconductor wafer chips using domestic technology. The company provides AI, HPC, and HBM test solutions. Aiming to become the global No. 1 based on its current third-place market share worldwide. SEMICS strives to provide deep trust and high profits to customers and business partners through innovative technology and challenging products. The company is dedicated to solving technical and operational issues in EDS environments.
- Wafer Prober: Core equipment for testing the electrical characteristics of semiconductor wafers.Wafer Prober: Core equipment for testing the electrical characteristics of semiconductor wafers.
- OPUS3 Series: A flagship single wafer prober with over 3,000 units sold cumulatively. Emphasizing high precision, user-friendliness, easy maintenance, and flexibility. Capable of handling 6-inch, 8-inch, and 12-inch SEMI Standard Wafers without a change kit and supporting universal probe card loading. Provides optimal EDS process solutions and has a partnership with ERS to offer advanced thermal chucks as an option.OPUS3 Series: A flagship single wafer prober with over 3,000 units sold cumulatively. Emphasizing high precision, user-friendliness, easy maintenance, and flexibility. Capable of handling 6-inch, 8-inch, and 12-inch SEMI Standard Wafers without a change kit and supporting universal probe card loading. Provides optimal EDS process solutions and has a partnership with ERS to offer advanced thermal chucks as an option.
- OPUS3 SE: A model specialized in 6-inch and 8-inch wafer handling. Features a compact footprint, reliable temperature control, a rigid Z-structure, map shift prevention, real-time recipe validation, intelligent pin alignment algorithms, and smart probing route algorithms. Specifications include a maximum probing force of 230kgf, XY accuracy of ±1.5㎛, and Tri-Temp capabilities (-40℃/-55℃ to 150℃/200℃, AMBIENT CONTROL 25℃).OPUS3 SE: A model specialized in 6-inch and 8-inch wafer handling. Features a compact footprint, reliable temperature control, a rigid Z-structure, map shift prevention, real-time recipe validation, intelligent pin alignment algorithms, and smart probing route algorithms. Specifications include a maximum probing force of 230kgf, XY accuracy of ±1.5㎛, and Tri-Temp capabilities (-40℃/-55℃ to 150℃/200℃, AMBIENT CONTROL 25℃).
- OPUS3 FD (Framed Wafer Prober): A prober capable of handling both standard and framed wafers. Offers convenient conversion via a conversion kit and features advanced alignment algorithms for various special wafers. Provides high accuracy and fast throughput. Includes OPUS3 FD8 (developed in 2012) and OPUS3 FD12 (developed in 2013) models.OPUS3 FD (Framed Wafer Prober): A prober capable of handling both standard and framed wafers. Offers convenient conversion via a conversion kit and features advanced alignment algorithms for various special wafers. Provides high accuracy and fast throughput. Includes OPUS3 FD8 (developed in 2012) and OPUS3 FD12 (developed in 2013) models.
- OPUS3 SD: A wafer prober with 6-inch, 8-inch, and 12-inch wafer handling capabilities, suitable for automated processes with a top loader.OPUS3 SD: A wafer prober with 6-inch, 8-inch, and 12-inch wafer handling capabilities, suitable for automated processes with a top loader.
- OPERA (Group Prober): Adopts a stacked wafer prober method, offering a unique concept and performance unmatched by competitors. Capable of simultaneous multi-testing with 12 cells, boasting maximum space efficiency and testing performance. Implements an 'apartment-type group prober' structure with vertically stacked equipment based on high-rigidity design. Achieves up to 4 times the throughput of competitors by combining a parallel operation system for multiple test units with an AI vision-based Flying PMI algorithm. Developed through the 'World Class 300' national R&D project in 2018. OPERA D is a model targeting the challenging HPC semiconductor test market.OPERA (Group Prober): Adopts a stacked wafer prober method, offering a unique concept and performance unmatched by competitors. Capable of simultaneous multi-testing with 12 cells, boasting maximum space efficiency and testing performance. Implements an 'apartment-type group prober' structure with vertically stacked equipment based on high-rigidity design. Achieves up to 4 times the throughput of competitors by combining a parallel operation system for multiple test units with an AI vision-based Flying PMI algorithm. Developed through the 'World Class 300' national R&D project in 2018. OPERA D is a model targeting the challenging HPC semiconductor test market.
- OPERETTA and PUPPY: Models developed in 2019, with PUPPY being part of a next-generation prober development project.OPERETTA and PUPPY: Models developed in 2019, with PUPPY being part of a next-generation prober development project.
- OPUS MINI&GENIE: The world's smallest wafer prober utilizing advanced technology. Provides features such as auto tilting & active force measurement chuck and flexible loader changes according to wafer size.OPUS MINI&GENIE: The world's smallest wafer prober utilizing advanced technology. Provides features such as auto tilting & active force measurement chuck and flexible loader changes according to wafer size.
- Manipulator: A product line related to semiconductor equipment.Manipulator: A product line related to semiconductor equipment.
- Sorter: A product line related to semiconductor equipment.Sorter: A product line related to semiconductor equipment.
- Key Technologies: Unique wafer prober design technologies including a flat structure, the first introduction of linear stages and linear motor-driven XY stages, and the application of card changers. Possesses high-rigidity, high-precision, ultra-high-speed stage manufacturing technology, high-precision machine vision technology, high-precision optical component technology, low-temperature chuck and chamber manufacturing technology, and precise error correction technology. Technology for significantly reducing waiting times and improving productivity. The world's only 'Chuck Tilting' technology for extending probe card life and improving test accuracy. High-performance semiconductor heat control technology for ensuring test stability and improving process efficiency. Application of AI vision-based Flying Probe Mark Inspection (PMI) algorithms. 'Hexa Pod' technology for next-generation tiltable prober development, currently patent-pending.Key Technologies: Unique wafer prober design technologies including a flat structure, the first introduction of linear stages and linear motor-driven XY stages, and the application of card changers. Possesses high-rigidity, high-precision, ultra-high-speed stage manufacturing technology, high-precision machine vision technology, high-precision optical component technology, low-temperature chuck and chamber manufacturing technology, and precise error correction technology. Technology for significantly reducing waiting times and improving productivity. The world's only 'Chuck Tilting' technology for extending probe card life and improving test accuracy. High-performance semiconductor heat control technology for ensuring test stability and improving process efficiency. Application of AI vision-based Flying Probe Mark Inspection (PMI) algorithms. 'Hexa Pod' technology for next-generation tiltable prober development, currently patent-pending.
- Unique Technology and Successful Localization: A pioneering role in successfully developing and localizing wafer prober equipment with domestic technology in a market with high entry barriers. A company that achieved technological localization in a market virtually monopolized by Japanese companies.Unique Technology and Successful Localization: A pioneering role in successfully developing and localizing wafer prober equipment with domestic technology in a market with high entry barriers. A company that achieved technological localization in a market virtually monopolized by Japanese companies.
- Differentiated Product Design and Innovation: Original wafer prober designs distinct from existing products, including a flat structure, the first introduction of linear stages and linear motor-driven XY stages, and the application of card changers. Capability for customer-tailored development to meet specific customer requirements.Differentiated Product Design and Innovation: Original wafer prober designs distinct from existing products, including a flat structure, the first introduction of linear stages and linear motor-driven XY stages, and the application of card changers. Capability for customer-tailored development to meet specific customer requirements.
- High-Specification, Low-Cost Strategy: A strategy to secure market competitive advantage by providing high-performance equipment at a lower cost, based on excellent technology and analytical capabilities. Cost competitiveness achieved through in-house software development.High-Specification, Low-Cost Strategy: A strategy to secure market competitive advantage by providing high-performance equipment at a lower cost, based on excellent technology and analytical capabilities. Cost competitiveness achieved through in-house software development.
- Precision Maintenance in Extreme Environments: A technical strength ensuring consistent precision across a wide temperature range from -40℃ to 150℃ and during machine movement.Precision Maintenance in Extreme Environments: A technical strength ensuring consistent precision across a wide temperature range from -40℃ to 150℃ and during machine movement.
- High Throughput and Space Efficiency: The ability to achieve up to 4 times the throughput of competitors through an apartment-type group prober structure combined with AI vision algorithms. An innovative structure that vertically stacks equipment, increasing cleanroom space efficiency by up to 670% compared to traditional horizontal layouts.High Throughput and Space Efficiency: The ability to achieve up to 4 times the throughput of competitors through an apartment-type group prober structure combined with AI vision algorithms. An innovative structure that vertically stacks equipment, increasing cleanroom space efficiency by up to 670% compared to traditional horizontal layouts.
- World's Only 'Chuck Tilting' Technology: The world's only technology that precisely controls the flatness between the probe card and wafer by tilting the chuck itself, unlike conventional top plate movement methods. This technology extends the lifespan of expensive probe cards, maintains high rigidity and stability in high-load probing environments, and precisely compensates for minute deflections at the wafer edge, significantly improving inspection accuracy.World's Only 'Chuck Tilting' Technology: The world's only technology that precisely controls the flatness between the probe card and wafer by tilting the chuck itself, unlike conventional top plate movement methods. This technology extends the lifespan of expensive probe cards, maintains high rigidity and stability in high-load probing environments, and precisely compensates for minute deflections at the wafer edge, significantly improving inspection accuracy.
- Semiconductor Manufacturing IndustrySemiconductor Manufacturing Industry
- Semiconductor Wafer Inspection ProcessSemiconductor Wafer Inspection Process
- AI and HPC (High-Performance Computing) Semiconductor Test MarketAI and HPC (High-Performance Computing) Semiconductor Test Market
- HBM (High Bandwidth Memory) Test SolutionsHBM (High Bandwidth Memory) Test Solutions
- Optics and Display IndustryOptics and Display Industry
- Taiwan, China, Singapore, Southeast AsiaTaiwan, China, Singapore, Southeast Asia
- France, Across EuropeFrance, Across Europe
- United StatesUnited States
- ISO 9001 and ISO 14001 certifications acquired (2004)ISO 9001 and ISO 14001 certifications acquired (2004)
- Inno-biz Company certification (2005)Inno-biz Company certification (2005)
- OPUS3 CE certification acquired (2009)OPUS3 CE certification acquired (2009)
- CSA (Canadian Standards Association) OPUS3 certification (2010)CSA (Canadian Standards Association) OPUS3 certification (2010)
- Semi S2, S8 certifications acquired (2011)Semi S2, S8 certifications acquired (2011)
- ISO 22301 and ISO 45001 certifications acquiredISO 22301 and ISO 45001 certifications acquired
- Selected and awarded World Class 300 (2018)Selected and awarded World Class 300 (2018)
- KITA Certificate (Korea Investors and Traders Association) awarded (2018)KITA Certificate (Korea Investors and Traders Association) awarded (2018)
- World-Class Product awards in 2016, 2018, 2019World-Class Product awards in 2016, 2018, 2019
- Euntap Industrial Medal awarded (2017)Euntap Industrial Medal awarded (2017)
- Industrial Packaging award (2020)Industrial Packaging award (2020)
- Selected and awarded as an Excellent Supplier by APAC insider 2020 (2020)Selected and awarded as an Excellent Supplier by APAC insider 2020 (2020)
- Presidential Commendation for Trade Promotion and Minister of Trade, Industry and Energy Commendation for Trade Promotion awarded (2021)Presidential Commendation for Trade Promotion and Minister of Trade, Industry and Energy Commendation for Trade Promotion awarded (2021)
- One Hundred Million Dollar Export Tower awarded (59th Trade Day in 2022). Previous awards include Fifty Million Dollar Export Tower (2021), Thirty Million Dollar Export Tower (2018), and Ten Million Dollar Export Tower (2006).One Hundred Million Dollar Export Tower awarded (59th Trade Day in 2022). Previous awards include Fifty Million Dollar Export Tower (2021), Thirty Million Dollar Export Tower (2018), and Ten Million Dollar Export Tower (2006).
- 'hexa pod' technology is patent-pending'hexa pod' technology is patent-pending
- The paper 'Future Technology Prober' was selected as the 'Most Inspiring Paper' at SWTW (SouthWest Test Workshop)The paper 'Future Technology Prober' was selected as the 'Most Inspiring Paper' at SWTW (SouthWest Test Workshop)