SEMCNS is a technology-leading company in the ceramic substrate field, having started anew in 2016 by acquiring Samsung Electro-Mechanics' ceramic substrate business division. It specializes in manufacturing and supplying ceramic STF (Space Transformer), a core component for semiconductor testing processes. The company provides high-performance ceramic substrate solutions in line with the miniaturization and high-integration trends of the semiconductor industry.SEMCNSisatechnology-leadingcompanyintheceramicsubstratefield,havingstartedanewin2016byacquiringSamsungElectro-Mechanics'ceramicsubstratebusinessdivision.ItspecializesinmanufacturingandsupplyingceramicSTF(SpaceTransformer),acorecomponentforsemiconductortestingprocesses.Thecompanyprovideshigh-performanceceramicsubstratesolutionsinlinewiththeminiaturizationandhigh-integrationtrendsofthesemiconductorindustry.
Key Products/TechnologiesKeyProducts/Technologies
Ceramic STF (Space Transformer): A core component of probe cards for electrical performance evaluation of semiconductor wafers. It supports MEMS pins and transmits electrical signals to test equipment via PCBs, playing a crucial role in determining good or bad dies. Sizes range from 4 to 12 inches, with thicknesses between 3 and 6mm. Internally, it features a precisely connected structure with millions of vias and up to 40 internal layers.CeramicSTF(SpaceTransformer):Acorecomponentofprobecardsforelectricalperformanceevaluationofsemiconductorwafers.ItsupportsMEMSpinsandtransmitselectricalsignalstotestequipmentviaPCBs,playingacrucialroleindetermininggoodorbaddies.Sizesrangefrom4to12inches,withthicknessesbetween3and6mm.Internally,itfeaturesapreciselyconnectedstructurewithmillionsofviasandupto40internallayers.
Ceramic STF for NAND Probe Cards: Ceramic STF products specialized for NAND flash memory testing. This is a primary product line, accounting for approximately 75% of total revenue based on the 2024 business report.CeramicSTFforNANDProbeCards:CeramicSTFproductsspecializedforNANDflashmemorytesting.Thisisaprimaryproductline,accountingforapproximately75%oftotalrevenuebasedonthe2024businessreport.
Ceramic STF for DRAM Probe Cards: Ceramic STF products used for DRAM memory testing. This segment accounted for approximately 23% of revenue in 2024, with high-value DRAM STF sales expected to be a growth driver.CeramicSTFforDRAMProbeCards:CeramicSTFproductsusedforDRAMmemorytesting.Thissegmentaccountedforapproximately23%ofrevenuein2024,withhigh-valueDRAMSTFsalesexpectedtobeagrowthdriver.
Ceramic STF for Non-Memory Semiconductors (CIS: CMOS Image Sensor) Probe Cards: A product line aimed at expanding into the non-memory semiconductor test market. This segment accounted for approximately 2% of revenue in 2024, with ongoing efforts to expand into new markets.CeramicSTFforNon-MemorySemiconductors(CIS:CMOSImageSensor)ProbeCards:Aproductlineaimedatexpandingintothenon-memorysemiconductortestmarket.Thissegmentaccountedforapproximately2%ofrevenuein2024,withongoingeffortstoexpandintonewmarkets.
Ceramic STF for HBM (High Bandwidth Memory): High-value products responding to increased demand driven by the AI and high-performance computing markets. Currently undergoing quality testing by domestic and international HBM manufacturers, significant growth in supply is anticipated for these next-generation core products.CeramicSTFforHBM(HighBandwidthMemory):High-valueproductsrespondingtoincreaseddemanddrivenbytheAIandhigh-performancecomputingmarkets.CurrentlyundergoingqualitytestingbydomesticandinternationalHBMmanufacturers,significantgrowthinsupplyisanticipatedforthesenext-generationcoreproducts.
LTCC (Low Temperature Co-fired Ceramic) Technology: A low-temperature co-fired ceramic technology that allows for the use of metals with lower electrical resistance for wiring compared to high-temperature co-fired (HTCC) methods, advantageous for high-speed signal processing. This technology enables more precise stacking of internal circuits, facilitating high integration, multi-functionality, and product miniaturization.LTCC(LowTemperatureCo-firedCeramic)Technology:Alow-temperatureco-firedceramictechnologythatallowsfortheuseofmetalswithlowerelectricalresistanceforwiringcomparedtohigh-temperatureco-fired(HTCC)methods,advantageousforhigh-speedsignalprocessing.Thistechnologyenablesmoreprecisestackingofinternalcircuits,facilitatinghighintegration,multi-functionality,andproductminiaturization.
Large-Area Shrinkage-Free LTCC Ceramic STF Commercialization Technology: A world-first technology for manufacturing ceramic STF without shrinkage in large areas using the LTCC process. This is a key technology that maximizes product precision and reliability.Large-AreaShrinkage-FreeLTCCCeramicSTFCommercializationTechnology:Aworld-firsttechnologyformanufacturingceramicSTFwithoutshrinkageinlargeareasusingtheLTCCprocess.Thisisakeytechnologythatmaximizesproductprecisionandreliability.
In-house End-to-End Development Technology: The capability to independently develop and produce all processes of ceramic STF, including design, substrate manufacturing, processing, and thin-film formation. This ensures quality control and strengthens technological competitiveness.In-houseEnd-to-EndDevelopmentTechnology:ThecapabilitytoindependentlydevelopandproduceallprocessesofceramicSTF,includingdesign,substratemanufacturing,processing,andthin-filmformation.Thisensuresqualitycontrolandstrengthenstechnologicalcompetitiveness.
U-LTCC (Ultra-Low Temperature Co-fired Ceramic) Technology Development: Currently undertaking a national project for the development of ultra-low temperature co-fired multilayer ceramic substrate materials, processes, and component manufacturing technology for autonomous driving radar and next-generation communication. This next-generation technology aims for high-integration, ultra-low loss multilayer ceramic substrates using U-LTCC processes below 650°C.U-LTCC(Ultra-LowTemperatureCo-firedCeramic)TechnologyDevelopment:Currentlyundertakinganationalprojectforthedevelopmentofultra-lowtemperatureco-firedmultilayerceramicsubstratematerials,processes,andcomponentmanufacturingtechnologyforautonomousdrivingradarandnext-generationcommunication.Thisnext-generationtechnologyaimsforhigh-integration,ultra-lowlossmultilayerceramicsubstratesusingU-LTCCprocessesbelow650°C.
Core AdvantagesCoreAdvantages
Leading Technology Company in Ceramic STF: A company that has established itself as a technology leader in the ceramic substrate field by inheriting core technologies and personnel through the acquisition of Samsung Electro-Mechanics' ceramic STF business. It has successfully localized ceramic STF, a market previously dominated by Japanese companies, securing its position as the sole domestic developer and supplier.LeadingTechnologyCompanyinCeramicSTF:AcompanythathasestablisheditselfasatechnologyleaderintheceramicsubstratefieldbyinheritingcoretechnologiesandpersonnelthroughtheacquisitionofSamsungElectro-Mechanics'ceramicSTFbusiness.IthassuccessfullylocalizedceramicSTF,amarketpreviouslydominatedbyJapanesecompanies,securingitspositionasthesoledomesticdeveloperandsupplier.
World-Class LTCC (Low Temperature Co-fired Ceramic) Technology: Possesses world-first technology for commercializing large-area, shrinkage-free LTCC ceramic STF. Its LTCC process, which is advantageous for high-speed signal processing and precise internal circuit stacking, creates a high technological entry barrier, with only a few global companies capable of mass-producing LTCC-based STF, and it is virtually the only one with established references.World-ClassLTCC(LowTemperatureCo-firedCeramic)Technology:Possessesworld-firsttechnologyforcommercializinglarge-area,shrinkage-freeLTCCceramicSTF.ItsLTCCprocess,whichisadvantageousforhigh-speedsignalprocessingandpreciseinternalcircuitstacking,createsahightechnologicalentrybarrier,withonlyafewglobalcompaniescapableofmass-producingLTCC-basedSTF,anditisvirtuallytheonlyonewithestablishedreferences.
Diversified Product Portfolio and Future Growth Engines: Successfully diversified its product portfolio from NAND-centric to include DRAM, non-memory (CIS), and high-value HBM (High Bandwidth Memory) ceramic STF. Its entry into the HBM market positions it as a key beneficiary of the AI semiconductor supercycle, securing mid-to-long-term growth momentum.DiversifiedProductPortfolioandFutureGrowthEngines:SuccessfullydiversifieditsproductportfoliofromNAND-centrictoincludeDRAM,non-memory(CIS),andhigh-valueHBM(HighBandwidthMemory)ceramicSTF.ItsentryintotheHBMmarketpositionsitasakeybeneficiaryoftheAIsemiconductorsupercycle,securingmid-to-long-termgrowthmomentum.
Securing Global Top-tier Customers and Strong Partnerships: Has secured major domestic and international semiconductor manufacturers such as Samsung Electronics, SK Hynix, Micron, Intel, and Kioxia as customers. It has established a flexible production system capable of customized order manufacturing for each customer and model, enhancing customer satisfaction.SecuringGlobalTop-tierCustomersandStrongPartnerships:HassecuredmajordomesticandinternationalsemiconductormanufacturerssuchasSamsungElectronics,SKHynix,Micron,Intel,andKioxiaascustomers.Ithasestablishedaflexibleproductionsystemcapableofcustomizedordermanufacturingforeachcustomerandmodel,enhancingcustomersatisfaction.
Stable Production Capacity and Efficient Delivery Response: Completed the construction of a new smart factory in Osong, Chungcheongbuk-do, in February 2024, significantly expanding production capacity and achieving economies of scale. This enables stable response to increasing customer demand and secures a competitive edge through timely delivery.StableProductionCapacityandEfficientDeliveryResponse:CompletedtheconstructionofanewsmartfactoryinOsong,Chungcheongbuk-do,inFebruary2024,significantlyexpandingproductioncapacityandachievingeconomiesofscale.Thisenablesstableresponsetoincreasingcustomerdemandandsecuresacompetitiveedgethroughtimelydelivery.
Strong Technological Entry Barriers and Patent Competitiveness: The ceramic STF industry is highly technology-intensive, requiring significant time and investment for development and mass production, and mandatory approval through rigorous customer tests. With its in-house end-to-end development capabilities, the company has registered a total of 82 patents as of the first half of 2023, establishing strong technological entry barriers.StrongTechnologicalEntryBarriersandPatentCompetitiveness:TheceramicSTFindustryishighlytechnology-intensive,requiringsignificanttimeandinvestmentfordevelopmentandmassproduction,andmandatoryapprovalthroughrigorouscustomertests.Withitsin-houseend-to-enddevelopmentcapabilities,thecompanyhasregisteredatotalof82patentsasofthefirsthalfof2023,establishingstrongtechnologicalentrybarriers.
Target IndustrieTargetIndustrie
Semiconductor Industry (Semiconductor Wafer Test Process)SemiconductorIndustry(SemiconductorWaferTestProcess)
RF ModulesRFModules
Electronic DevicesElectronicDevices
Military DevicesMilitaryDevices
Autonomous Driving RadarAutonomousDrivingRadar
Next-Generation 5G and 6G CommunicationNext-Generation5Gand6GCommunication
Space, Aviation, and Defense SectorsSpace,Aviation,andDefenseSectors
South Korea, Japan, China, TaiwanSouthKorea,Japan,China,Taiwan
Europe (European probe card customers like Technoprobe)Europe(EuropeanprobecardcustomerslikeTechnoprobe)
United States (Customers like FormFactor, Micron, Intel)UnitedStates(CustomerslikeFormFactor,Micron,Intel)
Certifications/PatentsCertifications/Patents
Establishment of Corporate R&D CenterEstablishmentofCorporateR&DCenter
Venture Company Certification (Korea Technology Finance Corporation)VentureCompanyCertification(KoreaTechnologyFinanceCorporation)
Advanced Technology Product Certification (Ministry of Trade, Industry and Energy)AdvancedTechnologyProductCertification(MinistryofTrade,IndustryandEnergy)
Excellent Technology Company Selection (Korea Technology Finance Corporation)ExcellentTechnologyCompanySelection(KoreaTechnologyFinanceCorporation)
Quality Management System Certification (ISO9001)QualityManagementSystemCertification(ISO9001)
Root Technology Specialist Company Designation (Ministry of SMEs and Startups)RootTechnologySpecialistCompanyDesignation(MinistryofSMEsandStartups)
Material and Component Specialist Company Certification (Ministry of Trade, Industry and Energy)MaterialandComponentSpecialistCompanyCertification(MinistryofTrade,IndustryandEnergy)
World-Class Product Certification (Ministry of Trade, Industry and Energy)World-ClassProductCertification(MinistryofTrade,IndustryandEnergy)
Technology Evaluation Grade A Acquisition (Korea Technology Finance Corporation)TechnologyEvaluationGradeAAcquisition(KoreaTechnologyFinanceCorporation)
Selected as KOSDAQ Rising Star in 2022SelectedasKOSDAQRisingStarin2022
Selected as National Representative 1000 Innovative Companies (Ministry of Trade, Industry and Energy)SelectedasNationalRepresentative1000InnovativeCompanies(MinistryofTrade,IndustryandEnergy)
Excellent Technology Capability Company CertificateExcellentTechnologyCapabilityCompanyCertificate
Excellent Technology Research Center (ATC) Designation CertificateExcellentTechnologyResearchCenter(ATC)DesignationCertificate