Information
Japan, 〒602-0081 Kyoto, Kamigyo Ward, Zuikōin Maechō, 天神北町１−１
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Overview
- Summary
- SCREEN Semiconductor Solutions is a global leader in semiconductor manufacturing equipment, particularly in the wafer cleaning equipment market, maintaining a dominant share. The company provides diverse solutions for advanced logic and memory semiconductors, as well as for IoT devices utilizing 200mm and smaller wafers. It supplies essential equipment for the production of core semiconductor devices driving societal changes such as AI, autonomous vehicles, robotics, and 5G. Through continuous R&D and innovation, the company contributes to the evolution of the semiconductor industry.SCREEN Semiconductor Solutions is a global leader in semiconductor manufacturing equipment, particularly in the wafer cleaning equipment market, maintaining a dominant share. The company provides diverse solutions for advanced logic and memory semiconductors, as well as for IoT devices utilizing 200mm and smaller wafers. It supplies essential equipment for the production of core semiconductor devices driving societal changes such as AI, autonomous vehicles, robotics, and 5G. Through continuous R&D and innovation, the company contributes to the evolution of the semiconductor industry.
- Key Products/Technologies
- Wafer Cleaning Systems: Offers various models including Single Wafer Cleaners (SU-3400, SU-3300, SU-3200, SU-2000), Wet Stations (FC-3100, WS-620C/WS-820C/WS-820L, FC-821L, CW-2000), Spin Scrubbers (SS-3300S, SS-3200, SS-3200 for 200mm, SS-80EX), and Spin Processors (SP-2100). The SU-3400 achieves a processing capacity of up to 1,200 wafers per hour. The FC-3100 provides a high throughput of 1,000 wafers per hour.Wafer Cleaning Systems: Offers various models including Single Wafer Cleaners (SU-3400, SU-3300, SU-3200, SU-2000), Wet Stations (FC-3100, WS-620C/WS-820C/WS-820L, FC-821L, CW-2000), Spin Scrubbers (SS-3300S, SS-3200, SS-3200 for 200mm, SS-80EX), and Spin Processors (SP-2100). The SU-3400 achieves a processing capacity of up to 1,200 wafers per hour. The FC-3100 provides a high throughput of 1,000 wafers per hour.
- Coat/Develop Tracks: Provides equipment for photoresist coating and development, such as DT-3000 (SOKUDO DUO), RF-200EX/RF-300EX, and SK-60EX/SK-80EX.Coat/Develop Tracks: Provides equipment for photoresist coating and development, such as DT-3000 (SOKUDO DUO), RF-200EX/RF-300EX, and SK-60EX/SK-80EX.
- Annealing Systems: The Flash Lamp Annealer LA-3100 precisely controls heating temperature profiles in milliseconds and integrates wafer temperature measurement functionality.Annealing Systems: The Flash Lamp Annealer LA-3100 precisely controls heating temperature profiles in milliseconds and integrates wafer temperature measurement functionality.
- Measurement Systems: Offers various film thickness measurement equipment, including the Ellipsometric Film Thickness Measurement System RE-3500 and Spectroscopic Film Thickness Measurement Systems (VM-2500/VM-3500, VM-1200/VM-1300).Measurement Systems: Offers various film thickness measurement equipment, including the Ellipsometric Film Thickness Measurement System RE-3500 and Spectroscopic Film Thickness Measurement Systems (VM-2500/VM-3500, VM-1200/VM-1300).
- Inspection Systems: Wafer Pattern Inspection Systems (ZI-3600, ZI-2000) inspect wafers ranging from 100mm to 300mm, featuring proprietary inspection heads and high-speed image processing engines for superior resolution and productivity.Inspection Systems: Wafer Pattern Inspection Systems (ZI-3600, ZI-2000) inspect wafers ranging from 100mm to 300mm, featuring proprietary inspection heads and high-speed image processing engines for superior resolution and productivity.
- Advanced Packaging Lithography: Supplies advanced packaging process equipment such as Direct Imaging Systems for advanced packages (DW-3100, DW-3100 for PLP), the Direct Imaging System for Next-Generation Patterning LeVina, and the Slit Coater System for Panel Level Packaging Lemotia. The DW-3100 features sub-1µm resolution and wafer warpage correction technologies.Advanced Packaging Lithography: Supplies advanced packaging process equipment such as Direct Imaging Systems for advanced packages (DW-3100, DW-3100 for PLP), the Direct Imaging System for Next-Generation Patterning LeVina, and the Slit Coater System for Panel Level Packaging Lemotia. The DW-3100 features sub-1µm resolution and wafer warpage correction technologies.
- Photomask-related equipment: The Automatic Dimension Measurement System DR-8000 measures photomask pattern dimensions with nanometer-level repeatability and offers optical transmittance and phase shift measurement capabilities.Photomask-related equipment: The Automatic Dimension Measurement System DR-8000 measures photomask pattern dimensions with nanometer-level repeatability and offers optical transmittance and phase shift measurement capabilities.
- Core Technologies: Includes proprietary surface treatment technology for optimal air-liquid interface treatment on wafer surfaces, molecular-level cleaning capabilities, direct patterning and image processing technologies, optical and imaging technologies, and the development of coater/developer technology utilizing room-temperature photocrosslinking.Core Technologies: Includes proprietary surface treatment technology for optimal air-liquid interface treatment on wafer surfaces, molecular-level cleaning capabilities, direct patterning and image processing technologies, optical and imaging technologies, and the development of coater/developer technology utilizing room-temperature photocrosslinking.
- Core Advantages
- Global Market Leadership in Wafer Cleaning Equipment: Consistently holds the number one global market share in semiconductor cleaning processes, with an estimated 35-45% market share in single-wafer cleaning equipment.Global Market Leadership in Wafer Cleaning Equipment: Consistently holds the number one global market share in semiconductor cleaning processes, with an estimated 35-45% market share in single-wafer cleaning equipment.
- Extensive Patent Portfolio and Continuous R&D Investment: Possesses over 4,000 active patents and focuses on developing proprietary nozzle and wafer-spin technologies. Strategic collaborations with leading research institutes like imec and IBM drive the development of next-generation EUV lithography cleaning processes and sustainable semiconductor technologies.Extensive Patent Portfolio and Continuous R&D Investment: Possesses over 4,000 active patents and focuses on developing proprietary nozzle and wafer-spin technologies. Strategic collaborations with leading research institutes like imec and IBM drive the development of next-generation EUV lithography cleaning processes and sustainable semiconductor technologies.
- Strong Client Relationships and Technical Support: Has received multiple 'Excellent Production Support Awards' and 'Excellent Contribution in Green Manufacturing Awards' from TSMC, and the 'Outstanding Performance in Sustainability Award' from Micron Technology Inc., demonstrating high regard and trust from major foundry clients.Strong Client Relationships and Technical Support: Has received multiple 'Excellent Production Support Awards' and 'Excellent Contribution in Green Manufacturing Awards' from TSMC, and the 'Outstanding Performance in Sustainability Award' from Micron Technology Inc., demonstrating high regard and trust from major foundry clients.
- Focus on Environmental Performance and Sustainability: Emphasizes 'Green Chemistry' to reduce chemical and DI water usage by up to 30% and actively participates in Scope 3 greenhouse gas emission reduction programs. Achieved RBA VAP Platinum Status, demonstrating commitment to responsible business practices.Focus on Environmental Performance and Sustainability: Emphasizes 'Green Chemistry' to reduce chemical and DI water usage by up to 30% and actively participates in Scope 3 greenhouse gas emission reduction programs. Achieved RBA VAP Platinum Status, demonstrating commitment to responsible business practices.
- Diversified Product Portfolio: Offers a comprehensive lineup of equipment covering various semiconductor manufacturing processes, including wafer cleaning, lithography, annealing, measurement, and inspection systems. Provides solutions for both 300mm advanced devices and 200mm and smaller IoT devices.Diversified Product Portfolio: Offers a comprehensive lineup of equipment covering various semiconductor manufacturing processes, including wafer cleaning, lithography, annealing, measurement, and inspection systems. Provides solutions for both 300mm advanced devices and 200mm and smaller IoT devices.
- High Productivity and Space Efficiency: The SU-3400 single-wafer cleaning system achieves a 30% reduction in footprint while maintaining 24 chambers and features an innovative wafer transfer mechanism that significantly enhances productivity per unit area.High Productivity and Space Efficiency: The SU-3400 single-wafer cleaning system achieves a 30% reduction in footprint while maintaining 24 chambers and features an innovative wafer transfer mechanism that significantly enhances productivity per unit area.
- Target Industries
- Semiconductor Manufacturing Industry: Production processes for various semiconductor devices including advanced logic, memory, power devices, CIS, and MEMSSemiconductor Manufacturing Industry: Production processes for various semiconductor devices including advanced logic, memory, power devices, CIS, and MEMS
- IoT Device Manufacturing Industry: Production of IoT devices utilizing 200mm and smaller wafersIoT Device Manufacturing Industry: Production of IoT devices utilizing 200mm and smaller wafers
- AI Semiconductor Manufacturing Industry: Advanced semiconductor manufacturing driven by the increasing demand for AI chips and High-Performance Computing (HPC)AI Semiconductor Manufacturing Industry: Advanced semiconductor manufacturing driven by the increasing demand for AI chips and High-Performance Computing (HPC)
- Autonomous Vehicles and Robotics Industries: Supporting the growth of related industries through the supply of core semiconductor devicesAutonomous Vehicles and Robotics Industries: Supporting the growth of related industries through the supply of core semiconductor devices
- 5G Communication Device Manufacturing Industry: Supporting semiconductor production necessary for 5G technology advancement5G Communication Device Manufacturing Industry: Supporting semiconductor production necessary for 5G technology advancement
- Display Manufacturing Industry: Production of display panels through coater/developer equipment for large-scale TFT arrays (LCD and OLED)Display Manufacturing Industry: Production of display panels through coater/developer equipment for large-scale TFT arrays (LCD and OLED)
- Advanced Packaging Industry: Supplying direct imaging systems for heterogeneous integration and large semiconductor package manufacturingAdvanced Packaging Industry: Supplying direct imaging systems for heterogeneous integration and large semiconductor package manufacturing
- Medical Device Industry: Application of patterning technology to facilitate manufacturing record management in high-reliability medical device fieldsMedical Device Industry: Application of patterning technology to facilitate manufacturing record management in high-reliability medical device fields
- Major Markets
- Taiwan, China, Japan, KoreaTaiwan, China, Japan, Korea
- GermanyGermany
- United StatesUnited States
- Certifications/Patents
- ISO 9001:2015 (Quality Management System) Certification: Registered for Hikone, Taga, HD Head Office, Rakusai, and Takaoka sitesISO 9001:2015 (Quality Management System) Certification: Registered for Hikone, Taga, HD Head Office, Rakusai, and Takaoka sites
- ISO 14001 (Environmental Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiariesISO 14001 (Environmental Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiaries
- ISO 45001 (Occupational Health and Safety Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiariesISO 45001 (Occupational Health and Safety Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiaries
- ISO 50001 (Energy Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiariesISO 50001 (Energy Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiaries
- ISO/IEC 27001 (Information Security Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiariesISO/IEC 27001 (Information Security Management System) Certification: For SCREEN Holdings Co., Ltd. and its subsidiaries
- RBA VAP Audit PLATINUM Status: Achieved for Hikone and Taga sitesRBA VAP Audit PLATINUM Status: Achieved for Hikone and Taga sites
- Over 4,000 active patents: Patents related to proprietary nozzle and wafer-spin technologies, surface processing, direct patterning, and image processing technologies.Over 4,000 active patents: Patents related to proprietary nozzle and wafer-spin technologies, surface processing, direct patterning, and image processing technologies.
- Key Patent Examples: Cup and substrate processing apparatus (Patent No.: 10160012), Substrate processing apparatus and substrate processing method (Patent No.: 10201824), Substrate processing apparatus (Patent No.: 10216099), Substrate treating apparatus and substrate transporting method (Patent No.: 10181417), Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units (Patent No.: 9687874).Key Patent Examples: Cup and substrate processing apparatus (Patent No.: 10160012), Substrate processing apparatus and substrate processing method (Patent No.: 10201824), Substrate processing apparatus (Patent No.: 10216099), Substrate treating apparatus and substrate transporting method (Patent No.: 10181417), Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units (Patent No.: 9687874).
Introduction
Location
Japan, 〒602-0081 Kyoto, Kamigyo Ward, Zuikōin Maechō, 天神北町１−１
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