Sapien Semiconductor Co., Ltd. is a fabless company providing customized ASIC products and solutions based on innovative design IPs optimized for Micro-LED display driving. It is a global leader in developing various Micro-LED display driving semiconductors applicable from micro-sized to large-sized displays. The company specializes in developing and supplying ultra-small CMOS Backplanes for AR/MR devices and Micro Pixel Drivers (MPD) for FALD-BLU, TVs, and signage. It aims to be a global game-changer in the next-generation Micro-LED display industry.SapienSemiconductorCo.,Ltd.isafablesscompanyprovidingcustomizedASICproductsandsolutionsbasedoninnovativedesignIPsoptimizedforMicro-LEDdisplaydriving.ItisagloballeaderindevelopingvariousMicro-LEDdisplaydrivingsemiconductorsapplicablefrommicro-sizedtolarge-sizeddisplays.Thecompanyspecializesindevelopingandsupplyingultra-smallCMOSBackplanesforAR/MRdevicesandMicroPixelDrivers(MPD)forFALD-BLU,TVs,andsignage.Itaimstobeaglobalgame-changerinthenext-generationMicro-LEDdisplayindustry.
Key Products/TechnologiesKeyProducts/Technologies
LEDoS CMOS Backplane technology enables ultra-small, ultra-high-density, and ultra-low-power display engines optimized for next-generation applications such as AR smart glasses, HMDs, and military goggles. Products incorporate Active-matrix Architecture, PWM Driving Scheme, and patented Memory-inside-Pixel (MiP®) technology. Features include independent RGB pixel driving, 1,280(RGB/Mono) x 720 resolution, 10-bit Color Depth, Mura Compensation, Image Processing IPs, and an embedded Temperature Sensor. Based on 28nm FD-SOI CMOS process, development kits are available, supporting up to 2K resolution, 2.5 ㎛ or lower pixel pitch, various custom IP integrations, and flexible technical support.LEDoSCMOSBackplanetechnologyenablesultra-small,ultra-high-density,andultra-low-powerdisplayenginesoptimizedfornext-generationapplicationssuchasARsmartglasses,HMDs,andmilitarygoggles.ProductsincorporateActive-matrixArchitecture,PWMDrivingScheme,andpatentedMemory-inside-Pixel(MiP®)technology.FeaturesincludeindependentRGBpixeldriving,1,280(RGB/Mono)x720resolution,10-bitColorDepth,MuraCompensation,ImageProcessingIPs,andanembeddedTemperatureSensor.Basedon28nmFD-SOICMOSprocess,developmentkitsareavailable,supportingupto2Kresolution,2.5㎛orlowerpixelpitch,variouscustomIPintegrations,andflexibletechnicalsupport.
Micro Pixel Driver (MPD®) products are Micro-/Mini-LED driving solutions for large displays such as FALD BLU, TVs, signage, and transparent displays. These solutions support high-quality display implementation with clear image quality and stable performance.MicroPixelDriver(MPD®)productsareMicro-/Mini-LEDdrivingsolutionsforlargedisplayssuchasFALDBLU,TVs,signage,andtransparentdisplays.Thesesolutionssupporthigh-qualitydisplayimplementationwithclearimagequalityandstableperformance.
Micro-Tile® technology is a next-generation tiled display driving technology capable of driving 15x30 micrometer (μm) Micro-LEDs. This technology forms an active display module by configuring 300 Micro-LEDs into a 10×10 RGB pixel array, driven by a single driver IC. Designed with MiP(Memory-inside-Pixel) and applying POD™ (Pixel On Driver) based patented packaging technology and TSV (Through Silicon Via) process, it achieves ultra-fine/high-density implementation and reduces manufacturing costs.Micro-Tile®technologyisanext-generationtileddisplaydrivingtechnologycapableofdriving15x30micrometer(μm)Micro-LEDs.Thistechnologyformsanactivedisplaymodulebyconfiguring300Micro-LEDsintoa10×10RGBpixelarray,drivenbyasingledriverIC.DesignedwithMiP(Memory-inside-Pixel)andapplyingPOD™(PixelOnDriver)basedpatentedpackagingtechnologyandTSV(ThroughSiliconVia)process,itachievesultra-fine/high-densityimplementationandreducesmanufacturingcosts.
Core AdvantagesCoreAdvantages
Proprietary Micro-LED specialized DDIC design technology provides essential brightness, fast response speed, low power consumption, and ultra-small DDI structures required for AR devices.ProprietaryMicro-LEDspecializedDDICdesigntechnologyprovidesessentialbrightness,fastresponsespeed,lowpowerconsumption,andultra-smallDDIstructuresrequiredforARdevices.
The patented MiP(Memory-inside-Pixel) core technology, with memory embedded within the DDI, enables up to 75% power consumption reduction, over 30% yield improvement, up to 50% cost reduction, and 90% assembly cost reduction compared to competitors.ThepatentedMiP(Memory-inside-Pixel)coretechnology,withmemoryembeddedwithintheDDI,enablesupto75%powerconsumptionreduction,over30%yieldimprovement,upto50%costreduction,and90%assemblycostreductioncomparedtocompetitors.
Collaboration and references with global big tech companies include a cooperation development agreement with French company A and US company M in 2019, leading to the completion of AR/MR CMOS Backplane development and supply to company S in 2021. A strong network with multiple global Micro-LED manufacturers and Set, OEM/ODM clients provides differentiated solutions and stable supply throughout the project lifecycle.CollaborationandreferenceswithglobalbigtechcompaniesincludeacooperationdevelopmentagreementwithFrenchcompanyAandUScompanyMin2019,leadingtothecompletionofAR/MRCMOSBackplanedevelopmentandsupplytocompanySin2021.AstrongnetworkwithmultipleglobalMicro-LEDmanufacturersandSet,OEM/ODMclientsprovidesdifferentiatedsolutionsandstablesupplythroughouttheprojectlifecycle.
Technological capability spanning from ultra-small to ultra-large displays includes the development of various Micro-LED display driving semiconductors applicable to ultra-small AR/MR devices, FALD-BLU, TVs, and signage.Technologicalcapabilityspanningfromultra-smalltoultra-largedisplaysincludesthedevelopmentofvariousMicro-LEDdisplaydrivingsemiconductorsapplicabletoultra-smallAR/MRdevices,FALD-BLU,TVs,andsignage.
A technological lead of 2-3 years in 2nd generation and over 5 years in 3rd generation compared to Chinese competitors, positioning the company to lead industry standards.Atechnologicalleadof2-3yearsin2ndgenerationandover5yearsin3rdgenerationcomparedtoChinesecompetitors,positioningthecompanytoleadindustrystandards.
Strong intellectual property (IP) competitiveness with an average of 20 global patent applications annually and over 150 global technical patents, meticulously protecting core Micro-LED technologies through patent application systems, supported by in-house patent attorneys and US lawyers.Strongintellectualproperty(IP)competitivenesswithanaverageof20globalpatentapplicationsannuallyandover150globaltechnicalpatents,meticulouslyprotectingcoreMicro-LEDtechnologiesthroughpatentapplicationsystems,supportedbyin-housepatentattorneysandUSlawyers.
Target IndustrieTargetIndustrie
Augmented Reality (AR) and Mixed Reality (MR) devices such as AR smart glasses and HMD (Head-Mounted Display).AugmentedReality(AR)andMixedReality(MR)devicessuchasARsmartglassesandHMD(Head-MountedDisplay).
Defense and military sectors, including military goggles and AR-HUD for tanks and fighter jets.Defenseandmilitarysectors,includingmilitarygogglesandAR-HUDfortanksandfighterjets.
Large display product groups, including FALD BLU (Full Array Local Dimming Backlight Unit).Largedisplayproductgroups,includingFALDBLU(FullArrayLocalDimmingBacklightUnit).
Various display products such as TVs, signage, and transparent displays.VariousdisplayproductssuchasTVs,signage,andtransparentdisplays.
Specialized display markets, including automotive displays and wearable displays.Specializeddisplaymarkets,includingautomotivedisplaysandwearabledisplays.
Potential entry into new AI-related markets such as AI optical communication devices.PotentialentryintonewAI-relatedmarketssuchasAIopticalcommunicationdevices.
Major MarketsMajorMarkets
Based in the Korean market, a NRE development and supply contract with a Micro-LED display manufacturer in the Asian region., Anticipated Mini-LED DDI mass production revenue from Chinese clients, with mass production expected in the second half of 2026.BasedintheKoreanmarket,aNREdevelopmentandsupplycontractwithaMicro-LEDdisplaymanufacturerintheAsianregion.,AnticipatedMini-LEDDDImassproductionrevenuefromChineseclients,withmassproductionexpectedinthesecondhalfof2026.
Cooperation development agreement signed with French company A., CMOS backplane development and supply contract signed with a European microdisplay engine company., Export of high-end display solutions and anticipation of additional orders from European companies.CooperationdevelopmentagreementsignedwithFrenchcompanyA.,CMOSbackplanedevelopmentandsupplycontractsignedwithaEuropeanmicrodisplayenginecompany.,Exportofhigh-enddisplaysolutionsandanticipationofadditionalordersfromEuropeancompanies.
Cooperation development agreement signed with US company M., Active discussions with multiple North American companies regarding the supply of Micro-LED display driving chips for AI smart glasses., Plans to accelerate local supply through US operations., Strategic partnerships established with global big tech companies.CooperationdevelopmentagreementsignedwithUScompanyM.,ActivediscussionswithmultipleNorthAmericancompaniesregardingthesupplyofMicro-LEDdisplaydrivingchipsforAIsmartglasses.,PlanstoacceleratelocalsupplythroughUSoperations.,Strategicpartnershipsestablishedwithglobalbigtechcompanies.
Certifications/PatentsCertifications/Patents
Acquisition of 'ISO 9001:2015' international standard certification for quality management systems from the international certification body ICR (March 2026). Official recognition that the quality management system for the entire process of Micro-LED display driving CMOS DDIC development and supply conforms to international standards.Acquisitionof'ISO9001:2015'internationalstandardcertificationforqualitymanagementsystemsfromtheinternationalcertificationbodyICR(March2026).OfficialrecognitionthatthequalitymanagementsystemfortheentireprocessofMicro-LEDdisplaydrivingCMOSDDICdevelopmentandsupplyconformstointernationalstandards.
Acquisition of Intellectual Property Management Company certification from the Korean Intellectual Property Office in 2022.AcquisitionofIntellectualPropertyManagementCompanycertificationfromtheKoreanIntellectualPropertyOfficein2022.
Possession of intellectual property rights with 54 domestic patents and 13 international patent applications registered/pending. Holding over 150 global technical patents, meticulously protecting core Micro-LED technologies through the patent application system.Possessionofintellectualpropertyrightswith54domesticpatentsand13internationalpatentapplicationsregistered/pending.Holdingover150globaltechnicalpatents,meticulouslyprotectingcoreMicro-LEDtechnologiesthroughthepatentapplicationsystem.
Specific patent registration for MiP(Memory-inside-Pixel) technology. Also holds patented POD™ (Pixel On Driver) based packaging technology.SpecificpatentregistrationforMiP(Memory-inside-Pixel)technology.AlsoholdspatentedPOD™(PixelOnDriver)basedpackagingtechnology.
Awarded the Excellence Prize at the 3rd (2023) and 5th (2025) Korea Venture Startup Patent Awards, demonstrating technological completeness.AwardedtheExcellencePrizeatthe3rd(2023)and5th(2025)KoreaVentureStartupPatentAwards,demonstratingtechnologicalcompleteness.
Introduction
Location
42 Changeop-ro, Sujeong-gu, Seongnam-si, Gyeonggi-do, South Korea
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42 Changeop-ro, Sujeong-gu, Seongnam-si, Gyeonggi-do, South Korea