Information
61 Sinwon-ro 91beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
+82 31-495-5039
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Overview
- Summary
- SAESOL DIAMOND Ind. Co., Ltd. is a leading company manufacturing a variety of diamond tools essential for the semiconductor and IT industries, including CMP Pad Conditioners, Grinding Wheels, and Diamond Wire Saws. The company is recognized for its technological prowess through continuous R&D and quality innovation, supplying its products to major semiconductor and IT companies worldwide. Notably, it achieved the top position in the global CMP Pad Conditioner market share by sales volume in 2009.SAESOL DIAMOND Ind. Co., Ltd. is a leading company manufacturing a variety of diamond tools essential for the semiconductor and IT industries, including CMP Pad Conditioners, Grinding Wheels, and Diamond Wire Saws. The company is recognized for its technological prowess through continuous R&D and quality innovation, supplying its products to major semiconductor and IT companies worldwide. Notably, it achieved the top position in the global CMP Pad Conditioner market share by sales volume in 2009.
- Key Products/Technologies
- CMP Pad Conditioner: A critical consumable used in the semiconductor Chemical Mechanical Planarization (CMP) process to maintain consistent polishing performance by conditioning the pad surface. This product incorporates etching methods for uniform diamond arrangement and shape, and reverse plating for consistent height, offering 50% improved performance over competitors and reducing CMP process defect rates by more than twofold by preventing diamond detachment and wafer damage. Applicable to various CMP process applications such as ILD, STI, Metal, TSV, Buffing, Barrier, Poly, and Gate, with 4.25-inch stainless steel and diamond-nickel bonding specifications. Key features include stable pad roughness and extended conditioner lifetime.CMP Pad Conditioner: A critical consumable used in the semiconductor Chemical Mechanical Planarization (CMP) process to maintain consistent polishing performance by conditioning the pad surface. This product incorporates etching methods for uniform diamond arrangement and shape, and reverse plating for consistent height, offering 50% improved performance over competitors and reducing CMP process defect rates by more than twofold by preventing diamond detachment and wafer damage. Applicable to various CMP process applications such as ILD, STI, Metal, TSV, Buffing, Barrier, Poly, and Gate, with 4.25-inch stainless steel and diamond-nickel bonding specifications. Key features include stable pad roughness and extended conditioner lifetime.
- Grinding Wheel (Diamond Wheel): Products used for processing the backside surface of semiconductor wafers (Si, SiC, Sapphire) and the surface of workpieces like semiconductor packages (EMC), Si, and SiC. The company offers a diverse range of products with Vitrified, Metal, and Resin bonding methods, characterized by enhanced lifetime and performance retention. Custom manufacturing is available for various grinders, with grit sizes ranging from Mesh #320 to #2000. Achieved sales in Metal Back Grinding Wheels in 2013 and Vitrified Back Grinding Wheels and Electro Plated Wheels in 2015.Grinding Wheel (Diamond Wheel): Products used for processing the backside surface of semiconductor wafers (Si, SiC, Sapphire) and the surface of workpieces like semiconductor packages (EMC), Si, and SiC. The company offers a diverse range of products with Vitrified, Metal, and Resin bonding methods, characterized by enhanced lifetime and performance retention. Custom manufacturing is available for various grinders, with grit sizes ranging from Mesh #320 to #2000. Achieved sales in Metal Back Grinding Wheels in 2013 and Vitrified Back Grinding Wheels and Electro Plated Wheels in 2015.
- Diamond Wire Saw: Diamond tools used in semiconductor wafer processing steps, such as slicing sapphire and silicon ingots. Achieved sales in Diamond Wire Saws for Sapphire Ingot in 2014.Diamond Wire Saw: Diamond tools used in semiconductor wafer processing steps, such as slicing sapphire and silicon ingots. Achieved sales in Diamond Wire Saws for Sapphire Ingot in 2014.
- Core Advantages
- Global Market Leading Technology: A global leader, achieving the top position in the CMP Pad Conditioner market share by sales volume in 2009. Possesses proprietary etching and reverse plating technologies that deliver 50% improved performance and more than twofold lower CMP process defect rates compared to competitors.Global Market Leading Technology: A global leader, achieving the top position in the CMP Pad Conditioner market share by sales volume in 2009. Possesses proprietary etching and reverse plating technologies that deliver 50% improved performance and more than twofold lower CMP process defect rates compared to competitors.
- Continuous R&D and Quality Innovation: Recognized for its technical capabilities by semiconductor companies worldwide through relentless R&D and quality innovation, providing differentiated products and services with a customer-centric approach in a rapidly changing IT environment. Strengthened R&D capabilities with the establishment of a technology research institute in 2006.Continuous R&D and Quality Innovation: Recognized for its technical capabilities by semiconductor companies worldwide through relentless R&D and quality innovation, providing differentiated products and services with a customer-centric approach in a rapidly changing IT environment. Strengthened R&D capabilities with the establishment of a technology research institute in 2006.
- Global Customer Network and Supply Capacity: Maintains a strong customer network, supplying products to major global semiconductor and IT companies including Samsung Electronics, SK Hynix, TSMC, Intel, and Micron Technology. Strengths include mass production capability of over 120,000 conditioners per month and systematic quality control through raw material diamond screening.Global Customer Network and Supply Capacity: Maintains a strong customer network, supplying products to major global semiconductor and IT companies including Samsung Electronics, SK Hynix, TSMC, Intel, and Micron Technology. Strengths include mass production capability of over 120,000 conditioners per month and systematic quality control through raw material diamond screening.
- Successful Localization and Market Pioneering: Successfully localized CMP Pad Conditioners for the first time in Korea in 1999, replacing entirely imported products and pioneering the domestic market by supplying to Samsung Electronics and Hyundai Electronics (now SK Hynix).Successful Localization and Market Pioneering: Successfully localized CMP Pad Conditioners for the first time in Korea in 1999, replacing entirely imported products and pioneering the domestic market by supplying to Samsung Electronics and Hyundai Electronics (now SK Hynix).
- Diversified Product Portfolio: Develops and produces a variety of diamond tools, including CMP Pad Conditioners, Grinding Wheels, and Diamond Wire Saws, offering comprehensive solutions across the semiconductor manufacturing process.Diversified Product Portfolio: Develops and produces a variety of diamond tools, including CMP Pad Conditioners, Grinding Wheels, and Diamond Wire Saws, offering comprehensive solutions across the semiconductor manufacturing process.
- Target Industrie
- Semiconductor Industry: Key processes in semiconductor manufacturing such as Chemical Mechanical Planarization (CMP), wafer backside grinding, and ingot slicing.Semiconductor Industry: Key processes in semiconductor manufacturing such as Chemical Mechanical Planarization (CMP), wafer backside grinding, and ingot slicing.
- IT Industry: Supplies diamond tools required for various IT industry sectors beyond semiconductors.IT Industry: Supplies diamond tools required for various IT industry sectors beyond semiconductors.
- Electrical/Electronics Industry: Classified under the electrical/electronics industry in the Ajou University RISE Project Group's family company status.Electrical/Electronics Industry: Classified under the electrical/electronics industry in the Ajou University RISE Project Group's family company status.
- Major Markets
- South Korea, TaiwanSouth Korea, Taiwan
- EuropeEurope
- USA (Texas – Austin branch established)USA (Texas – Austin branch established)
- Certifications/Patents
- ISO 14001 certification acquired (2005, URS Certification Body)ISO 14001 certification acquired (2005, URS Certification Body)
- Implementation of ISO 9001:2008 for quality-first policy, continuous quality improvement, and quality assurance activitiesImplementation of ISO 9001:2008 for quality-first policy, continuous quality improvement, and quality assurance activities
- Accreditation of Corporate Research Institute (2006, Korea Industrial Technology Association, No. 20062533)Accreditation of Corporate Research Institute (2006, Korea Industrial Technology Association, No. 20062533)
- Selected as a 'Soo-Bu-Jang Excellent Company' (Materials, Parts, and Equipment) (2021)Selected as a 'Soo-Bu-Jang Excellent Company' (Materials, Parts, and Equipment) (2021)
- Selected as a 'WORLD CLASS 300' company (2016)Selected as a 'WORLD CLASS 300' company (2016)
- Awarded the '70 Million Dollar Export Tower' on the 59th Trade Day (2022)Awarded the '70 Million Dollar Export Tower' on the 59th Trade Day (2022)
- Awarded the '20 Million Dollar Export Tower' on the 53rd Trade Day (2016)Awarded the '20 Million Dollar Export Tower' on the 53rd Trade Day (2016)
- Awarded the '10 Million Dollar Export Tower' on the 48th Trade Day (2011)Awarded the '10 Million Dollar Export Tower' on the 48th Trade Day (2011)
- Received commendations on Taxpayer's Day (Commissioner of the National Tax Service, 2006, 2010, 2016)Received commendations on Taxpayer's Day (Commissioner of the National Tax Service, 2006, 2010, 2016)
- Selected as Samsung Electronics' Top Environmental Safety Manufacturing Partner (2019)Selected as Samsung Electronics' Top Environmental Safety Manufacturing Partner (2019)
- Selected as Samsung Electronics' 'Strong Small and Medium-sized Enterprise of the Year' (2013)Selected as Samsung Electronics' 'Strong Small and Medium-sized Enterprise of the Year' (2013)
- Selected as a 'Promising Small and Medium-sized Enterprise' (Industrial Bank of Korea, 2002)Selected as a 'Promising Small and Medium-sized Enterprise' (Industrial Bank of Korea, 2002)
- Selected as a 'Youth-Friendly Strong Small Company' (Ministry of Employment and Labor, 2018)Selected as a 'Youth-Friendly Strong Small Company' (Ministry of Employment and Labor, 2018)
- Possesses etching and reverse plating technologies that improve CMP pad conditioner performance by 50% and reduce defect rates by more than twofold.Possesses etching and reverse plating technologies that improve CMP pad conditioner performance by 50% and reduce defect rates by more than twofold.
Introduction
Location
61 Sinwon-ro 91beon-gil, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
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