A company dedicated to R&D and global market expansion through the domestic introduction of PCB prototype machines and the development and manufacturing of fine lead wires.AcompanydedicatedtoR&DandglobalmarketexpansionthroughthedomesticintroductionofPCBprototypemachinesandthedevelopmentandmanufacturingoffineleadwires.
Key Products/TechnologiesKeyProducts/Technologies
**PCB Processing Machines**: Offers Eleven-Lab and Auto-Lab models. Capable of precise sample production and testing from CAD-designed circuit files within 5-30 minutes. Possesses world-first technology capable of manufacturing down to 50 microns.**PCBProcessingMachines**:OffersEleven-LabandAuto-Labmodels.CapableofprecisesampleproductionandtestingfromCAD-designedcircuitfileswithin5-30minutes.Possessesworld-firsttechnologycapableofmanufacturingdownto50microns.
**Fine Lead Wires**: A product line of processed wires used in mobile phones, small microphones, and sensors. The special coated jump wire for wiring features a Φ0.2mm special coated copper wire with a dielectric breakdown voltage of 2.0 KV. Enables direct soldering without stripping insulation, prevents short circuits even when wires overlap, and exhibits excellent high-frequency characteristics.**FineLeadWires**:Aproductlineofprocessedwiresusedinmobilephones,smallmicrophones,andsensors.ThespecialcoatedjumpwireforwiringfeaturesaΦ0.2mmspecialcoatedcopperwirewithadielectricbreakdownvoltageof2.0KV.Enablesdirectsolderingwithoutstrippinginsulation,preventsshortcircuitsevenwhenwiresoverlap,andexhibitsexcellenthigh-frequencycharacteristics.
**PCB Repair and Plating Products**: Products designed for immediate correction, supplementation, and response to error points occurring during the PCB manufacturing process. Provides various plating solutions such as electrolytic degreasing, activation, copper, nickel, gold, silver, cobalt, chromium, as well as anodes and brush plating solutions for partial plating.**PCBRepairandPlatingProducts**:Productsdesignedforimmediatecorrection,supplementation,andresponsetoerrorpointsoccurringduringthePCBmanufacturingprocess.Providesvariousplatingsolutionssuchaselectrolyticdegreasing,activation,copper,nickel,gold,silver,cobalt,chromium,aswellasanodesandbrushplatingsolutionsforpartialplating.
**Other PCB-related Products**: A comprehensive lineup including plating equipment (brush plating, immersion plating), anodizing production kits, universal boards, conversion boards, FPCBs, Raspberry Pi & Arduino, soldering practice boards, UV LED curing machines & precision exposure machines, fume extractors & air purifiers, R&D accessories, various chemical products, soldering lead, MEMS-related products, Teflon wrapped wires, fine heat-resistant flame-retardant wires, silicone wires, ultra-low and ultra-high temperature insulated wires, special copper wires for wiring, flat cables, and storage racks.**OtherPCB-relatedProducts**:Acomprehensivelineupincludingplatingequipment(brushplating,immersionplating),anodizingproductionkits,universalboards,conversionboards,FPCBs,RaspberryPi&Arduino,solderingpracticeboards,UVLEDcuringmachines&precisionexposuremachines,fumeextractors&airpurifiers,R&Daccessories,variouschemicalproducts,solderinglead,MEMS-relatedproducts,Teflonwrappedwires,fineheat-resistantflame-retardantwires,siliconewires,ultra-lowandultra-hightemperatureinsulatedwires,specialcopperwiresforwiring,flatcables,andstorageracks.
Core AdvantagesCoreAdvantages
**Leading Technology Introduction and Development Capability**: A pioneering role since its establishment in 1994, contributing significantly to domestic R&D by being the first to introduce PCB Prototype Machines into Korea.**LeadingTechnologyIntroductionandDevelopmentCapability**:Apioneeringrolesinceitsestablishmentin1994,contributingsignificantlytodomesticR&DbybeingthefirsttointroducePCBPrototypeMachinesintoKorea.
**Differentiated PCB Processing Technology**: Capability to precisely produce PCB samples from CAD files within 5-30 minutes. Holds world-first ultra-precision technology capable of manufacturing down to 50 microns.**DifferentiatedPCBProcessingTechnology**:CapabilitytopreciselyproducePCBsamplesfromCADfileswithin5-30minutes.Holdsworld-firstultra-precisiontechnologycapableofmanufacturingdownto50microns.
**High-Performance Fine Lead Wire Technology**: Development and manufacturing capability for special coated jump wires (Φ0.2mm) that allow direct soldering without stripping, prevent short circuits even when wires overlap, and offer excellent high-frequency characteristics.**High-PerformanceFineLeadWireTechnology**:Developmentandmanufacturingcapabilityforspecialcoatedjumpwires(Φ0.2mm)thatallowdirectsolderingwithoutstripping,preventshortcircuitsevenwhenwiresoverlap,andofferexcellenthigh-frequencycharacteristics.
**Comprehensive PCB Solution Provider**: Ability to provide total PCB-related solutions, from sample production and repair to various plating solutions, related equipment, and a wide range of consumables and accessories.**ComprehensivePCBSolutionProvider**:AbilitytoprovidetotalPCB-relatedsolutions,fromsampleproductionandrepairtovariousplatingsolutions,relatedequipment,andawiderangeofconsumablesandaccessories.
**Continuous R&D Investment**: Strengthening technological competitiveness through continuous R&D investment and efforts in developing and manufacturing fine lead wires.**ContinuousR&DInvestment**:StrengtheningtechnologicalcompetitivenessthroughcontinuousR&Dinvestmentandeffortsindevelopingandmanufacturingfineleadwires.
**Global Market Competitiveness**: Demonstrated strong export performance and global market competitiveness through awards such as the 'Ten Million Dollar Export Tower' and 'Seven Million Dollar Export Tower'.**GlobalMarketCompetitiveness**:Demonstratedstrongexportperformanceandglobalmarketcompetitivenessthroughawardssuchasthe'TenMillionDollarExportTower'and'SevenMillionDollarExportTower'.
Target IndustrieTargetIndustrie
**Education and R&D Institutions**: Support for PCB sample production and R&D activities in educational institutions including universities, technical high schools, and junior colleges.**EducationandR&DInstitutions**:SupportforPCBsampleproductionandR&Dactivitiesineducationalinstitutionsincludinguniversities,technicalhighschools,andjuniorcolleges.
**Electronics and Semiconductor Industries**: Supply of equipment and materials for PCB manufacturing and repair, as well as the advanced semiconductor substrate and packaging industries.**ElectronicsandSemiconductorIndustries**:SupplyofequipmentandmaterialsforPCBmanufacturingandrepair,aswellastheadvancedsemiconductorsubstrateandpackagingindustries.
**Small Electronic Device Industry**: Manufacturing of small electronic products requiring fine lead wires, such as mobile phones, small microphones, and sensors.**SmallElectronicDeviceIndustry**:Manufacturingofsmallelectronicproductsrequiringfineleadwires,suchasmobilephones,smallmicrophones,andsensors.
**Precision Machinery and Automation Industry**: Contribution to the industry through participation in relevant exhibitions such as the Daegu International Machinery Industry Expo and Smart Factory Construction & Production Automation Fair.**PrecisionMachineryandAutomationIndustry**:ContributiontotheindustrythroughparticipationinrelevantexhibitionssuchastheDaeguInternationalMachineryIndustryExpoandSmartFactoryConstruction&ProductionAutomationFair.
**Quality Management System Certification**: ISO 9001:2015 acquisition.**QualityManagementSystemCertification**:ISO9001:2015acquisition.
**Environmental Management System Certification**: ISO 14001:2015 acquisition.**EnvironmentalManagementSystemCertification**:ISO14001:2015acquisition.
**Export Performance Awards**: Awarded the 'Ten Million Dollar Export Tower' in 2021 and the 'Seven Million Dollar Export Tower' in 2020.**ExportPerformanceAwards**:Awardedthe'TenMillionDollarExportTower'in2021andthe'SevenMillionDollarExportTower'in2020.
**Technological Competence**: World-first PCB processing technology capable of manufacturing down to 50 microns. Special coated jump wire technology allowing direct soldering without stripping.**TechnologicalCompetence**:World-firstPCBprocessingtechnologycapableofmanufacturingdownto50microns.Specialcoatedjumpwiretechnologyallowingdirectsolderingwithoutstripping.
Introduction
Location
767 Sinsu-ro, Suji-gu, Yongin-si, Gyeonggi-do, South Korea
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Information
767 Sinsu-ro, Suji-gu, Yongin-si, Gyeonggi-do, South Korea