RORZE SYSTEMS, The Republic of Korea - Komachine Supplier Profile and Product List

- RORZE SYSTEMS Co., Ltd. is a specialized company established in November 1997, focusing on semiconductor and display manufacturing equipment, including clean robots, glass cutting systems, and EFEMs, primarily for the development and supply of automation systems. The company plays a crucial role in logistics transfer systems and laser processing equipment for FPD (Flat Panel Display) and semiconductor production lines. It leads technological innovation by commercializing the world's first laser-based full glass cutting technology. RORZE SYSTEMS is securing new growth engines by leveraging its unique laser cutting technology in response to the emerging semiconductor glass substrate market.RORZE SYSTEMS Co., Ltd. is a specialized company established in November 1997, focusing on semiconductor and display manufacturing equipment, including clean robots, glass cutting systems, and EFEMs, primarily for the development and supply of automation systems. The company plays a crucial role in logistics transfer systems and laser processing equipment for FPD (Flat Panel Display) and semiconductor production lines. It leads technological innovation by commercializing the world's first laser-based full glass cutting technology. RORZE SYSTEMS is securing new growth engines by leveraging its unique laser cutting technology in response to the emerging semiconductor glass substrate market.
- Index: A robot application system used in FPD processes for loading and unloading glass substrates into cassettes for inter-process transfer. It features linear motion via Rack/Pinion, a travel speed of 2.0m/s (FAB), and a travel axis repeatability of ±2.0mm (based on glass).Index: A robot application system used in FPD processes for loading and unloading glass substrates into cassettes for inter-process transfer. It features linear motion via Rack/Pinion, a travel speed of 2.0m/s (FAB), and a travel axis repeatability of ±2.0mm (based on glass).
- EFEM (Equipment Front End Module): Equipment for automatically transferring and loading/unloading FOUPs (Front Opening Unified Pods) containing wafers to/from process equipment in semiconductor fabs. It performs wafer movement, loading/unloading, and alignment functions, supporting up to two load ports and load locks. This includes ACE EFEM and ACE SORTER models.EFEM (Equipment Front End Module): Equipment for automatically transferring and loading/unloading FOUPs (Front Opening Unified Pods) containing wafers to/from process equipment in semiconductor fabs. It performs wafer movement, loading/unloading, and alignment functions, supporting up to two load ports and load locks. This includes ACE EFEM and ACE SORTER models.
- Wafer Sorter: A system for sorting and transferring wafers, enhancing efficiency in semiconductor processes in conjunction with EFEM.Wafer Sorter: A system for sorting and transferring wafers, enhancing efficiency in semiconductor processes in conjunction with EFEM.
- Laser Cutting Machine: Equipment that uses a high-power CO₂ laser beam to cut and discharge 6G OLED Glass. It boasts specifications such as a Cutting Speed of 300mm/s, Straightness of ±40㎛, Orthogonal of 90˚ ±2˚, and Glass Thickness of 0.4~0.7t. It provides processing evaluation and systems for cutting, marking, and drilling of Glass, Wafer, Film, Ceramic, and Metal using picosecond, nanosecond, and CO2 laser processing systems.Laser Cutting Machine: Equipment that uses a high-power CO₂ laser beam to cut and discharge 6G OLED Glass. It boasts specifications such as a Cutting Speed of 300mm/s, Straightness of ±40㎛, Orthogonal of 90˚ ±2˚, and Glass Thickness of 0.4~0.7t. It provides processing evaluation and systems for cutting, marking, and drilling of Glass, Wafer, Film, Ceramic, and Metal using picosecond, nanosecond, and CO2 laser processing systems.
- Laser Cutting Development Equipment: Equipment for developing laser processing technology for various substrates, possessing diverse laser technologies including 0.03t UTG (Ultra Thin Glass) cutting, 0.1t, 0.3t, 2t, 2.8t thick glass cutting, LCD/OLED glass cutting, tempered glass cutting, and film/PET cutting.Laser Cutting Development Equipment: Equipment for developing laser processing technology for various substrates, possessing diverse laser technologies including 0.03t UTG (Ultra Thin Glass) cutting, 0.1t, 0.3t, 2t, 2.8t thick glass cutting, LCD/OLED glass cutting, tempered glass cutting, and film/PET cutting.
- OS Tester: Equipment for inspecting the condition of wafers or glass during semiconductor and display processes.OS Tester: Equipment for inspecting the condition of wafers or glass during semiconductor and display processes.
- LoadPort (ACE300): A device for transferring wafers between wafer storage containers and process equipment.LoadPort (ACE300): A device for transferring wafers between wafer storage containers and process equipment.
- Robots (Clean Robot, Mobile Robot, Atmospheric Robot, Vacuum Wafer Robot, Dual Arm Robot): Robot systems for transferring glass and wafers in semiconductor and FPD production lines. Including RC Series and RD Series models, these are Clean Type products with a sealed structure to prevent foreign matter intrusion and enable vacuum suction. The RC-400 series controllers offer flexibility and high-speed data communication, controlling complex robot movements through LINK MASTER, I/O MASTER, and GENERATE MASTER functions.Robots (Clean Robot, Mobile Robot, Atmospheric Robot, Vacuum Wafer Robot, Dual Arm Robot): Robot systems for transferring glass and wafers in semiconductor and FPD production lines. Including RC Series and RD Series models, these are Clean Type products with a sealed structure to prevent foreign matter intrusion and enable vacuum suction. The RC-400 series controllers offer flexibility and high-speed data communication, controlling complex robot movements through LINK MASTER, I/O MASTER, and GENERATE MASTER functions.
- Aligner: Equipment responsible for aligning wafers or glass, essential for precise process execution.Aligner: Equipment responsible for aligning wafers or glass, essential for precise process execution.
- Vacuum Platform: A platform used for transferring and processing wafers in a vacuum environment.Vacuum Platform: A platform used for transferring and processing wafers in a vacuum environment.
- Inkjet Printing System: A system capable of forming uniform and free coating films on various substrates with innovative control technology for consistent area and thickness. It features high-resolution print heads, high-precision uniformity & profile control, and Mura correction functions.Inkjet Printing System: A system capable of forming uniform and free coating films on various substrates with innovative control technology for consistent area and thickness. It features high-resolution print heads, high-precision uniformity & profile control, and Mura correction functions.
- Unique Laser Cutting Technology: The company's technological prowess in developing and commercializing the world's first 'Laser Glass Cutting Machine (GCM)' applied to FPD production processes. This technology offers fewer micro-cracks and particles compared to conventional diamond wheel methods, with superior cut surface strength, making it essential for high-precision display production such as OLED.Unique Laser Cutting Technology: The company's technological prowess in developing and commercializing the world's first 'Laser Glass Cutting Machine (GCM)' applied to FPD production processes. This technology offers fewer micro-cracks and particles compared to conventional diamond wheel methods, with superior cut surface strength, making it essential for high-precision display production such as OLED.
- Engineer-Centric Technology Management and R&D Capabilities: Approximately 40% of the total workforce consists of research personnel, establishing a 'just-in-time development' system tailored to customer requirements. A majority of the management team comprises experienced engineers, providing a strong advantage in solving technical challenges in process automation. Recognized as an excellent corporate research institute in 2019.Engineer-Centric Technology Management and R&D Capabilities: Approximately 40% of the total workforce consists of research personnel, establishing a 'just-in-time development' system tailored to customer requirements. A majority of the management team comprises experienced engineers, providing a strong advantage in solving technical challenges in process automation. Recognized as an excellent corporate research institute in 2019.
- Optimized Logistics Automation Systems for Cleanroom Environments: Capability to develop transfer systems with low particle generation, high throughput, and high reliability in semiconductor and display manufacturing processes. Minimizing particle generation in cleanrooms and reducing the risk of damage to larger, thinner glass substrates through precise handling technology, contributing to improved customer yield and productivity.Optimized Logistics Automation Systems for Cleanroom Environments: Capability to develop transfer systems with low particle generation, high throughput, and high reliability in semiconductor and display manufacturing processes. Minimizing particle generation in cleanrooms and reducing the risk of damage to larger, thinner glass substrates through precise handling technology, contributing to improved customer yield and productivity.
- Diverse Automation Equipment Portfolio and Customized Solutions: Development and supply of a wide range of automation equipment necessary for semiconductor and display production, including clean robots, glass cutting systems, EFEM, Wafer Sorter, LoadPort, and Aligner. Providing customized solutions from design to software configuration and installation, tailored to the specific automation characteristics of FPD module manufacturers and semiconductor device manufacturers.Diverse Automation Equipment Portfolio and Customized Solutions: Development and supply of a wide range of automation equipment necessary for semiconductor and display production, including clean robots, glass cutting systems, EFEM, Wafer Sorter, LoadPort, and Aligner. Providing customized solutions from design to software configuration and installation, tailored to the specific automation characteristics of FPD module manufacturers and semiconductor device manufacturers.
- Global Customer Network and International Market Expansion: Establishment of strong trust relationships with leading domestic and international customers such as Samsung Display and SK Hynix. Building a global network through numerous overseas subsidiaries including RORZE INTERNATIONAL PTE. LTD. (Singapore), RORZE AUTOMATION, INC. (U.S.A.), RORZE ROBOTECH CO., LTD. (Vietnam), RORZE TECHNOLOGY, INC. (Taiwan), RORZE SYSTEMS CORPORATION (Korea), RORZE CREATECH CO., LTD. (China), and RORZE ENGINEERING GmbH (Germany).Global Customer Network and International Market Expansion: Establishment of strong trust relationships with leading domestic and international customers such as Samsung Display and SK Hynix. Building a global network through numerous overseas subsidiaries including RORZE INTERNATIONAL PTE. LTD. (Singapore), RORZE AUTOMATION, INC. (U.S.A.), RORZE ROBOTECH CO., LTD. (Vietnam), RORZE TECHNOLOGY, INC. (Taiwan), RORZE SYSTEMS CORPORATION (Korea), RORZE CREATECH CO., LTD. (China), and RORZE ENGINEERING GmbH (Germany).
- Semiconductor Manufacturing: Application of automation systems across the entire semiconductor production process, including wafer transfer, alignment, inspection, and vacuum environment processing.Semiconductor Manufacturing: Application of automation systems across the entire semiconductor production process, including wafer transfer, alignment, inspection, and vacuum environment processing.
- Flat Panel Display (FPD) Manufacturing: Application of glass transfer, cutting, module equipment, and inkjet printing systems in the manufacturing processes of LCD, OLED, and other display panels.Flat Panel Display (FPD) Manufacturing: Application of glass transfer, cutting, module equipment, and inkjet printing systems in the manufacturing processes of LCD, OLED, and other display panels.
- Life Science Automation: Provision of incubators (cell culture equipment) and software packages for improving efficiency and automation in cell culture operations.Life Science Automation: Provision of incubators (cell culture equipment) and software packages for improving efficiency and automation in cell culture operations.
- Mobile Robot Market: Application of smart factory solutions utilizing next-generation mobile robot (AMR) technology.Mobile Robot Market: Application of smart factory solutions utilizing next-generation mobile robot (AMR) technology.
- South Korea, Singapore, Vietnam, Taiwan, ChinaSouth Korea, Singapore, Vietnam, Taiwan, China
- Germany, FranceGermany, France
- U.S.A.U.S.A.
- Possession of 110 patents.Possession of 110 patents.
- Acquisition of patent rights related to electrode pattern inspection devices (February 15, 2012).Acquisition of patent rights related to electrode pattern inspection devices (February 15, 2012).
- Acquisition of patent for contact-type electrode pattern inspection device (January 15, 2013).Acquisition of patent for contact-type electrode pattern inspection device (January 15, 2013).
- Acquisition of patent rights related to side edge clamp type multi-finger robots (July 14, 2010).Acquisition of patent rights related to side edge clamp type multi-finger robots (July 14, 2010).
- Acquisition of patent rights related to substrate transfer devices (January 21, 2021).Acquisition of patent rights related to substrate transfer devices (January 21, 2021).
- Acquisition of patent for wafer mapping method using displacement sensor (December 12, 2007).Acquisition of patent for wafer mapping method using displacement sensor (December 12, 2007).
- Patent for bending robot for flexible printed circuit boards (2021).Patent for bending robot for flexible printed circuit boards (2021).
- Selected as an excellent corporate research institute in 2019.Selected as an excellent corporate research institute in 2019.
- Commendation as an exemplary taxpayer on Taxpayer's Day (March 2025).Commendation as an exemplary taxpayer on Taxpayer's Day (March 2025).