Information
8-5 Nakajimachō, Nishinomiya, Hyogo 663-8105, Japan
-
-
Overview
- Summary
- Rokko Electronics is a Japan-based company established in Nishinomiya in 1983, specializing in semiconductor wafer grinding and polishing services. The company possesses essential technological capabilities for semiconductor product manufacturing, including silicon wafer processing, prime wafer mirror polishing, double-sided mirror polishing, and back grinding. Since 1994, it has expanded into wafer regeneration processing, contributing to resource efficiency. Rokko Electronics provides precise processing services utilizing various advanced equipment such as large polishing machines, grinders, and lapping machines. The company has also secured proprietary technologies in processing special wafers like SiC, sapphire, and MEMS.Rokko Electronics is a Japan-based company established in Nishinomiya in 1983, specializing in semiconductor wafer grinding and polishing services. The company possesses essential technological capabilities for semiconductor product manufacturing, including silicon wafer processing, prime wafer mirror polishing, double-sided mirror polishing, and back grinding. Since 1994, it has expanded into wafer regeneration processing, contributing to resource efficiency. Rokko Electronics provides precise processing services utilizing various advanced equipment such as large polishing machines, grinders, and lapping machines. The company has also secured proprietary technologies in processing special wafers like SiC, sapphire, and MEMS.
- Key Products/Technologies
- Silicon Wafer Processing: Essential surface treatment technologies for semiconductor production, including prime wafer mirror polishing, double-sided mirror polishing, and back grinding.Silicon Wafer Processing: Essential surface treatment technologies for semiconductor production, including prime wafer mirror polishing, double-sided mirror polishing, and back grinding.
- SiC Wafer Grinding and Polishing Services: Integrated services for SiC wafer grinding, polishing, and RCA cleaning, utilizing high-rigidity grinders to improve flatness and surface roughness with proprietary technology.SiC Wafer Grinding and Polishing Services: Integrated services for SiC wafer grinding, polishing, and RCA cleaning, utilizing high-rigidity grinders to improve flatness and surface roughness with proprietary technology.
- MEMS Wafer Special Processing: Specialized grinding and polishing techniques for complex MEMS applications, including SOI, glass/Si mounted, through-holed, cavity-structured, Through-Silicon Via (TSV), and non-circular wafers.MEMS Wafer Special Processing: Specialized grinding and polishing techniques for complex MEMS applications, including SOI, glass/Si mounted, through-holed, cavity-structured, Through-Silicon Via (TSV), and non-circular wafers.
- Wafer Regeneration Processing Services: Environmentally friendly recycling services that restore monitor wafers to their original quality for reuse, contributing to customer material cost reduction.Wafer Regeneration Processing Services: Environmentally friendly recycling services that restore monitor wafers to their original quality for reuse, contributing to customer material cost reduction.
- Ultra-Thin Wafer Processing: Capability to precisely process 4-8 inch wafers to a thinness of 15-100 μm, providing surfaces suitable for sensor and power device applications.Ultra-Thin Wafer Processing: Capability to precisely process 4-8 inch wafers to a thinness of 15-100 μm, providing surfaces suitable for sensor and power device applications.
- High-Precision Polishing Technology: Highly sophisticated polishing techniques to remove microscopic roughness from wafer surfaces, achieving mirror finishes without distortion or scratches.High-Precision Polishing Technology: Highly sophisticated polishing techniques to remove microscopic roughness from wafer surfaces, achieving mirror finishes without distortion or scratches.
- Knife Edge Prevention Process and Beveling Services: Pre-grinding beveling services to prevent breakage or chipping of wafers after thinning.Knife Edge Prevention Process and Beveling Services: Pre-grinding beveling services to prevent breakage or chipping of wafers after thinning.
- Automated Cleaning and Inspection Equipment: Automated cleaning equipment for controlling metal contamination and particles, along with non-contact wafer thickness measurement devices and surface inspection equipment for precise quality control.Automated Cleaning and Inspection Equipment: Automated cleaning equipment for controlling metal contamination and particles, along with non-contact wafer thickness measurement devices and surface inspection equipment for precise quality control.
- Rokko Premium Process: A unique process developed to address knife-edge issues and contamination on the backside of patterned wafers during thinning.Rokko Premium Process: A unique process developed to address knife-edge issues and contamination on the backside of patterned wafers during thinning.
- Core Advantages
- Integrated Process Service Provision: Offering comprehensive integrated process services including wafer grinding, polishing, and RCA cleaning, providing high-precision processing solutions tailored to customer needs.Integrated Process Service Provision: Offering comprehensive integrated process services including wafer grinding, polishing, and RCA cleaning, providing high-precision processing solutions tailored to customer needs.
- Expertise in Diverse Materials and Special Wafer Handling: Extensive experience and technical capabilities in processing difficult-to-process new materials like SiC, LT, LN, and sapphire, as well as specialized wafers such as MEMS, TSV, and cavity structures, beyond standard silicon.Expertise in Diverse Materials and Special Wafer Handling: Extensive experience and technical capabilities in processing difficult-to-process new materials like SiC, LT, LN, and sapphire, as well as specialized wafers such as MEMS, TSV, and cavity structures, beyond standard silicon.
- Ultra-Thin and High-Quality Mirror Polishing Technology: Highly skilled polishing techniques capable of ultra-thin wafer processing down to 15 μm and achieving distortion-free mirror finishes, ensuring high flatness and low surface roughness.Ultra-Thin and High-Quality Mirror Polishing Technology: Highly skilled polishing techniques capable of ultra-thin wafer processing down to 15 μm and achieving distortion-free mirror finishes, ensuring high flatness and low surface roughness.
- Advanced Wafer Regeneration Technology: Proprietary know-how in monitor wafer regeneration services, contributing to reduced material costs for semiconductor production processes and environmental protection.Advanced Wafer Regeneration Technology: Proprietary know-how in monitor wafer regeneration services, contributing to reduced material costs for semiconductor production processes and environmental protection.
- Strict Quality Control and Automated Processes: Implementation of ISO 9001 and ISO 14001 certified quality and environmental management systems, automated grinding and polishing equipment, and non-contact thickness measurement technology to ensure consistent and stable high-quality services.Strict Quality Control and Automated Processes: Implementation of ISO 9001 and ISO 14001 certified quality and environmental management systems, automated grinding and polishing equipment, and non-contact thickness measurement technology to ensure consistent and stable high-quality services.
- Continuous R&D and Technological Innovation: Ongoing efforts in adopting new technologies and improving processes, with a focus on developing unique technologies such as highly efficient mirror polishing for SiC wafers.Continuous R&D and Technological Innovation: Ongoing efforts in adopting new technologies and improving processes, with a focus on developing unique technologies such as highly efficient mirror polishing for SiC wafers.
- Customized Solution Provision: Flexible responsiveness to specific customer requirements, offering optimized processing services from the R&D stage to mass production.Customized Solution Provision: Flexible responsiveness to specific customer requirements, offering optimized processing services from the R&D stage to mass production.
- Target Industries
- Semiconductor Industry: Supporting semiconductor device manufacturing processes through silicon wafer processing and regeneration.Semiconductor Industry: Supporting semiconductor device manufacturing processes through silicon wafer processing and regeneration.
- Power Semiconductor Industry: Providing backside grinding and mirror polishing services to enhance heat dissipation performance for power devices used in high-voltage applications.Power Semiconductor Industry: Providing backside grinding and mirror polishing services to enhance heat dissipation performance for power devices used in high-voltage applications.
- Sensor Industry: Applying wafer processing technology to provide thin/mirror-finished surfaces required for high-precision sensor devices.Sensor Industry: Applying wafer processing technology to provide thin/mirror-finished surfaces required for high-precision sensor devices.
- MEMS Industry: Special wafer grinding and polishing processes for manufacturing complex MEMS devices, including SOI, TSV, and cavity structures.MEMS Industry: Special wafer grinding and polishing processes for manufacturing complex MEMS devices, including SOI, TSV, and cavity structures.
- Automotive and Electric Vehicle Industry: Contributing to next-generation mobility sectors like electric vehicles through SiC wafer processing for high-efficiency power semiconductors.Automotive and Electric Vehicle Industry: Contributing to next-generation mobility sectors like electric vehicles through SiC wafer processing for high-efficiency power semiconductors.
- Major Markets
- Japan, South Korea, Taiwan, China, Southeast AsiaJapan, South Korea, Taiwan, China, Southeast Asia
- Certain regionsCertain regions
- USAUSA
- Certifications/Patents
- ISO 9001:2015 Certification: Attainment of the international standard for quality management systems, establishing a quality control framework prioritizing customer satisfaction.ISO 9001:2015 Certification: Attainment of the international standard for quality management systems, establishing a quality control framework prioritizing customer satisfaction.
- ISO 14001 Certification: Attainment of the international standard for environmental management systems, demonstrating commitment to environmental protection and sustainable management practices.ISO 14001 Certification: Attainment of the international standard for environmental management systems, demonstrating commitment to environmental protection and sustainable management practices.
- Highly Efficient Mirror Polishing Technology for SiC Wafers: Development of a unique technology called abrasive grain generating polishing, utilizing potassium permanganate to achieve highly efficient mirror polishing of SiC wafers.Highly Efficient Mirror Polishing Technology for SiC Wafers: Development of a unique technology called abrasive grain generating polishing, utilizing potassium permanganate to achieve highly efficient mirror polishing of SiC wafers.
- Copper-Contamination-Free Test Wafer Regeneration Process: Development of new film removal etchants and polishing slurries to prevent copper contamination, meeting the demands of semiconductor manufacturers.Copper-Contamination-Free Test Wafer Regeneration Process: Development of new film removal etchants and polishing slurries to prevent copper contamination, meeting the demands of semiconductor manufacturers.
- NC Controlled Beveling Technology: Provision of beveling services capable of adjusting edge shapes according to various wafer thicknesses through an NC control system.NC Controlled Beveling Technology: Provision of beveling services capable of adjusting edge shapes according to various wafer thicknesses through an NC control system.
- Non-Contact Gauge (NCG) Based Thickness Measurement Technology: Precise measurement of all wafers, including MEMS and cavity-structured wafers, using a non-contact laser-based thickness measurement system.Non-Contact Gauge (NCG) Based Thickness Measurement Technology: Precise measurement of all wafers, including MEMS and cavity-structured wafers, using a non-contact laser-based thickness measurement system.
- Nishinomiya City Excellent Business Award in 2012: Recognition for contributing to local community development and achieving outstanding business performance.Nishinomiya City Excellent Business Award in 2012: Recognition for contributing to local community development and achieving outstanding business performance.
- Hyogo Prefecture Location Promotion Project and Supply Chain Countermeasure Project Recognition: Acknowledged as a company contributing to regional economic revitalization and supply chain stability.Hyogo Prefecture Location Promotion Project and Supply Chain Countermeasure Project Recognition: Acknowledged as a company contributing to regional economic revitalization and supply chain stability.
Introduction
Location
8-5 Nakajimachō, Nishinomiya, Hyogo 663-8105, Japan
클릭하여 위치 살펴보기
