Information
213 Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
+82 31-499-2815
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Overview
- Summary
- RF-Materials Co., Ltd. is a specialized manufacturer of compound semiconductor packages, possessing in-house capabilities for multilayer ceramic, heat sink, dissimilar material bonding, and plating processes. The company ensures the supply of highly reliable, top-quality products through its integrated in-house system. It provides specialized hermetic packages and customized solutions for various advanced industries, including RF (Radio Frequency) transistor packages, optical communication packages, laser packages, infrared detection packages, and military, medical, automotive, and aerospace applications. Established in 2004, the company continuously strengthens its competitiveness in domestic and international markets through ongoing technological innovation and R&D.RF-Materials Co., Ltd. is a specialized manufacturer of compound semiconductor packages, possessing in-house capabilities for multilayer ceramic, heat sink, dissimilar material bonding, and plating processes. The company ensures the supply of highly reliable, top-quality products through its integrated in-house system. It provides specialized hermetic packages and customized solutions for various advanced industries, including RF (Radio Frequency) transistor packages, optical communication packages, laser packages, infrared detection packages, and military, medical, automotive, and aerospace applications. Established in 2004, the company continuously strengthens its competitiveness in domestic and international markets through ongoing technological innovation and R&D.
- Key Products/Technologies
- **Main Product Categories**: RF transistor packages, optical communication packages, laser packages, infrared detection packages, military/medical/automotive/aerospace packages, ceramic components, and Laser Diode Modules. The company offers ceramic packages with superior mechanical properties, suitable for small, high-density, and surface-mountable applications.**Main Product Categories**: RF transistor packages, optical communication packages, laser packages, infrared detection packages, military/medical/automotive/aerospace packages, ceramic components, and Laser Diode Modules. The company offers ceramic packages with superior mechanical properties, suitable for small, high-density, and surface-mountable applications.
- **Core Technologies**: Heat sink material technology, utilizing materials like CPC, CMC, S-CMC, CuW, and MoCu for high thermal conductivity and low thermal expansion coefficient. Ceramic material technology, encompassing ceramic green sheet and single/multi-layer ceramic manufacturing processes. Super-high frequency design technology, involving simulation, interpretation, and measurement for optimized package performance, impedance matching, low insertion loss, low reflection coefficient, and broadband characteristics.**Core Technologies**: Heat sink material technology, utilizing materials like CPC, CMC, S-CMC, CuW, and MoCu for high thermal conductivity and low thermal expansion coefficient. Ceramic material technology, encompassing ceramic green sheet and single/multi-layer ceramic manufacturing processes. Super-high frequency design technology, involving simulation, interpretation, and measurement for optimized package performance, impedance matching, low insertion loss, low reflection coefficient, and broadband characteristics.
- Laser Diode (LD) Module technology, including module heat dissipation design, optical design, precision alignment of optical components, and high-power module process technology. Surface treatment technology, covering plating processes such as Ni/Au, Ni/Pd/Au, Ni/Co/Au, and AuSn for corrosion and oxidation resistance of packages. Dissimilar materials bonding technology, featuring high-precision bonding techniques like glass sealing, metallizing, brazing, and high-temperature soldering for materials with different thermal properties.Laser Diode (LD) Module technology, including module heat dissipation design, optical design, precision alignment of optical components, and high-power module process technology. Surface treatment technology, covering plating processes such as Ni/Au, Ni/Pd/Au, Ni/Co/Au, and AuSn for corrosion and oxidation resistance of packages. Dissimilar materials bonding technology, featuring high-precision bonding techniques like glass sealing, metallizing, brazing, and high-temperature soldering for materials with different thermal properties.
- Core Advantages
- An in-house system for compound semiconductor package manufacturing, including multilayer ceramic, heat sink, dissimilar material bonding, and plating processes. This integrated system ensures the stable supply of highly reliable, top-quality products.An in-house system for compound semiconductor package manufacturing, including multilayer ceramic, heat sink, dissimilar material bonding, and plating processes. This integrated system ensures the stable supply of highly reliable, top-quality products.
- Possession of top-tier domestic technology in glass sealing, metallizing, and brazing for dissimilar material bonding. Expertise in engineering to optimize the characteristics of various materials.Possession of top-tier domestic technology in glass sealing, metallizing, and brazing for dissimilar material bonding. Expertise in engineering to optimize the characteristics of various materials.
- Pioneering development and mass production of optical communication packages in Korea. Since joining the RFHIC Group, the company supports the group's RF component and packaging value chain, creating synergy.Pioneering development and mass production of optical communication packages in Korea. Since joining the RFHIC Group, the company supports the group's RF component and packaging value chain, creating synergy.
- Automated assembly and inspection systems for precision manufacturing. This capability ensures the production of only highly reliable products with efficient productivity.Automated assembly and inspection systems for precision manufacturing. This capability ensures the production of only highly reliable products with efficient productivity.
- Establishment of multi-layered HTCC ceramic lines and single-layer ceramic lines, enabling both mass production and customized small-quantity, multi-variety production to meet customer demands.Establishment of multi-layered HTCC ceramic lines and single-layer ceramic lines, enabling both mass production and customized small-quantity, multi-variety production to meet customer demands.
- Accumulated package manufacturing technologies allowing for in-house production of laser diode modules.Accumulated package manufacturing technologies allowing for in-house production of laser diode modules.
- Optimized plating technology for various materials and a clean working environment, guaranteeing uniform coating quality.Optimized plating technology for various materials and a clean working environment, guaranteeing uniform coating quality.
- Target Industrie
- Wireless communication industry (RF transistor packages, 5G and next-generation wireless network base stations, antennas, communication infrastructure).Wireless communication industry (RF transistor packages, 5G and next-generation wireless network base stations, antennas, communication infrastructure).
- Optical communication industry (optical communication packages, laser diode modules).Optical communication industry (optical communication packages, laser diode modules).
- Defense and aerospace industries (military packages, radar, satellite communications, aerospace packages, high-power RF applications).Defense and aerospace industries (military packages, radar, satellite communications, aerospace packages, high-power RF applications).
- Automotive industry (automotive packages, laser modules, ADAS systems, vehicle communication).Automotive industry (automotive packages, laser modules, ADAS systems, vehicle communication).
- Medical industry (medical packages, laser modules, medical device communications).Medical industry (medical packages, laser modules, medical device communications).
- Industrial equipment and X-ray sectors (industrial equipment, X-ray related components).Industrial equipment and X-ray sectors (industrial equipment, X-ray related components).
- Consumer electronics (RF components for smartphones, tablets, IoT devices, etc.).Consumer electronics (RF components for smartphones, tablets, IoT devices, etc.).
- Major Markets
- South Korea, General Asian MarketSouth Korea, General Asian Market
- Certifications/Patents
- KS Q ISO 9001:2015 Certification (QSC2593).KS Q ISO 9001:2015 Certification (QSC2593).
- IATF 16949 Certification (0356445).IATF 16949 Certification (0356445).
- Venture Company Certification (No. 20180300436, No. 20200300517).Venture Company Certification (No. 20180300436, No. 20200300517).
- Material/Component Specialist Company Certification (No. 18311).Material/Component Specialist Company Certification (No. 18311).
- Technology Innovation Small and Medium Business (INNO-BIZ) Designation (No. R7061-2924).Technology Innovation Small and Medium Business (INNO-BIZ) Designation (No. R7061-2924).
- World Class Product Certification.World Class Product Certification.
- Korea Special Process Certification (KSPC510 Chemical Treatment).Korea Special Process Certification (KSPC510 Chemical Treatment).
- Excellent Corporate Research Institute Designation.Excellent Corporate Research Institute Designation.
- Gyeonggi-do Excellent Export Small and Medium Business Award.Gyeonggi-do Excellent Export Small and Medium Business Award.
- Gyeonggi-do Electronic Trade Frontier Company Selection.Gyeonggi-do Electronic Trade Frontier Company Selection.
- Root Enterprise Specialist Company Designation (No. 160606-0151).Root Enterprise Specialist Company Designation (No. 160606-0151).
- Gyeonggi-do Export Promising Small and Medium Business Designation (No. 11 Gyeonggi-275).Gyeonggi-do Export Promising Small and Medium Business Designation (No. 11 Gyeonggi-275).
- Gyeonggi-do Star Company Designation (No. 2018-036).Gyeonggi-do Star Company Designation (No. 2018-036).
- Global Hidden Champion Designation (No. 2019-092).Global Hidden Champion Designation (No. 2019-092).
Introduction
Location
213 Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
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