Information
213 Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
+82 31-499-2815
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Overview
- Summary
- RF-Materials is a specialized manufacturer of compound semiconductor packages, offering hermetic packages and customized solutions for various advanced industries including RF, optical communication, laser, defense, aerospace, and automotive sectors. The company's in-house capabilities in multilayer ceramic, heat sink, dissimilar material bonding, and plating processes ensure the supply of highly reliable products. Since its establishment in 2004, the company has continuously strengthened its competitiveness in domestic and international markets through ongoing technological innovation and R&D. As an affiliate of RFHIC, it is expanding its market presence by integrating into global value chains.RF-Materials is a specialized manufacturer of compound semiconductor packages, offering hermetic packages and customized solutions for various advanced industries including RF, optical communication, laser, defense, aerospace, and automotive sectors. The company's in-house capabilities in multilayer ceramic, heat sink, dissimilar material bonding, and plating processes ensure the supply of highly reliable products. Since its establishment in 2004, the company has continuously strengthened its competitiveness in domestic and international markets through ongoing technological innovation and R&D. As an affiliate of RFHIC, it is expanding its market presence by integrating into global value chains.
- Key Products/Technologies
- RF (Radio Frequency) Transistor Packages: Packages for compound semiconductors (GaN, GaAs, InP, etc.) used in wireless and optical communications, including heat sinks and ceramic terminals.RF (Radio Frequency) Transistor Packages: Packages for compound semiconductors (GaN, GaAs, InP, etc.) used in wireless and optical communications, including heat sinks and ceramic terminals.
- Optical Communication Packages: Packages for optical communication modules and optical transceivers, first developed and mass-produced in Korea.Optical Communication Packages: Packages for optical communication modules and optical transceivers, first developed and mass-produced in Korea.
- Laser Packages: Semiconductor packages for laser modules in industrial and medical laser devices, characterized by hermetic and thermal dissipation structures.Laser Packages: Semiconductor packages for laser modules in industrial and medical laser devices, characterized by hermetic and thermal dissipation structures.
- Military Packages: Infrared (IR) sensor packages for night operations (housing InSb, InGaAs, etc. compound semiconductors) and military equipment components.Military Packages: Infrared (IR) sensor packages for night operations (housing InSb, InGaAs, etc. compound semiconductors) and military equipment components.
- Ceramic Components: Establishment of single and multi-layer HTCC ceramic lines and green sheet manufacturing technology.Ceramic Components: Establishment of single and multi-layer HTCC ceramic lines and green sheet manufacturing technology.
- Laser Diode (LD) Modules: Integration of module thermal design, optical design, precise optical component alignment, and high-power module process technology.Laser Diode (LD) Modules: Integration of module thermal design, optical design, precise optical component alignment, and high-power module process technology.
- Multilayer Ceramic Manufacturing Process: Capabilities in ceramic green sheet, single-layer, and multi-layer ceramic production.Multilayer Ceramic Manufacturing Process: Capabilities in ceramic green sheet, single-layer, and multi-layer ceramic production.
- Dissimilar Material Bonding Process: High-precision bonding technology for materials with different thermal characteristics, including glass sealing, metallization, brazing, and high-temperature soldering.Dissimilar Material Bonding Process: High-precision bonding technology for materials with different thermal characteristics, including glass sealing, metallization, brazing, and high-temperature soldering.
- Core Advantages
- In-house System and Vertical Integration: An in-house system encompassing multilayer ceramic, heat sink, dissimilar material bonding, and plating processes, ensuring the stable supply of highly reliable, top-quality products.In-house System and Vertical Integration: An in-house system encompassing multilayer ceramic, heat sink, dissimilar material bonding, and plating processes, ensuring the stable supply of highly reliable, top-quality products.
- Dissimilar Material Bonding Technology: Domestically top-tier capabilities in high-precision bonding of materials with differing thermal characteristics, including glass sealing, metallization, and brazing.Dissimilar Material Bonding Technology: Domestically top-tier capabilities in high-precision bonding of materials with differing thermal characteristics, including glass sealing, metallization, and brazing.
- Customized Solutions for Diverse Advanced Industries: Provision of specialized hermetic packages and tailored solutions for various high-tech sectors such as RF transistors, optical communications, lasers, and infrared sensing packages.Customized Solutions for Diverse Advanced Industries: Provision of specialized hermetic packages and tailored solutions for various high-tech sectors such as RF transistors, optical communications, lasers, and infrared sensing packages.
- Continuous Technological Innovation and R&D: A strong position as a specialized component and material company, consistently enhancing competitiveness in domestic and international markets through ongoing technological innovation and research and development since its establishment in 2004.Continuous Technological Innovation and R&D: A strong position as a specialized component and material company, consistently enhancing competitiveness in domestic and international markets through ongoing technological innovation and research and development since its establishment in 2004.
- Integration into Global Value Chains and Market Expansion: As an RFHIC affiliate, strengthening its role in the global communication equipment supply chain realignment, securing global clients like Lumentum for NVIDIA AI server optical transceiver thermal modules.Integration into Global Value Chains and Market Expansion: As an RFHIC affiliate, strengthening its role in the global communication equipment supply chain realignment, securing global clients like Lumentum for NVIDIA AI server optical transceiver thermal modules.
- Fast Delivery and Competitive Pricing: Commitment to supplying highly reliable products with quick turnaround times and competitive pricing.Fast Delivery and Competitive Pricing: Commitment to supplying highly reliable products with quick turnaround times and competitive pricing.
- Target Industries
- Wireless Communication Industry: RF communication, 5G/6G communication equipment, base station sectors.Wireless Communication Industry: RF communication, 5G/6G communication equipment, base station sectors.
- Optical Communication Industry: Optical communication modules and optical transceivers sectors.Optical Communication Industry: Optical communication modules and optical transceivers sectors.
- Laser Industry: Industrial and medical lasers, laser modules, OCT systems, thermal imaging, material processing sectors.Laser Industry: Industrial and medical lasers, laser modules, OCT systems, thermal imaging, material processing sectors.
- Defense and Military Industry: Military infrared sensor packages, military equipment components, aerospace sectors.Defense and Military Industry: Military infrared sensor packages, military equipment components, aerospace sectors.
- Automotive Industry: Heat sinks for electric vehicle power modules, packages for electric vehicle battery control sensors, ADAS sectors.Automotive Industry: Heat sinks for electric vehicle power modules, packages for electric vehicle battery control sensors, ADAS sectors.
- Medical Industry: Medical packages, medical device communication, X-ray related fields.Medical Industry: Medical packages, medical device communication, X-ray related fields.
- Industrial Equipment and X-ray Fields: Industrial equipment and X-ray related components.Industrial Equipment and X-ray Fields: Industrial equipment and X-ray related components.
- Consumer Electronics: Wireless communication components for smartphones, tablets, and IoT devices.Consumer Electronics: Wireless communication components for smartphones, tablets, and IoT devices.
- Major Markets
- South Korea, Israel, ChinaSouth Korea, Israel, China
- FranceFrance
- United StatesUnited States
- Certifications/Patents
- KS Q ISO 9001:2015 Certification (QSC2593)KS Q ISO 9001:2015 Certification (QSC2593)
- IATF 16949 Certification (0356445)IATF 16949 Certification (0356445)
- Venture Company Certification (No. 20180300436, No. 20200300517)Venture Company Certification (No. 20180300436, No. 20200300517)
- Materials and Components Specialist Company Certification (No. 18311)Materials and Components Specialist Company Certification (No. 18311)
- Root Industry Specialist Company Designation (No. 160606-0151)Root Industry Specialist Company Designation (No. 160606-0151)
- Technology Innovation Small and Medium Business (INNO-BIZ) Designation (No. R7061-2924)Technology Innovation Small and Medium Business (INNO-BIZ) Designation (No. R7061-2924)
- Global Hidden Champion Designation (No. 2019-092)Global Hidden Champion Designation (No. 2019-092)
- World Class Product CertificationWorld Class Product Certification
- Korea Special Process Certification (KSPC510 Chemical Treatment)Korea Special Process Certification (KSPC510 Chemical Treatment)
- Excellent Corporate Research Institute DesignationExcellent Corporate Research Institute Designation
- Possession of core compound semiconductor package technologies: including thermal management materials, ceramic materials, high-frequency design, LD module, surface treatment, and dissimilar material bonding technologies.Possession of core compound semiconductor package technologies: including thermal management materials, ceramic materials, high-frequency design, LD module, surface treatment, and dissimilar material bonding technologies.
Introduction
Location
213 Gangchon-ro, Danwon-gu, Ansan-si, Gyeonggi-do, South Korea
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